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Application filed by Ever Technologies Pte LtdfiledCriticalEver Technologies Pte Ltd
Priority to SG200401545-9ApriorityCriticalpatent/SG144708A1/en
Publication of SG144708A1publicationCriticalpatent/SG144708A1/en
Shaping Of Tube Ends By Bending Or Straightening
(AREA)
Abstract
Apparatus And Method For Fabricating Folded IC packages An apparatus (1) for fabrication of folded IC packages, the apparatus comprising a holder (4) for receiving and fastening one or more planar IC packages, a folding element (46) for folding one portion of each planar IC package on top of another portion of said each the IC package, and a heater (42) for applying heat to the folded IC package to cure an adhesive element of the integrated package for fastening said folded portion of the IC package on top of the other portion of the IC package.
SG200401545-9A2004-02-272004-02-27Apparatus and method for fabricating folded ic packages
SG144708A1
(en)
Method for manufacturing sheet provided with ic tag, apparatus for manufacturing sheet provided with ic tag, sheet provided with ic tag, method for fixing ic chip, apparatus for fixing ic chip, and ic tag
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part