SG144746A1 - Super high density module with integrated wafer level packages - Google Patents

Super high density module with integrated wafer level packages

Info

Publication number
SG144746A1
SG144746A1 SG200608082-4A SG2006080824A SG144746A1 SG 144746 A1 SG144746 A1 SG 144746A1 SG 2006080824 A SG2006080824 A SG 2006080824A SG 144746 A1 SG144746 A1 SG 144746A1
Authority
SG
Singapore
Prior art keywords
wafer level
packages
high density
dies
super high
Prior art date
Application number
SG200608082-4A
Inventor
Yong Poo Chia
Suan Jeung Boon
Siu Waf Low
Yong Loo Neo
Bok Leng Ser
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200608082-4A priority Critical patent/SG144746A1/en
Publication of SG144746A1 publication Critical patent/SG144746A1/en

Links

Landscapes

  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

SUPER HIGH DENSITY MODULE WITH INTEGRATED WAFER LEVEL PACKAGES A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of a memory package such as single in line memory modules (SIMMs) or dual in line memory modules.
SG200608082-4A 2002-05-21 2002-05-21 Super high density module with integrated wafer level packages SG144746A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200608082-4A SG144746A1 (en) 2002-05-21 2002-05-21 Super high density module with integrated wafer level packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200608082-4A SG144746A1 (en) 2002-05-21 2002-05-21 Super high density module with integrated wafer level packages

Publications (1)

Publication Number Publication Date
SG144746A1 true SG144746A1 (en) 2008-08-28

Family

ID=39710855

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200608082-4A SG144746A1 (en) 2002-05-21 2002-05-21 Super high density module with integrated wafer level packages

Country Status (1)

Country Link
SG (1) SG144746A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US6144102A (en) * 1997-05-16 2000-11-07 Texas Instruments Incorporated Semiconductor device package
US20020038890A1 (en) * 2000-10-04 2002-04-04 Shinji Ohuchi Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US6144102A (en) * 1997-05-16 2000-11-07 Texas Instruments Incorporated Semiconductor device package
US20020038890A1 (en) * 2000-10-04 2002-04-04 Shinji Ohuchi Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby

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