SG47087A1 - Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same - Google Patents

Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same

Info

Publication number
SG47087A1
SG47087A1 SG1996005947A SG1996005947A SG47087A1 SG 47087 A1 SG47087 A1 SG 47087A1 SG 1996005947 A SG1996005947 A SG 1996005947A SG 1996005947 A SG1996005947 A SG 1996005947A SG 47087 A1 SG47087 A1 SG 47087A1
Authority
SG
Singapore
Prior art keywords
bumps
leads
same
tab tape
arranging
Prior art date
Application number
SG1996005947A
Inventor
Masahi Konda
Yasuhiro Suzuki
Yasuhide Ohno
Tosiharu Kikuchi
Tomohiro Uno
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2064926A external-priority patent/JPH06105731B2/en
Priority claimed from JP10102690A external-priority patent/JPH06105732B2/en
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of SG47087A1 publication Critical patent/SG47087A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
SG1996005947A 1990-03-14 1991-03-12 Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same SG47087A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2064926A JPH06105731B2 (en) 1990-03-14 1990-03-14 Bump transfer method and apparatus
JP10102690A JPH06105732B2 (en) 1990-04-16 1990-04-16 Bump transfer method

Publications (1)

Publication Number Publication Date
SG47087A1 true SG47087A1 (en) 1998-03-20

Family

ID=26406063

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996005947A SG47087A1 (en) 1990-03-14 1991-03-12 Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same

Country Status (1)

Country Link
SG (1) SG47087A1 (en)

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