SG118151A1 - Method for singulation of semiconductor package - Google Patents
Method for singulation of semiconductor packageInfo
- Publication number
- SG118151A1 SG118151A1 SG200204999A SG200204999A SG118151A1 SG 118151 A1 SG118151 A1 SG 118151A1 SG 200204999 A SG200204999 A SG 200204999A SG 200204999 A SG200204999 A SG 200204999A SG 118151 A1 SG118151 A1 SG 118151A1
- Authority
- SG
- Singapore
- Prior art keywords
- singulation
- semiconductor package
- package
- semiconductor
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200204999A SG118151A1 (en) | 2002-08-19 | 2002-08-19 | Method for singulation of semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200204999A SG118151A1 (en) | 2002-08-19 | 2002-08-19 | Method for singulation of semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG118151A1 true SG118151A1 (en) | 2006-01-27 |
Family
ID=36102698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200204999A SG118151A1 (en) | 2002-08-19 | 2002-08-19 | Method for singulation of semiconductor package |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG118151A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6336988A (en) * | 1986-07-29 | 1988-02-17 | Rohm Co Ltd | Dividing method for semiconductor wafer |
JPS63293939A (en) * | 1987-05-27 | 1988-11-30 | Hitachi Ltd | Manufacture of semiconductor integrated circuit device |
JP2003318137A (en) * | 2002-04-24 | 2003-11-07 | Korea Semiconductor System Co Ltd | Method for splitting semiconductor package |
-
2002
- 2002-08-19 SG SG200204999A patent/SG118151A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6336988A (en) * | 1986-07-29 | 1988-02-17 | Rohm Co Ltd | Dividing method for semiconductor wafer |
JPS63293939A (en) * | 1987-05-27 | 1988-11-30 | Hitachi Ltd | Manufacture of semiconductor integrated circuit device |
JP2003318137A (en) * | 2002-04-24 | 2003-11-07 | Korea Semiconductor System Co Ltd | Method for splitting semiconductor package |
Non-Patent Citations (1)
Title |
---|
RESEARCH DISCLOSURE VOL. 443, NO. 098 * |
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