SG164332A1 - A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate - Google Patents

A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate

Info

Publication number
SG164332A1
SG164332A1 SG201000903-3A SG2010009033A SG164332A1 SG 164332 A1 SG164332 A1 SG 164332A1 SG 2010009033 A SG2010009033 A SG 2010009033A SG 164332 A1 SG164332 A1 SG 164332A1
Authority
SG
Singapore
Prior art keywords
support assembly
substrate holder
substrate
well
semiconductor materials
Prior art date
Application number
SG201000903-3A
Other languages
English (en)
Inventor
Iv Juan Manuel Campaneria
Todd Steven Nitsche
Steven Scott Wolthuis
Original Assignee
Xycarb Ceramics Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xycarb Ceramics Bv filed Critical Xycarb Ceramics Bv
Publication of SG164332A1 publication Critical patent/SG164332A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
SG201000903-3A 2009-02-10 2010-02-09 A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate SG164332A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15145609P 2009-02-10 2009-02-10

Publications (1)

Publication Number Publication Date
SG164332A1 true SG164332A1 (en) 2010-09-29

Family

ID=41720583

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201000903-3A SG164332A1 (en) 2009-02-10 2010-02-09 A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate

Country Status (5)

Country Link
US (1) US20100212595A1 (nl)
EP (1) EP2216810A3 (nl)
NL (1) NL1037228C2 (nl)
SG (1) SG164332A1 (nl)
TW (1) TW201112350A (nl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8943661B2 (en) 2010-11-23 2015-02-03 Rockler Companies, Inc. Non-slip spacer support system
US9816184B2 (en) * 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
US10811299B2 (en) 2018-05-04 2020-10-20 Lam Research Corporation Wafer chuck assembly
USD983647S1 (en) 2020-07-01 2023-04-18 Rockler Companies, Inc. Workpiece support

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7070661B2 (en) * 2003-08-22 2006-07-04 Axcelis Technologies, Inc. Uniform gas cushion wafer support
US7169234B2 (en) * 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
CN101007298B (zh) * 2006-01-24 2011-06-29 深圳富泰宏精密工业有限公司 支架稳固装置
KR100754244B1 (ko) * 2006-05-22 2007-09-03 삼성전자주식회사 스핀 코팅 유닛용 스핀 척 감지장치

Also Published As

Publication number Publication date
EP2216810A3 (en) 2012-03-28
TW201112350A (en) 2011-04-01
NL1037228A (nl) 2010-08-11
NL1037228C2 (nl) 2011-05-25
US20100212595A1 (en) 2010-08-26
EP2216810A2 (en) 2010-08-11

Similar Documents

Publication Publication Date Title
MX363145B (es) Modulo de bomba, modulo base de bomba y sistema de bomba.
GB2452827A9 (en) Support stand for notebook
GB201114436D0 (en) Fixing means
GB2454291B (en) In-vehicle holder support device
GB0602114D0 (en) Support for wafer singulation
PL2182177T3 (pl) Konstrukcja nośna łożyska dla turbiny
WO2012072783A3 (de) MEIßELHALTER UND WERKZEUGUNTERTEIL FÜR EINEN MEIßELHALTER
TWI371076B (en) A wafer container with at least one supporting module having a long slot
EP2630278A4 (en) METHOD OF CATERING SILICON CARBIDE CRYSTALS AND DEVICE THEREFOR
EP1994559A4 (en) HIGH EFFICIENCY DEPOSITION APPARATUS WITH MAGNETIC SUPPORT
CA124982S (en) Device for supporting a workpiece
SG164332A1 (en) A support assembly for substrate holder, as well as a device provided with such a support assembly for layered deposition of various semiconductor materials on a semiconductor substrate
PL2299948T3 (pl) Urządzenie wspierające, zwłaszcza lędźwiowy odcinek kręgosłupa
GB201213558D0 (en) Reconfigurable antenna
SI1816251T1 (sl) Vpenjalna naprava za pritrditev na nosilno konstrukcijo posebno na ohišje gospodinjskega aparata
EP2338167A4 (en) CARRIER FOR A SEMICONDUCTOR WAFER IN A HIGH-TEMPERATURE ENVIRONMENT
GB0823293D0 (en) The adjustable support sling
GB2452095B (en) Flat display supporting apparatus
Chang et al. Errata: Spectrum reconstruction for filter-array spectrum sensor from sparse template selection
GB2460151B (en) Carrier board supporting device
GB2477047A (en) Plant holder
TW200724464A (en) Cartridge for holding brittle laminae
TWM402891U (en) Evaporation deposition wafer holder with monitor wafers
UA77724U (ru) Подставка для ножей
TWM354628U (en) Supporting structure for table top