SG43366A1 - Method and compositions for diffusion patterning tape on substrate - Google Patents
Method and compositions for diffusion patterning tape on substrateInfo
- Publication number
- SG43366A1 SG43366A1 SG1996009766A SG1996009766A SG43366A1 SG 43366 A1 SG43366 A1 SG 43366A1 SG 1996009766 A SG1996009766 A SG 1996009766A SG 1996009766 A SG1996009766 A SG 1996009766A SG 43366 A1 SG43366 A1 SG 43366A1
- Authority
- SG
- Singapore
- Prior art keywords
- compositions
- substrate
- diffusion patterning
- tape
- patterning tape
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 238000000059 patterning Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F5/00—Screening processes; Screens therefor
- G03F5/14—Screening processes; Screens therefor by contact methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43507695A | 1995-05-08 | 1995-05-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG43366A1 true SG43366A1 (en) | 1997-10-17 |
Family
ID=23726870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996009766A SG43366A1 (en) | 1995-05-08 | 1996-05-08 | Method and compositions for diffusion patterning tape on substrate |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0742585A1 (en) |
JP (1) | JP3490841B2 (en) |
KR (1) | KR960042211A (en) |
CN (1) | CN1137641A (en) |
SG (1) | SG43366A1 (en) |
TW (1) | TW349059B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0970499A1 (en) | 1997-03-25 | 2000-01-12 | E.I. Du Pont De Nemours And Company | Field emitter cathode backplate structures for display panels |
US7754807B2 (en) | 1999-04-20 | 2010-07-13 | Stratasys, Inc. | Soluble material and process for three-dimensional modeling |
EP1194274B1 (en) * | 1999-04-20 | 2017-03-22 | Stratasys, Inc. | Process for three-dimensional modeling |
CN103153904B (en) * | 2010-09-30 | 2015-08-05 | 积水化学工业株式会社 | Intermediate film for laminated glasses and laminated glass |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5032216A (en) * | 1989-10-20 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Non-photographic method for patterning organic polymer films |
US5209814A (en) * | 1991-09-30 | 1993-05-11 | E. I. Du Pont De Nemours And Company | Method for diffusion patterning |
US5260163A (en) * | 1992-05-07 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Photoenhanced diffusion patterning for organic polymer films |
US5411628A (en) * | 1993-10-21 | 1995-05-02 | E. I. Du Pont De Nemours And Company | Diffusion patterning process and screen therefor |
-
1996
- 1996-05-06 EP EP96107099A patent/EP0742585A1/en not_active Withdrawn
- 1996-05-07 TW TW085105430A patent/TW349059B/en not_active IP Right Cessation
- 1996-05-08 JP JP13947096A patent/JP3490841B2/en not_active Expired - Fee Related
- 1996-05-08 KR KR1019960014974A patent/KR960042211A/en not_active Application Discontinuation
- 1996-05-08 CN CN96110006A patent/CN1137641A/en active Pending
- 1996-05-08 SG SG1996009766A patent/SG43366A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR960042211A (en) | 1996-12-21 |
EP0742585A1 (en) | 1996-11-13 |
CN1137641A (en) | 1996-12-11 |
JPH08302044A (en) | 1996-11-19 |
JP3490841B2 (en) | 2004-01-26 |
TW349059B (en) | 1999-01-01 |
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