SG74689A1 - Dispensing nozzle for a die bonder - Google Patents

Dispensing nozzle for a die bonder

Info

Publication number
SG74689A1
SG74689A1 SG1999000022A SG1999000022A SG74689A1 SG 74689 A1 SG74689 A1 SG 74689A1 SG 1999000022 A SG1999000022 A SG 1999000022A SG 1999000022 A SG1999000022 A SG 1999000022A SG 74689 A1 SG74689 A1 SG 74689A1
Authority
SG
Singapore
Prior art keywords
nozzle
adhesive
dispensing nozzle
die bonder
feed channel
Prior art date
Application number
SG1999000022A
Inventor
Luca Baraldi
Original Assignee
Esec Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sa filed Critical Esec Sa
Publication of SG74689A1 publication Critical patent/SG74689A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Coating Apparatus (AREA)

Abstract

The machine has a baffle (21) for throttling the flow of adhesive (5) in the feed channel (7) leading to the nozzle exit, so that when adhesive is added to fill the nozzle, the leading edge (12) of the flowing adhesive is directed in a predetermined flow direction, forcing all of the gas (15) in the feed channel out through the nozzle exit holes (10, 10a). An Independent claim is included for the use of this nozzle in the dispensing part of a die bonding machine.
SG1999000022A 1998-01-12 1999-01-06 Dispensing nozzle for a die bonder SG74689A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP98100386A EP0928634A1 (en) 1998-01-12 1998-01-12 Dispensing nozzle for a die bonder

Publications (1)

Publication Number Publication Date
SG74689A1 true SG74689A1 (en) 2000-08-22

Family

ID=8231255

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1999000022A SG74689A1 (en) 1998-01-12 1999-01-06 Dispensing nozzle for a die bonder

Country Status (6)

Country Link
EP (1) EP0928634A1 (en)
JP (1) JPH11260842A (en)
AT (1) ATE413234T1 (en)
DE (1) DE59914892D1 (en)
MY (1) MY119580A (en)
SG (1) SG74689A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2254033A1 (en) * 1972-11-04 1974-05-16 Paal Hans DEVICE FOR DOT APPLICATION OF AN ADHESIVE
DE3913409A1 (en) * 1989-04-24 1990-10-25 Fischer Artur Werke Gmbh Adhesive components sepd. by axial partition in cartridge - are mixed during expulsion with partition retracting into plunger cavity
US5244149A (en) * 1992-05-05 1993-09-14 Eastman Kodak Company Impinging jet fluid distributor

Also Published As

Publication number Publication date
DE59914892D1 (en) 2008-12-18
JPH11260842A (en) 1999-09-24
ATE413234T1 (en) 2008-11-15
MY119580A (en) 2005-06-30
EP0928634A1 (en) 1999-07-14

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