SG63813A1 - Asymmetrical resist sidewall - Google Patents

Asymmetrical resist sidewall

Info

Publication number
SG63813A1
SG63813A1 SG1998000340A SG1998000340A SG63813A1 SG 63813 A1 SG63813 A1 SG 63813A1 SG 1998000340 A SG1998000340 A SG 1998000340A SG 1998000340 A SG1998000340 A SG 1998000340A SG 63813 A1 SG63813 A1 SG 63813A1
Authority
SG
Singapore
Prior art keywords
resist sidewall
asymmetrical
asymmetrical resist
sidewall
resist
Prior art date
Application number
SG1998000340A
Inventor
Rebecca Dora Mih
Donald Coughlin Wheeler
Timothy Allan Brunner
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SG63813A1 publication Critical patent/SG63813A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG1998000340A 1997-03-12 1998-02-16 Asymmetrical resist sidewall SG63813A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/820,399 US5948571A (en) 1997-03-12 1997-03-12 Asymmetrical resist sidewall

Publications (1)

Publication Number Publication Date
SG63813A1 true SG63813A1 (en) 1999-03-30

Family

ID=25230653

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998000340A SG63813A1 (en) 1997-03-12 1998-02-16 Asymmetrical resist sidewall

Country Status (6)

Country Link
US (2) US5948571A (en)
JP (1) JP2980580B2 (en)
KR (1) KR100268746B1 (en)
MY (2) MY121026A (en)
SG (1) SG63813A1 (en)
TW (1) TW535208B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256394A (en) 1997-03-12 1998-09-25 Internatl Business Mach Corp <Ibm> Semiconductor structure and device
JP3297423B2 (en) * 2000-08-09 2002-07-02 株式会社東芝 Focus test mask and method of measuring focus and aberration using the same
US6960510B2 (en) * 2002-07-01 2005-11-01 International Business Machines Corporation Method of making sub-lithographic features
US7149998B2 (en) * 2002-12-30 2006-12-12 Synopsys Inc. Lithography process modeling of asymmetric patterns
JPWO2005004211A1 (en) * 2003-07-03 2006-08-17 株式会社ニコン Focus test mask, focus measurement method, and exposure apparatus
JP4015079B2 (en) * 2003-07-18 2007-11-28 株式会社東芝 Reticle, exposure apparatus inspection system, exposure apparatus inspection method, and reticle manufacturing method
JP4625643B2 (en) * 2004-03-02 2011-02-02 Ｏｋｉセミコンダクタ株式会社 Formation method of linear grating
JP4582574B2 (en) * 2004-06-04 2010-11-17 シャープ株式会社 Phase shift mask and manufacturing method thereof
KR100643684B1 (en) * 2005-11-04 2006-11-10 한국과학기술원 Polymer or resist pattern, and metal film pattern, metal pattern, and plastic mold using thereof, and methods of forming the sames
US7883822B2 (en) * 2007-10-17 2011-02-08 Texas Instruments Incorporated Graded lithographic mask
JP2009175587A (en) * 2008-01-28 2009-08-06 Toshiba Corp Mask for inspection of exposure apparatus, method for manufacturing the mask, and method for inspecting exposure apparatus using the mask for inspection of exposure apparatus
US8001495B2 (en) 2008-04-17 2011-08-16 International Business Machines Corporation System and method of predicting problematic areas for lithography in a circuit design
US20100182580A1 (en) * 2009-01-16 2010-07-22 Micron Technology, Inc. Photolithography systems with local exposure correction and associated methods
EP2498129A4 (en) * 2009-11-05 2018-01-03 Nikon Corporation Focus test mask, focus measuring method, exposure apparatus, and exposure method
JP5665784B2 (en) * 2012-03-16 2015-02-04 株式会社東芝 Photomask and pattern forming method
KR102475201B1 (en) 2017-10-24 2022-12-07 삼성전기주식회사 Coil component and manufacturing method for the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3153230B2 (en) * 1990-09-10 2001-04-03 株式会社日立製作所 Pattern formation method
JPH0534897A (en) * 1991-07-30 1993-02-12 Fujitsu Ltd Optical mask and production thereof
JPH0561180A (en) * 1991-08-30 1993-03-12 Oki Electric Ind Co Ltd Photomask and pattern forming method by using this photomask
US5370975A (en) * 1992-01-31 1994-12-06 Mitsubishi Denki Kabushiki Kaisha Method for forming resist pattern
US5225035A (en) * 1992-06-15 1993-07-06 Micron Technology, Inc. Method of fabricating a phase-shifting photolithographic mask reticle having identical light transmittance in all transparent regions
US5348826A (en) * 1992-08-21 1994-09-20 Intel Corporation Reticle with structurally identical inverted phase-shifted features
US5302477A (en) * 1992-08-21 1994-04-12 Intel Corporation Inverted phase-shifted reticle
US5300379A (en) * 1992-08-21 1994-04-05 Intel Corporation Method of fabrication of inverted phase-shifted reticle
US5538815A (en) * 1992-09-14 1996-07-23 Kabushiki Kaisha Toshiba Method for designing phase-shifting masks with automatization capability
US5308722A (en) * 1992-09-24 1994-05-03 Advanced Micro Devices Voting technique for the manufacture of defect-free printing phase shift lithography
US5300786A (en) * 1992-10-28 1994-04-05 International Business Machines Corporation Optical focus phase shift test pattern, monitoring system and process
JPH06188270A (en) * 1992-12-15 1994-07-08 Mitsubishi Electric Corp Manufacture of field effect transistor and pattern transfer mask
US5672450A (en) * 1994-05-11 1997-09-30 Micron Technology, Inc. Method of phase shift mask fabrication comprising a tapered edge and phase conflict resolution
US5487962A (en) * 1994-05-11 1996-01-30 Rolfson; J. Brett Method of chromeless phase shift mask fabrication suitable for auto-cad layout
US5718829A (en) * 1995-09-01 1998-02-17 Micron Technology, Inc. Phase shift structure and method of fabrication

Also Published As

Publication number Publication date
MY121026A (en) 2005-12-30
JPH10254121A (en) 1998-09-25
KR19980079489A (en) 1998-11-25
MY127590A (en) 2006-12-29
US5948571A (en) 1999-09-07
TW535208B (en) 2003-06-01
US6114096A (en) 2000-09-05
JP2980580B2 (en) 1999-11-22
KR100268746B1 (en) 2000-12-01

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