SG114526A1 - Pressure-sensitive system and method of testing electronic device interconnections - Google Patents
Pressure-sensitive system and method of testing electronic device interconnectionsInfo
- Publication number
- SG114526A1 SG114526A1 SG200200586A SG200200586A SG114526A1 SG 114526 A1 SG114526 A1 SG 114526A1 SG 200200586 A SG200200586 A SG 200200586A SG 200200586 A SG200200586 A SG 200200586A SG 114526 A1 SG114526 A1 SG 114526A1
- Authority
- SG
- Singapore
- Prior art keywords
- pressure
- electronic device
- sensitive system
- testing electronic
- device interconnections
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/919,256 US6512387B1 (en) | 2001-07-31 | 2001-07-31 | Pressure-sensitive system and method of testing electronic device interconnections |
Publications (1)
Publication Number | Publication Date |
---|---|
SG114526A1 true SG114526A1 (en) | 2005-09-28 |
Family
ID=25441784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200200586A SG114526A1 (en) | 2001-07-31 | 2002-01-30 | Pressure-sensitive system and method of testing electronic device interconnections |
Country Status (4)
Country | Link |
---|---|
US (1) | US6512387B1 (zh) |
EP (1) | EP1288668A3 (zh) |
SG (1) | SG114526A1 (zh) |
TW (1) | TWI225156B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7190440B2 (en) * | 2002-09-17 | 2007-03-13 | Seagate Technology, Llc | Controlling compressive force using pressure sensitive film |
TWI221531B (en) * | 2002-10-25 | 2004-10-01 | Hwan-Chia Chang | Method for testing soldering reliability |
US20080124528A1 (en) * | 2006-11-29 | 2008-05-29 | Motorola, Inc. | Printed electronic device and methods of determining the electrical value thereof |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
US9703623B2 (en) * | 2014-11-11 | 2017-07-11 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Adjusting the use of a chip/socket having a damaged pin |
KR20180101476A (ko) | 2016-01-08 | 2018-09-12 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 |
JP2017129395A (ja) * | 2016-01-19 | 2017-07-27 | 三菱電機株式会社 | 半導体装置の検査装置および半導体装置の検査方法 |
US10345208B2 (en) | 2016-07-12 | 2019-07-09 | Deka Products Limited Partnership | System and method for applying force to a device |
US11299705B2 (en) | 2016-11-07 | 2022-04-12 | Deka Products Limited Partnership | System and method for creating tissue |
US11126195B2 (en) * | 2017-06-12 | 2021-09-21 | Faraday & Future Inc. | System and method for detecting occluded objects based on image processing |
CN112964399B (zh) * | 2021-04-05 | 2022-07-29 | 西北工业大学 | 电子器件金属丝/弹簧片接触压力全自动测试仪及测试方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2263980B (en) * | 1992-02-07 | 1996-04-10 | Marconi Gec Ltd | Apparatus and method for testing bare dies |
JP3787185B2 (ja) * | 1995-04-28 | 2006-06-21 | アヴェンティス・リサーチ・ウント・テクノロジーズ・ゲーエムベーハー・ウント・コー・カーゲー | 配線基板の配線の欠陥を検出する装置 |
US5894161A (en) * | 1997-02-24 | 1999-04-13 | Micron Technology, Inc. | Interconnect with pressure sensing mechanism for testing semiconductor wafers |
-
2001
- 2001-07-31 US US09/919,256 patent/US6512387B1/en not_active Expired - Fee Related
-
2002
- 2002-01-30 SG SG200200586A patent/SG114526A1/en unknown
- 2002-01-31 TW TW091101680A patent/TWI225156B/zh active
- 2002-07-31 EP EP02255349A patent/EP1288668A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20030025494A1 (en) | 2003-02-06 |
US6512387B1 (en) | 2003-01-28 |
EP1288668A3 (en) | 2003-12-17 |
TWI225156B (en) | 2004-12-11 |
EP1288668A2 (en) | 2003-03-05 |
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