SG120104A1 - Spray cooling method and apparatus - Google Patents

Spray cooling method and apparatus

Info

Publication number
SG120104A1
SG120104A1 SG200303871A SG200303871A SG120104A1 SG 120104 A1 SG120104 A1 SG 120104A1 SG 200303871 A SG200303871 A SG 200303871A SG 200303871 A SG200303871 A SG 200303871A SG 120104 A1 SG120104 A1 SG 120104A1
Authority
SG
Singapore
Prior art keywords
cooling method
spray cooling
spray
cooling
Prior art date
Application number
SG200303871A
Inventor
Tong Teng Christopher Neo
Original Assignee
Singapore Tech Aerospace Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Tech Aerospace Ltd filed Critical Singapore Tech Aerospace Ltd
Priority to SG200303871A priority Critical patent/SG120104A1/en
Publication of SG120104A1 publication Critical patent/SG120104A1/en

Links

SG200303871A 2003-06-30 2003-06-30 Spray cooling method and apparatus SG120104A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200303871A SG120104A1 (en) 2003-06-30 2003-06-30 Spray cooling method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200303871A SG120104A1 (en) 2003-06-30 2003-06-30 Spray cooling method and apparatus

Publications (1)

Publication Number Publication Date
SG120104A1 true SG120104A1 (en) 2006-03-28

Family

ID=36586203

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200303871A SG120104A1 (en) 2003-06-30 2003-06-30 Spray cooling method and apparatus

Country Status (1)

Country Link
SG (1) SG120104A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0837260A (en) * 1994-07-22 1996-02-06 Hitachi Ltd Semiconductor cooler
EP0817263A2 (en) * 1990-10-11 1998-01-07 Nec Corporation Liquid cooling system for LSI packages
JPH1013069A (en) * 1996-06-26 1998-01-16 Fujitsu Ltd Cooling structure
WO2001001741A1 (en) * 1999-06-29 2001-01-04 General Dynamics Information Systems, Inc. Enclosure for spray cooling electronic modules
WO2001020962A1 (en) * 1999-09-13 2001-03-22 Hewlett-Packard Company Spray cooling system
JP2001111278A (en) * 1999-10-13 2001-04-20 Nec Corp Structure of nozzle plate for cooling
US20020112497A1 (en) * 2001-02-22 2002-08-22 Patel Chandrakant D. Spray cooling with local control of nozzles
US20020112491A1 (en) * 2001-02-22 2002-08-22 Malone Christopher G. Spray cooling system with cooling regime detection
US20020112496A1 (en) * 2001-02-22 2002-08-22 Bash Cullen E. Variably configured sprayjet cooling system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0817263A2 (en) * 1990-10-11 1998-01-07 Nec Corporation Liquid cooling system for LSI packages
JPH0837260A (en) * 1994-07-22 1996-02-06 Hitachi Ltd Semiconductor cooler
JPH1013069A (en) * 1996-06-26 1998-01-16 Fujitsu Ltd Cooling structure
WO2001001741A1 (en) * 1999-06-29 2001-01-04 General Dynamics Information Systems, Inc. Enclosure for spray cooling electronic modules
WO2001020962A1 (en) * 1999-09-13 2001-03-22 Hewlett-Packard Company Spray cooling system
JP2001111278A (en) * 1999-10-13 2001-04-20 Nec Corp Structure of nozzle plate for cooling
US20020112497A1 (en) * 2001-02-22 2002-08-22 Patel Chandrakant D. Spray cooling with local control of nozzles
US20020112491A1 (en) * 2001-02-22 2002-08-22 Malone Christopher G. Spray cooling system with cooling regime detection
US20020112496A1 (en) * 2001-02-22 2002-08-22 Bash Cullen E. Variably configured sprayjet cooling system

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