SG161133A1 - System and method for engaging singulated substrates - Google Patents
System and method for engaging singulated substratesInfo
- Publication number
- SG161133A1 SG161133A1 SG200808274-5A SG2008082745A SG161133A1 SG 161133 A1 SG161133 A1 SG 161133A1 SG 2008082745 A SG2008082745 A SG 2008082745A SG 161133 A1 SG161133 A1 SG 161133A1
- Authority
- SG
- Singapore
- Prior art keywords
- unit
- engagement
- engaging
- pickers
- assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
A unit picker assembly for engaging singulated IC units, the assembly comprising; a plurality of unit pickers, each unit picker having an engagement end for engagement of an IC unit; each of said unit pickers movably mounted to permit movement from a retracted position to a unit engagement position; an actuator assembly arranged to move to a plurality of actuating positions, each of said positions corresponding to one of said unit pickers from the retracted position to the unit engagement position; wherein whilst in any of said actuating positions the actuator assembly is arranged to move the corresponding unit picker from the retracted position to the engagement position. Figure IA
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200808274-5A SG161133A1 (en) | 2008-11-04 | 2008-11-04 | System and method for engaging singulated substrates |
TW098137503A TW201027658A (en) | 2008-11-04 | 2009-11-04 | System and method for engaging singulated subtrates |
PCT/SG2009/000406 WO2010053451A2 (en) | 2008-11-04 | 2009-11-04 | System and method for engaging singulated subtrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200808274-5A SG161133A1 (en) | 2008-11-04 | 2008-11-04 | System and method for engaging singulated substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG161133A1 true SG161133A1 (en) | 2010-05-27 |
Family
ID=42153440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200808274-5A SG161133A1 (en) | 2008-11-04 | 2008-11-04 | System and method for engaging singulated substrates |
Country Status (3)
Country | Link |
---|---|
SG (1) | SG161133A1 (en) |
TW (1) | TW201027658A (en) |
WO (1) | WO2010053451A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201404526A (en) * | 2012-07-17 | 2014-02-01 | Horng Terng Automation Co Ltd | Equidistant openness adjustment mechanism |
CN104003187A (en) * | 2014-06-03 | 2014-08-27 | 苏州博众精工科技有限公司 | Grabbing rotation mechanism |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100792485B1 (en) * | 2006-07-01 | 2008-01-10 | (주)테크윙 | Pick-and-place apparatus |
SG142198A1 (en) * | 2006-11-03 | 2008-05-28 | Rokko Systems Pte Ltd | A unit lifter assembly |
KR100908496B1 (en) * | 2007-04-02 | 2009-08-04 | 이건소 | Vacuum adsorption picker apparatus of handler |
KR100822995B1 (en) * | 2007-06-27 | 2008-04-16 | 윤점채 | Pick and place unit in singulation handler |
-
2008
- 2008-11-04 SG SG200808274-5A patent/SG161133A1/en unknown
-
2009
- 2009-11-04 WO PCT/SG2009/000406 patent/WO2010053451A2/en active Application Filing
- 2009-11-04 TW TW098137503A patent/TW201027658A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201027658A (en) | 2010-07-16 |
WO2010053451A3 (en) | 2013-02-28 |
WO2010053451A2 (en) | 2010-05-14 |
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