SG116623A1 - Spool case for bonding wire. - Google Patents

Spool case for bonding wire.

Info

Publication number
SG116623A1
SG116623A1 SG200502346A SG200502346A SG116623A1 SG 116623 A1 SG116623 A1 SG 116623A1 SG 200502346 A SG200502346 A SG 200502346A SG 200502346 A SG200502346 A SG 200502346A SG 116623 A1 SG116623 A1 SG 116623A1
Authority
SG
Singapore
Prior art keywords
bonding wire
spool case
spool
case
bonding
Prior art date
Application number
SG200502346A
Inventor
Kwang Meng Tan
Togashi Ryou
Original Assignee
Malaysian Electronics Material
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Malaysian Electronics Material filed Critical Malaysian Electronics Material
Publication of SG116623A1 publication Critical patent/SG116623A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/02—Ducting arrangements
    • F24F13/0209—Ducting arrangements characterised by their connecting means, e.g. flanges
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F17/00—Vertical ducts; Channels, e.g. for drainage
    • E04F17/04—Air-ducts or air channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
  • Storing, Repeated Paying-Out, And Re-Storing Of Elongated Articles (AREA)
  • Closures For Containers (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
SG200502346A 2004-04-28 2005-04-18 Spool case for bonding wire. SG116623A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20041582 2004-04-28

Publications (1)

Publication Number Publication Date
SG116623A1 true SG116623A1 (en) 2005-11-28

Family

ID=35345766

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200502346A SG116623A1 (en) 2004-04-28 2005-04-18 Spool case for bonding wire.

Country Status (5)

Country Link
JP (1) JP4764032B2 (en)
KR (1) KR20060045023A (en)
CN (1) CN100542925C (en)
SG (1) SG116623A1 (en)
TW (1) TWI257365B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103836A (en) * 1983-11-11 1985-06-08 Fujitsu Ltd Multiplexing system of supervisory signal
JPH0484189A (en) * 1990-07-27 1992-03-17 Fujitsu General Ltd Gas discharge type display device
JPH07330060A (en) * 1994-06-15 1995-12-19 Dainippon Printing Co Ltd Carrying case for magnetic disk
JPH11321953A (en) * 1998-05-20 1999-11-24 Mitsubishi Materials Corp Spool case
JP4097818B2 (en) * 1998-12-04 2008-06-11 Ｔｄｋ株式会社 Recording media disk packaging container

Also Published As

Publication number Publication date
TWI257365B (en) 2006-07-01
CN1689950A (en) 2005-11-02
TW200535066A (en) 2005-11-01
JP2005317928A (en) 2005-11-10
CN100542925C (en) 2009-09-23
KR20060045023A (en) 2006-05-16
JP4764032B2 (en) 2011-08-31

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