SG47378A1 - Wire bonder and wire bonding method - Google Patents

Wire bonder and wire bonding method

Info

Publication number
SG47378A1
SG47378A1 SG1996000228A SG1996000228A SG47378A1 SG 47378 A1 SG47378 A1 SG 47378A1 SG 1996000228 A SG1996000228 A SG 1996000228A SG 1996000228 A SG1996000228 A SG 1996000228A SG 47378 A1 SG47378 A1 SG 47378A1
Authority
SG
Singapore
Prior art keywords
wire
bonding method
bonder
wire bonding
wire bonder
Prior art date
Application number
SG1996000228A
Inventor
Kimiji Nishimaki
Takashi Kamiharako
Original Assignee
Kaijo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19923493A external-priority patent/JP3178567B2/en
Priority claimed from JP19923693A external-priority patent/JP3009564B2/en
Priority claimed from JP5199235A external-priority patent/JP2992427B2/en
Application filed by Kaijo Kk filed Critical Kaijo Kk
Publication of SG47378A1 publication Critical patent/SG47378A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
SG1996000228A 1993-07-16 1994-07-15 Wire bonder and wire bonding method SG47378A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19923493A JP3178567B2 (en) 1993-07-16 1993-07-16 Wire bonding apparatus and method
JP19923693A JP3009564B2 (en) 1993-07-16 1993-07-16 Wire bonding apparatus and method
JP5199235A JP2992427B2 (en) 1993-07-16 1993-07-16 Wire bonding apparatus and method

Publications (1)

Publication Number Publication Date
SG47378A1 true SG47378A1 (en) 1998-04-17

Family

ID=27327616

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000228A SG47378A1 (en) 1993-07-16 1994-07-15 Wire bonder and wire bonding method

Country Status (1)

Country Link
SG (1) SG47378A1 (en)

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