SG113449A1 - Wet time etching - Google Patents
Wet time etchingInfo
- Publication number
- SG113449A1 SG113449A1 SG200300697A SG200300697A SG113449A1 SG 113449 A1 SG113449 A1 SG 113449A1 SG 200300697 A SG200300697 A SG 200300697A SG 200300697 A SG200300697 A SG 200300697A SG 113449 A1 SG113449 A1 SG 113449A1
- Authority
- SG
- Singapore
- Prior art keywords
- time etching
- wet time
- wet
- etching
- time
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200300697A SG113449A1 (en) | 2003-02-21 | 2003-02-21 | Wet time etching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200300697A SG113449A1 (en) | 2003-02-21 | 2003-02-21 | Wet time etching |
Publications (1)
Publication Number | Publication Date |
---|---|
SG113449A1 true SG113449A1 (en) | 2005-08-29 |
Family
ID=35125817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200300697A SG113449A1 (en) | 2003-02-21 | 2003-02-21 | Wet time etching |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG113449A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5244527A (en) * | 1991-08-06 | 1993-09-14 | Nec Corporation | Manufacturing unit for semiconductor devices |
US6337027B1 (en) * | 1999-09-30 | 2002-01-08 | Rockwell Science Center, Llc | Microelectromechanical device manufacturing process |
US20020123232A1 (en) * | 2001-03-02 | 2002-09-05 | Tsung-Ping Hsu | High density wafer production method |
US20020126368A1 (en) * | 2000-12-29 | 2002-09-12 | Smith David M. | Post metal etch clean process using soft mask |
-
2003
- 2003-02-21 SG SG200300697A patent/SG113449A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5244527A (en) * | 1991-08-06 | 1993-09-14 | Nec Corporation | Manufacturing unit for semiconductor devices |
US6337027B1 (en) * | 1999-09-30 | 2002-01-08 | Rockwell Science Center, Llc | Microelectromechanical device manufacturing process |
US20020126368A1 (en) * | 2000-12-29 | 2002-09-12 | Smith David M. | Post metal etch clean process using soft mask |
US20020123232A1 (en) * | 2001-03-02 | 2002-09-05 | Tsung-Ping Hsu | High density wafer production method |
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