SG118104A1 - Method for packaging an optoelectronic device and package formed thereby - Google Patents

Method for packaging an optoelectronic device and package formed thereby

Info

Publication number
SG118104A1
SG118104A1 SG200107809A SG200107809A SG118104A1 SG 118104 A1 SG118104 A1 SG 118104A1 SG 200107809 A SG200107809 A SG 200107809A SG 200107809 A SG200107809 A SG 200107809A SG 118104 A1 SG118104 A1 SG 118104A1
Authority
SG
Singapore
Prior art keywords
packaging
optoelectronic device
package formed
package
optoelectronic
Prior art date
Application number
SG200107809A
Inventor
Chew Hwee Seng Jimmy
Romeo Emmanuel P Alvarez
Briar John
Original Assignee
Advanpack Solutions Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanpack Solutions Pte Ltd filed Critical Advanpack Solutions Pte Ltd
Priority to SG200107809A priority Critical patent/SG118104A1/en
Publication of SG118104A1 publication Critical patent/SG118104A1/en

Links

SG200107809A 2001-12-10 2001-12-10 Method for packaging an optoelectronic device and package formed thereby SG118104A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200107809A SG118104A1 (en) 2001-12-10 2001-12-10 Method for packaging an optoelectronic device and package formed thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200107809A SG118104A1 (en) 2001-12-10 2001-12-10 Method for packaging an optoelectronic device and package formed thereby

Publications (1)

Publication Number Publication Date
SG118104A1 true SG118104A1 (en) 2006-01-27

Family

ID=36102688

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200107809A SG118104A1 (en) 2001-12-10 2001-12-10 Method for packaging an optoelectronic device and package formed thereby

Country Status (1)

Country Link
SG (1) SG118104A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08142401A (en) * 1994-11-15 1996-06-04 Kyocera Corp Image apparatus
US5696626A (en) * 1995-10-12 1997-12-09 Xerox Corporation Photosensitive silicon chip having a ridge near an end photosite
US5734155A (en) * 1995-06-07 1998-03-31 Lsi Logic Corporation Photo-sensitive semiconductor integrated circuit substrate and systems containing the same
EP0875940A2 (en) * 1997-04-30 1998-11-04 Hewlett-Packard Company Optoelectronic array and method of making the same
US20020125408A1 (en) * 2001-03-08 2002-09-12 Xerox Corporation Color filter configuration for a silicon wafer to be diced into photosensitive chips

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08142401A (en) * 1994-11-15 1996-06-04 Kyocera Corp Image apparatus
US5734155A (en) * 1995-06-07 1998-03-31 Lsi Logic Corporation Photo-sensitive semiconductor integrated circuit substrate and systems containing the same
US5696626A (en) * 1995-10-12 1997-12-09 Xerox Corporation Photosensitive silicon chip having a ridge near an end photosite
EP0875940A2 (en) * 1997-04-30 1998-11-04 Hewlett-Packard Company Optoelectronic array and method of making the same
US20020125408A1 (en) * 2001-03-08 2002-09-12 Xerox Corporation Color filter configuration for a silicon wafer to be diced into photosensitive chips

Similar Documents

Publication Publication Date Title
EP1308869A3 (en) Method and device for determining optimum packaging
TWI351078B (en) Packaging component and semiconductor package
TWI350573B (en) Semiconductor device package and method for manufacturing same
AU2002243722A1 (en) Electronic device package
AU2003284300A8 (en) Optoelectronic package and fabrication method
AU2002250249A1 (en) A method of packaging a device with a lead frame
IL151498A0 (en) Electronic device packaging
AU5109000A (en) Semiconductor package, semiconductor device, electronic device and production method for semiconductor package
SG119185A1 (en) Method for packaging circuits and packaged circuits
AU2003282641A1 (en) Device and method for sterilizing packages
GB0122681D0 (en) Packaging systems apparatus and method therefor
GB2370693B (en) Wiring method for semiconductor package
EP1447332A4 (en) Method and device for packaging load body
HK1049066A1 (en) Semiconductor package and method for mounting semiconductor package
GB9802105D0 (en) Semiconductor opto-electronic device packaging
EP1245494A4 (en) Method and device for inspecting sealed packages
SG106106A1 (en) Apparatus and method for off-loading electronic packages
AU2003289336A1 (en) Package structure and packaging method of semiconductor device
AU2003279681A1 (en) Method and device for manufacturing packages
HUP0401679A3 (en) Device for packaging products under controlled atmosphere
AU2002348875A1 (en) Method of and device for packaging electronic components thus packaged
AU2002359885A1 (en) Semiconductor package device and method
GB0028115D0 (en) Semiconductor device packaging assembly and method for manufacturing the same
SG118104A1 (en) Method for packaging an optoelectronic device and package formed thereby
AU2002342605A1 (en) Device and method for conveying filled bottles