SG74689A1 - Dispensing nozzle for a die bonder - Google Patents
Dispensing nozzle for a die bonderInfo
- Publication number
- SG74689A1 SG74689A1 SG1999000022A SG1999000022A SG74689A1 SG 74689 A1 SG74689 A1 SG 74689A1 SG 1999000022 A SG1999000022 A SG 1999000022A SG 1999000022 A SG1999000022 A SG 1999000022A SG 74689 A1 SG74689 A1 SG 74689A1
- Authority
- SG
- Singapore
- Prior art keywords
- nozzle
- adhesive
- dispensing nozzle
- die bonder
- feed channel
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Coating Apparatus (AREA)
Abstract
The machine has a baffle (21) for throttling the flow of adhesive (5) in the feed channel (7) leading to the nozzle exit, so that when adhesive is added to fill the nozzle, the leading edge (12) of the flowing adhesive is directed in a predetermined flow direction, forcing all of the gas (15) in the feed channel out through the nozzle exit holes (10, 10a). An Independent claim is included for the use of this nozzle in the dispensing part of a die bonding machine.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98100386A EP0928634A1 (en) | 1998-01-12 | 1998-01-12 | Dispensing nozzle for a die bonder |
Publications (1)
Publication Number | Publication Date |
---|---|
SG74689A1 true SG74689A1 (en) | 2000-08-22 |
Family
ID=8231255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1999000022A SG74689A1 (en) | 1998-01-12 | 1999-01-06 | Dispensing nozzle for a die bonder |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0928634A1 (en) |
JP (1) | JPH11260842A (en) |
AT (1) | ATE413234T1 (en) |
DE (1) | DE59914892D1 (en) |
MY (1) | MY119580A (en) |
SG (1) | SG74689A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2254033A1 (en) * | 1972-11-04 | 1974-05-16 | Paal Hans | DEVICE FOR DOT APPLICATION OF AN ADHESIVE |
DE3913409A1 (en) * | 1989-04-24 | 1990-10-25 | Fischer Artur Werke Gmbh | Adhesive components sepd. by axial partition in cartridge - are mixed during expulsion with partition retracting into plunger cavity |
US5244149A (en) * | 1992-05-05 | 1993-09-14 | Eastman Kodak Company | Impinging jet fluid distributor |
-
1998
- 1998-01-12 EP EP98100386A patent/EP0928634A1/en not_active Withdrawn
- 1998-12-08 MY MYPI98005543A patent/MY119580A/en unknown
-
1999
- 1999-01-06 SG SG1999000022A patent/SG74689A1/en unknown
- 1999-01-06 DE DE59914892T patent/DE59914892D1/en not_active Expired - Fee Related
- 1999-01-06 AT AT99810004T patent/ATE413234T1/en not_active IP Right Cessation
- 1999-01-12 JP JP11005743A patent/JPH11260842A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE59914892D1 (en) | 2008-12-18 |
JPH11260842A (en) | 1999-09-24 |
ATE413234T1 (en) | 2008-11-15 |
MY119580A (en) | 2005-06-30 |
EP0928634A1 (en) | 1999-07-14 |
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