SG55258A1 - Method for the production of complementary mos transistors - Google Patents

Method for the production of complementary mos transistors

Info

Publication number
SG55258A1
SG55258A1 SG1996011992A SG1996011992A SG55258A1 SG 55258 A1 SG55258 A1 SG 55258A1 SG 1996011992 A SG1996011992 A SG 1996011992A SG 1996011992 A SG1996011992 A SG 1996011992A SG 55258 A1 SG55258 A1 SG 55258A1
Authority
SG
Singapore
Prior art keywords
production
mos transistors
complementary mos
complementary
transistors
Prior art date
Application number
SG1996011992A
Inventor
Martin Kerber
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SG55258A1 publication Critical patent/SG55258A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/743Making of internal connections, substrate contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • H01L21/823892Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
SG1996011992A 1995-07-25 1996-07-23 Method for the production of complementary mos transistors SG55258A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19527157A DE19527157C2 (en) 1995-07-25 1995-07-25 Process for the production of complementary MOS transistors

Publications (1)

Publication Number Publication Date
SG55258A1 true SG55258A1 (en) 1998-12-21

Family

ID=7767746

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996011992A SG55258A1 (en) 1995-07-25 1996-07-23 Method for the production of complementary mos transistors

Country Status (6)

Country Link
EP (1) EP0756321A1 (en)
JP (1) JPH0945795A (en)
KR (1) KR970008575A (en)
DE (1) DE19527157C2 (en)
SG (1) SG55258A1 (en)
TW (1) TW329554B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11289094A (en) * 1998-04-04 1999-10-19 Toshiba Corp Semiconductor device and its manufacture
JP4674940B2 (en) * 2000-08-24 2011-04-20 パナソニック株式会社 Manufacturing method of semiconductor device
JP2011049500A (en) * 2009-08-28 2011-03-10 Sharp Corp Method of manufacturing semiconductor device
CN102593179A (en) * 2012-03-09 2012-07-18 上海宏力半导体制造有限公司 MOS (metal oxide semiconductor) transistor and manufacturing method thereof
CN111223768B (en) * 2018-11-27 2024-04-05 上海先进半导体制造有限公司 Manufacturing method of low-voltage CMOS device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02276274A (en) * 1989-04-18 1990-11-13 Matsushita Electron Corp Manufacture of semiconductor device
JPH043973A (en) * 1990-04-20 1992-01-08 Mitsubishi Electric Corp Manufacture of semiconductor device
US5395773A (en) * 1994-03-31 1995-03-07 Vlsi Technology, Inc. MOSFET with gate-penetrating halo implant
DE4415568C2 (en) * 1994-05-03 1996-03-07 Siemens Ag Manufacturing process for MOSFETs with LDD

Also Published As

Publication number Publication date
DE19527157C2 (en) 1997-06-19
JPH0945795A (en) 1997-02-14
EP0756321A1 (en) 1997-01-29
TW329554B (en) 1998-04-11
KR970008575A (en) 1997-02-24
DE19527157A1 (en) 1997-01-30

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