SG11202111592WA - Biometric sensor module for a smart card and method for manufacturing such a module - Google Patents
Biometric sensor module for a smart card and method for manufacturing such a moduleInfo
- Publication number
- SG11202111592WA SG11202111592WA SG11202111592WA SG11202111592WA SG11202111592WA SG 11202111592W A SG11202111592W A SG 11202111592WA SG 11202111592W A SG11202111592W A SG 11202111592WA SG 11202111592W A SG11202111592W A SG 11202111592WA SG 11202111592W A SG11202111592W A SG 11202111592WA
- Authority
- SG
- Singapore
- Prior art keywords
- module
- manufacturing
- smart card
- biometric sensor
- sensor module
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
- G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07345—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
- G06K19/07354—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches by biometrically sensitive means, e.g. fingerprint sensitive
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Automation & Control Theory (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Ceramic Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1904204A FR3095287B1 (en) | 2019-04-19 | 2019-04-19 | Biometric sensor module for smart card and method of manufacturing such a module |
PCT/FR2020/000129 WO2020212661A1 (en) | 2019-04-19 | 2020-04-16 | Biometric sensor module for a smart card and method for manufacturing such a module |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202111592WA true SG11202111592WA (en) | 2021-11-29 |
Family
ID=68342961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202111592WA SG11202111592WA (en) | 2019-04-19 | 2020-04-16 | Biometric sensor module for a smart card and method for manufacturing such a module |
Country Status (8)
Country | Link |
---|---|
US (1) | US20220216137A1 (en) |
EP (1) | EP3956816B1 (en) |
JP (1) | JP2022529277A (en) |
KR (1) | KR20210148184A (en) |
CN (1) | CN113728331A (en) |
FR (1) | FR3095287B1 (en) |
SG (1) | SG11202111592WA (en) |
WO (1) | WO2020212661A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3111215B1 (en) * | 2020-06-04 | 2022-08-12 | Linxens Holding | Biometric sensor module for smart card and method of manufacturing such a module |
EP3930133B1 (en) * | 2020-06-25 | 2024-02-21 | Samsung Electronics Co., Ltd. | Internal voltage generation circuit of smart card and smart card including the same |
TWM612841U (en) * | 2021-02-19 | 2021-06-01 | 安帝司股份有限公司 | Fingerprint identification smart card |
SE2150221A1 (en) * | 2021-03-01 | 2022-09-02 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensor module for a smartcard and method for fingerprint recognition in a smartcard |
CN117377963A (en) * | 2021-05-21 | 2024-01-09 | 兰克森控股公司 | Module for integration into a card body of a smart card, and method for implanting a module into a card body of a smart card |
FR3131174A1 (en) | 2021-12-17 | 2023-06-23 | Linxens Holding | Process for manufacturing an electrical circuit with an anti-corrosion layer and electrical circuit obtained by this process |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10139414A1 (en) * | 2001-08-17 | 2003-02-27 | Giesecke & Devrient Gmbh | Semiconductor circuit arrangement with biometric sensor and evaluation unit |
US20100194331A1 (en) * | 2009-02-05 | 2010-08-05 | James Chyi Lai | electrical device having a power source with a magnetic capacitor as an energy storage device |
US9773153B1 (en) * | 2016-03-24 | 2017-09-26 | Fingerprint Cards Ab | Fingerprint sensor module |
KR20180067148A (en) * | 2016-12-12 | 2018-06-20 | 삼성전자주식회사 | Printed Circuit Board and Apparatus being applied PCB |
US10395164B2 (en) | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
FR3061333B1 (en) * | 2016-12-26 | 2019-05-31 | Idemia France | PLASTIC THIN CARD INTEGRATING A DIGITAL FOOTPRINT SENSOR AND METHOD OF MAKING SAME |
FR3063555B1 (en) * | 2017-03-03 | 2021-07-09 | Linxens Holding | CHIP CARD AND PROCESS FOR MANUFACTURING A CHIP CARD |
US11211461B2 (en) * | 2018-12-28 | 2021-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and memory device |
US11289475B2 (en) * | 2019-01-25 | 2022-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
-
2019
- 2019-04-19 FR FR1904204A patent/FR3095287B1/en active Active
-
2020
- 2020-04-16 JP JP2021561985A patent/JP2022529277A/en active Pending
- 2020-04-16 SG SG11202111592WA patent/SG11202111592WA/en unknown
- 2020-04-16 CN CN202080029886.6A patent/CN113728331A/en active Pending
- 2020-04-16 WO PCT/FR2020/000129 patent/WO2020212661A1/en active Application Filing
- 2020-04-16 KR KR1020217033152A patent/KR20210148184A/en unknown
- 2020-04-16 US US17/603,829 patent/US20220216137A1/en active Pending
- 2020-04-16 EP EP20728531.3A patent/EP3956816B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20220216137A1 (en) | 2022-07-07 |
KR20210148184A (en) | 2021-12-07 |
EP3956816B1 (en) | 2024-04-10 |
CN113728331A (en) | 2021-11-30 |
FR3095287B1 (en) | 2022-11-04 |
JP2022529277A (en) | 2022-06-20 |
WO2020212661A1 (en) | 2020-10-22 |
EP3956816A1 (en) | 2022-02-23 |
FR3095287A1 (en) | 2020-10-23 |
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