SG44440A1 - Epoxy resin composition for semiconductor sealing - Google Patents

Epoxy resin composition for semiconductor sealing

Info

Publication number
SG44440A1
SG44440A1 SG1996000405A SG1996000405A SG44440A1 SG 44440 A1 SG44440 A1 SG 44440A1 SG 1996000405 A SG1996000405 A SG 1996000405A SG 1996000405 A SG1996000405 A SG 1996000405A SG 44440 A1 SG44440 A1 SG 44440A1
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
semiconductor sealing
semiconductor
sealing
Prior art date
Application number
SG1996000405A
Inventor
Ken Ohta
Wataru Kosaka
Kenichi Yanagisawa
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG44440A1 publication Critical patent/SG44440A1/en

Links

SG1996000405A 1989-11-22 1990-10-18 Epoxy resin composition for semiconductor sealing SG44440A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30197389 1989-11-22
JP30197489 1989-11-22

Publications (1)

Publication Number Publication Date
SG44440A1 true SG44440A1 (en) 1997-12-19

Family

ID=26562945

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000405A SG44440A1 (en) 1989-11-22 1990-10-18 Epoxy resin composition for semiconductor sealing

Country Status (1)

Country Link
SG (1) SG44440A1 (en)

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