SG121918A1 - A method and system of treating a surface of a fabricated microcomponent - Google Patents
A method and system of treating a surface of a fabricated microcomponentInfo
- Publication number
- SG121918A1 SG121918A1 SG200406515A SG200406515A SG121918A1 SG 121918 A1 SG121918 A1 SG 121918A1 SG 200406515 A SG200406515 A SG 200406515A SG 200406515 A SG200406515 A SG 200406515A SG 121918 A1 SG121918 A1 SG 121918A1
- Authority
- SG
- Singapore
- Prior art keywords
- microcomponent
- fabricated
- treating
- fabricated microcomponent
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200406515A SG121918A1 (en) | 2004-10-27 | 2004-10-27 | A method and system of treating a surface of a fabricated microcomponent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200406515A SG121918A1 (en) | 2004-10-27 | 2004-10-27 | A method and system of treating a surface of a fabricated microcomponent |
Publications (1)
Publication Number | Publication Date |
---|---|
SG121918A1 true SG121918A1 (en) | 2006-05-26 |
Family
ID=37945385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200406515A SG121918A1 (en) | 2004-10-27 | 2004-10-27 | A method and system of treating a surface of a fabricated microcomponent |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG121918A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4390392A (en) * | 1980-09-16 | 1983-06-28 | Texas Instruments Incorporated | Method for removal of minute physical damage to silicon wafers by employing laser annealing |
EP0208463A1 (en) * | 1985-06-24 | 1987-01-14 | GOVERNMENT OF THE UNITED STATES OF AMERICA as represented by the US department of energy | Planarization of metal films for multilevel interconnects |
US4731516A (en) * | 1985-10-11 | 1988-03-15 | Mitsubishi Denki Kabushiki Kaisha | Laser polishing semiconductor wafer |
US6444550B1 (en) * | 1999-08-18 | 2002-09-03 | Advanced Micro Devices, Inc. | Laser tailoring retrograde channel profile in surfaces |
US20040055999A1 (en) * | 2002-09-19 | 2004-03-25 | Yu-Cheng Chen | Method for planarizing polysilicon |
-
2004
- 2004-10-27 SG SG200406515A patent/SG121918A1/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4390392A (en) * | 1980-09-16 | 1983-06-28 | Texas Instruments Incorporated | Method for removal of minute physical damage to silicon wafers by employing laser annealing |
EP0208463A1 (en) * | 1985-06-24 | 1987-01-14 | GOVERNMENT OF THE UNITED STATES OF AMERICA as represented by the US department of energy | Planarization of metal films for multilevel interconnects |
US4731516A (en) * | 1985-10-11 | 1988-03-15 | Mitsubishi Denki Kabushiki Kaisha | Laser polishing semiconductor wafer |
US6444550B1 (en) * | 1999-08-18 | 2002-09-03 | Advanced Micro Devices, Inc. | Laser tailoring retrograde channel profile in surfaces |
US20040055999A1 (en) * | 2002-09-19 | 2004-03-25 | Yu-Cheng Chen | Method for planarizing polysilicon |
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