SG121918A1 - A method and system of treating a surface of a fabricated microcomponent - Google Patents

A method and system of treating a surface of a fabricated microcomponent

Info

Publication number
SG121918A1
SG121918A1 SG200406515A SG200406515A SG121918A1 SG 121918 A1 SG121918 A1 SG 121918A1 SG 200406515 A SG200406515 A SG 200406515A SG 200406515 A SG200406515 A SG 200406515A SG 121918 A1 SG121918 A1 SG 121918A1
Authority
SG
Singapore
Prior art keywords
microcomponent
fabricated
treating
fabricated microcomponent
Prior art date
Application number
SG200406515A
Inventor
Cheow-Tong Cheng
Ching-Biing Yeo
Takada Akio
Okada Kanzo
Kaidong Ye
Yeow Whatt Goh
Minghui Hong
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to SG200406515A priority Critical patent/SG121918A1/en
Publication of SG121918A1 publication Critical patent/SG121918A1/en

Links

SG200406515A 2004-10-27 2004-10-27 A method and system of treating a surface of a fabricated microcomponent SG121918A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200406515A SG121918A1 (en) 2004-10-27 2004-10-27 A method and system of treating a surface of a fabricated microcomponent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200406515A SG121918A1 (en) 2004-10-27 2004-10-27 A method and system of treating a surface of a fabricated microcomponent

Publications (1)

Publication Number Publication Date
SG121918A1 true SG121918A1 (en) 2006-05-26

Family

ID=37945385

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200406515A SG121918A1 (en) 2004-10-27 2004-10-27 A method and system of treating a surface of a fabricated microcomponent

Country Status (1)

Country Link
SG (1) SG121918A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390392A (en) * 1980-09-16 1983-06-28 Texas Instruments Incorporated Method for removal of minute physical damage to silicon wafers by employing laser annealing
EP0208463A1 (en) * 1985-06-24 1987-01-14 GOVERNMENT OF THE UNITED STATES OF AMERICA as represented by the US department of energy Planarization of metal films for multilevel interconnects
US4731516A (en) * 1985-10-11 1988-03-15 Mitsubishi Denki Kabushiki Kaisha Laser polishing semiconductor wafer
US6444550B1 (en) * 1999-08-18 2002-09-03 Advanced Micro Devices, Inc. Laser tailoring retrograde channel profile in surfaces
US20040055999A1 (en) * 2002-09-19 2004-03-25 Yu-Cheng Chen Method for planarizing polysilicon

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390392A (en) * 1980-09-16 1983-06-28 Texas Instruments Incorporated Method for removal of minute physical damage to silicon wafers by employing laser annealing
EP0208463A1 (en) * 1985-06-24 1987-01-14 GOVERNMENT OF THE UNITED STATES OF AMERICA as represented by the US department of energy Planarization of metal films for multilevel interconnects
US4731516A (en) * 1985-10-11 1988-03-15 Mitsubishi Denki Kabushiki Kaisha Laser polishing semiconductor wafer
US6444550B1 (en) * 1999-08-18 2002-09-03 Advanced Micro Devices, Inc. Laser tailoring retrograde channel profile in surfaces
US20040055999A1 (en) * 2002-09-19 2004-03-25 Yu-Cheng Chen Method for planarizing polysilicon

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