SG118104A1 - Method for packaging an optoelectronic device and package formed thereby - Google Patents
Method for packaging an optoelectronic device and package formed therebyInfo
- Publication number
- SG118104A1 SG118104A1 SG200107809A SG200107809A SG118104A1 SG 118104 A1 SG118104 A1 SG 118104A1 SG 200107809 A SG200107809 A SG 200107809A SG 200107809 A SG200107809 A SG 200107809A SG 118104 A1 SG118104 A1 SG 118104A1
- Authority
- SG
- Singapore
- Prior art keywords
- packaging
- optoelectronic device
- package formed
- package
- optoelectronic
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200107809A SG118104A1 (en) | 2001-12-10 | 2001-12-10 | Method for packaging an optoelectronic device and package formed thereby |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200107809A SG118104A1 (en) | 2001-12-10 | 2001-12-10 | Method for packaging an optoelectronic device and package formed thereby |
Publications (1)
Publication Number | Publication Date |
---|---|
SG118104A1 true SG118104A1 (en) | 2006-01-27 |
Family
ID=36102688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200107809A SG118104A1 (en) | 2001-12-10 | 2001-12-10 | Method for packaging an optoelectronic device and package formed thereby |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG118104A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08142401A (en) * | 1994-11-15 | 1996-06-04 | Kyocera Corp | Image apparatus |
US5696626A (en) * | 1995-10-12 | 1997-12-09 | Xerox Corporation | Photosensitive silicon chip having a ridge near an end photosite |
US5734155A (en) * | 1995-06-07 | 1998-03-31 | Lsi Logic Corporation | Photo-sensitive semiconductor integrated circuit substrate and systems containing the same |
EP0875940A2 (en) * | 1997-04-30 | 1998-11-04 | Hewlett-Packard Company | Optoelectronic array and method of making the same |
US20020125408A1 (en) * | 2001-03-08 | 2002-09-12 | Xerox Corporation | Color filter configuration for a silicon wafer to be diced into photosensitive chips |
-
2001
- 2001-12-10 SG SG200107809A patent/SG118104A1/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08142401A (en) * | 1994-11-15 | 1996-06-04 | Kyocera Corp | Image apparatus |
US5734155A (en) * | 1995-06-07 | 1998-03-31 | Lsi Logic Corporation | Photo-sensitive semiconductor integrated circuit substrate and systems containing the same |
US5696626A (en) * | 1995-10-12 | 1997-12-09 | Xerox Corporation | Photosensitive silicon chip having a ridge near an end photosite |
EP0875940A2 (en) * | 1997-04-30 | 1998-11-04 | Hewlett-Packard Company | Optoelectronic array and method of making the same |
US20020125408A1 (en) * | 2001-03-08 | 2002-09-12 | Xerox Corporation | Color filter configuration for a silicon wafer to be diced into photosensitive chips |
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