SG118151A1 - Method for singulation of semiconductor package - Google Patents

Method for singulation of semiconductor package

Info

Publication number
SG118151A1
SG118151A1 SG200204999A SG200204999A SG118151A1 SG 118151 A1 SG118151 A1 SG 118151A1 SG 200204999 A SG200204999 A SG 200204999A SG 200204999 A SG200204999 A SG 200204999A SG 118151 A1 SG118151 A1 SG 118151A1
Authority
SG
Singapore
Prior art keywords
singulation
semiconductor package
package
semiconductor
Prior art date
Application number
SG200204999A
Inventor
Park Myung-Soon
Original Assignee
Korea Semiconductor System Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Semiconductor System Co filed Critical Korea Semiconductor System Co
Priority to SG200204999A priority Critical patent/SG118151A1/en
Publication of SG118151A1 publication Critical patent/SG118151A1/en

Links

SG200204999A 2002-08-19 2002-08-19 Method for singulation of semiconductor package SG118151A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200204999A SG118151A1 (en) 2002-08-19 2002-08-19 Method for singulation of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200204999A SG118151A1 (en) 2002-08-19 2002-08-19 Method for singulation of semiconductor package

Publications (1)

Publication Number Publication Date
SG118151A1 true SG118151A1 (en) 2006-01-27

Family

ID=36102698

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200204999A SG118151A1 (en) 2002-08-19 2002-08-19 Method for singulation of semiconductor package

Country Status (1)

Country Link
SG (1) SG118151A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336988A (en) * 1986-07-29 1988-02-17 Rohm Co Ltd Dividing method for semiconductor wafer
JPS63293939A (en) * 1987-05-27 1988-11-30 Hitachi Ltd Manufacture of semiconductor integrated circuit device
JP2003318137A (en) * 2002-04-24 2003-11-07 Korea Semiconductor System Co Ltd Method for splitting semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336988A (en) * 1986-07-29 1988-02-17 Rohm Co Ltd Dividing method for semiconductor wafer
JPS63293939A (en) * 1987-05-27 1988-11-30 Hitachi Ltd Manufacture of semiconductor integrated circuit device
JP2003318137A (en) * 2002-04-24 2003-11-07 Korea Semiconductor System Co Ltd Method for splitting semiconductor package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RESEARCH DISCLOSURE VOL. 443, NO. 098 *

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