SG113449A1 - Wet time etching - Google Patents

Wet time etching

Info

Publication number
SG113449A1
SG113449A1 SG200300697A SG200300697A SG113449A1 SG 113449 A1 SG113449 A1 SG 113449A1 SG 200300697 A SG200300697 A SG 200300697A SG 200300697 A SG200300697 A SG 200300697A SG 113449 A1 SG113449 A1 SG 113449A1
Authority
SG
Singapore
Prior art keywords
time etching
wet time
wet
etching
time
Prior art date
Application number
SG200300697A
Inventor
Bacal Corrales Arnold
Kok Meng Ong
Sooriakumar Kathirgamasundaram
Wai Mun Chong
Original Assignee
Sensfab Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensfab Pte Ltd filed Critical Sensfab Pte Ltd
Priority to SG200300697A priority Critical patent/SG113449A1/en
Publication of SG113449A1 publication Critical patent/SG113449A1/en

Links

SG200300697A 2003-02-21 2003-02-21 Wet time etching SG113449A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200300697A SG113449A1 (en) 2003-02-21 2003-02-21 Wet time etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200300697A SG113449A1 (en) 2003-02-21 2003-02-21 Wet time etching

Publications (1)

Publication Number Publication Date
SG113449A1 true SG113449A1 (en) 2005-08-29

Family

ID=35125817

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200300697A SG113449A1 (en) 2003-02-21 2003-02-21 Wet time etching

Country Status (1)

Country Link
SG (1) SG113449A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244527A (en) * 1991-08-06 1993-09-14 Nec Corporation Manufacturing unit for semiconductor devices
US6337027B1 (en) * 1999-09-30 2002-01-08 Rockwell Science Center, Llc Microelectromechanical device manufacturing process
US20020123232A1 (en) * 2001-03-02 2002-09-05 Tsung-Ping Hsu High density wafer production method
US20020126368A1 (en) * 2000-12-29 2002-09-12 Smith David M. Post metal etch clean process using soft mask

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244527A (en) * 1991-08-06 1993-09-14 Nec Corporation Manufacturing unit for semiconductor devices
US6337027B1 (en) * 1999-09-30 2002-01-08 Rockwell Science Center, Llc Microelectromechanical device manufacturing process
US20020126368A1 (en) * 2000-12-29 2002-09-12 Smith David M. Post metal etch clean process using soft mask
US20020123232A1 (en) * 2001-03-02 2002-09-05 Tsung-Ping Hsu High density wafer production method

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