SG147348A1 - Method and apparatus for solder ball mounting - Google Patents

Method and apparatus for solder ball mounting

Info

Publication number
SG147348A1
SG147348A1 SG200703231-1A SG2007032311A SG147348A1 SG 147348 A1 SG147348 A1 SG 147348A1 SG 2007032311 A SG2007032311 A SG 2007032311A SG 147348 A1 SG147348 A1 SG 147348A1
Authority
SG
Singapore
Prior art keywords
template
ball mounting
solder ball
solder balls
reservoir housing
Prior art date
Application number
SG200703231-1A
Inventor
Nee Seng Ling
Soo Loo Ang
Ter Siang Pai
Original Assignee
Rokko Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Ventures Pte Ltd filed Critical Rokko Ventures Pte Ltd
Priority to SG200703231-1A priority Critical patent/SG147348A1/en
Priority to SG2013075411A priority patent/SG194412A1/en
Priority to US12/515,900 priority patent/US8061583B2/en
Priority to CN2007800502701A priority patent/CN101743480B/en
Priority to TW096144378A priority patent/TWI458410B/en
Priority to SG201002515-3A priority patent/SG161263A1/en
Priority to PCT/SG2007/000402 priority patent/WO2008063138A2/en
Priority to KR1020097012953A priority patent/KR20090096706A/en
Priority to CN2012101563796A priority patent/CN102744487A/en
Priority to JP2009538374A priority patent/JP5341768B2/en
Publication of SG147348A1 publication Critical patent/SG147348A1/en
Priority to US13/274,116 priority patent/US20120031954A1/en
Priority to JP2013164825A priority patent/JP2013251571A/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

METHOD AND APPARATUS FOR SOLDER BALL MOUNTING A template assembly comprising; a template for receiving solder balls; a reservoir housing for containing a plurality of solder balls, said reservoir housing arranged to move over said template and distribute the solder balls within said template and; a fluid interface device for providing a fluid interface between the template and reservoir housing.
SG200703231-1A 2006-11-22 2007-05-07 Method and apparatus for solder ball mounting SG147348A1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SG200703231-1A SG147348A1 (en) 2007-05-07 2007-05-07 Method and apparatus for solder ball mounting
SG201002515-3A SG161263A1 (en) 2006-11-22 2007-11-22 An improved ball mounting apparatus and method
US12/515,900 US8061583B2 (en) 2006-11-22 2007-11-22 Ball mounting apparatus and method
CN2007800502701A CN101743480B (en) 2006-11-22 2007-11-22 An improved ball mounting apparatus and method
TW096144378A TWI458410B (en) 2006-11-22 2007-11-22 An improved ball mounting apparatus and method
SG2013075411A SG194412A1 (en) 2006-11-22 2007-11-22 An improved ball mounting apparatus and method
PCT/SG2007/000402 WO2008063138A2 (en) 2006-11-22 2007-11-22 An improved ball mounting apparatus and method
KR1020097012953A KR20090096706A (en) 2006-11-22 2007-11-22 An improved ball mounting apparatus and method
CN2012101563796A CN102744487A (en) 2006-11-22 2007-11-22 An improved ball mounting apparatus and method
JP2009538374A JP5341768B2 (en) 2006-11-22 2007-11-22 Improved ball mounting apparatus and method
US13/274,116 US20120031954A1 (en) 2006-11-22 2011-10-14 Ball Mounting Apparatus and Method
JP2013164825A JP2013251571A (en) 2006-11-22 2013-08-08 Improved ball mounting apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200703231-1A SG147348A1 (en) 2007-05-07 2007-05-07 Method and apparatus for solder ball mounting

Publications (1)

Publication Number Publication Date
SG147348A1 true SG147348A1 (en) 2008-11-28

Family

ID=40032356

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200703231-1A SG147348A1 (en) 2006-11-22 2007-05-07 Method and apparatus for solder ball mounting

Country Status (1)

Country Link
SG (1) SG147348A1 (en)

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