SG158048A1 - Copper on organic solderability preservative (osp) interconnect and enhanced wire bonding process - Google Patents

Copper on organic solderability preservative (osp) interconnect and enhanced wire bonding process

Info

Publication number
SG158048A1
SG158048A1 SG200904295-3A SG2009042953A SG158048A1 SG 158048 A1 SG158048 A1 SG 158048A1 SG 2009042953 A SG2009042953 A SG 2009042953A SG 158048 A1 SG158048 A1 SG 158048A1
Authority
SG
Singapore
Prior art keywords
contact region
copper
osp
wire bonding
interconnect
Prior art date
Application number
SG200904295-3A
Inventor
Yong Chuan Koh
Jimmy Siat
Jeffrey Nantes Salamat
Lope Jr Vallespin Pepito
Ronaldo Cayetano Calderon
Rodel Manalac
Pang Hup Ong
Kian Teng Eng
Original Assignee
United Test & Assembly Ct Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Test & Assembly Ct Ltd filed Critical United Test & Assembly Ct Ltd
Publication of SG158048A1 publication Critical patent/SG158048A1/en

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/2076—Diameter ranges equal to or larger than 100 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND ENHANCED WIRE BONDING PROCESS A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate and a second contact region is disposed on the die. The first contact region, for example, comprises copper coated with an OSP material. A copper wire bond electrically couples the first and second contact regions. Wire bonding includes forming a ball bump on the first contact region having a flat top surface. Providing the flat top surface is achieved with a smoothing process. A ball bond is formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.
SG200904295-3A 2008-06-20 2009-06-22 Copper on organic solderability preservative (osp) interconnect and enhanced wire bonding process SG158048A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7415408P 2008-06-20 2008-06-20

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SG158048A1 true SG158048A1 (en) 2010-01-29

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SG200904295-3A SG158048A1 (en) 2008-06-20 2009-06-22 Copper on organic solderability preservative (osp) interconnect and enhanced wire bonding process

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SG (2) SG177212A1 (en)
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10121742B2 (en) * 2017-03-15 2018-11-06 Amkor Technology, Inc. Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6358847B1 (en) * 1999-03-31 2002-03-19 Lam Research Corporation Method for enabling conventional wire bonding to copper-based bond pad features
US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
US20070251980A1 (en) * 2006-04-26 2007-11-01 Gillotti Gary S Reduced oxidation system for wire bonding

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DE102009029844A1 (en) 2010-02-18
TW201007911A (en) 2010-02-16
TWI508248B (en) 2015-11-11
SG177212A1 (en) 2012-01-30

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