SG125909A1 - Method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding - Google Patents

Method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding

Info

Publication number
SG125909A1
SG125909A1 SG200300046A SG200300046A SG125909A1 SG 125909 A1 SG125909 A1 SG 125909A1 SG 200300046 A SG200300046 A SG 200300046A SG 200300046 A SG200300046 A SG 200300046A SG 125909 A1 SG125909 A1 SG 125909A1
Authority
SG
Singapore
Prior art keywords
conducting polymer
copper
polymer plug
bonding
metal bump
Prior art date
Application number
SG200300046A
Inventor
Yakub Aliyu
Simon Chooi
Mei Sheng Zhou
John Sudijono
Subhash Gupta
Sudipto Ranendra Roy
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/076,244 external-priority patent/US6821888B2/en
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG125909A1 publication Critical patent/SG125909A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Wire Bonding (AREA)

Abstract

A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.
SG200300046A 2002-02-13 2003-01-09 Method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding SG125909A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/076,244 US6821888B2 (en) 2000-07-07 2002-02-13 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Publications (1)

Publication Number Publication Date
SG125909A1 true SG125909A1 (en) 2006-10-30

Family

ID=38116979

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200501094A SG125148A1 (en) 2002-02-13 2003-01-09 A method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding
SG200300046A SG125909A1 (en) 2002-02-13 2003-01-09 Method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200501094A SG125148A1 (en) 2002-02-13 2003-01-09 A method of copper/copper surface bonding using a conducting polymer for application in ic chip bonding

Country Status (1)

Country Link
SG (2) SG125148A1 (en)

Also Published As

Publication number Publication date
SG125148A1 (en) 2006-09-29

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