SG11202111073XA - Methods and systems for combining x-ray metrology data sets to improve parameter estimation - Google Patents
Methods and systems for combining x-ray metrology data sets to improve parameter estimationInfo
- Publication number
- SG11202111073XA SG11202111073XA SG11202111073XA SG11202111073XA SG11202111073XA SG 11202111073X A SG11202111073X A SG 11202111073XA SG 11202111073X A SG11202111073X A SG 11202111073XA SG 11202111073X A SG11202111073X A SG 11202111073XA SG 11202111073X A SG11202111073X A SG 11202111073XA
- Authority
- SG
- Singapore
- Prior art keywords
- combining
- systems
- methods
- data sets
- parameter estimation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/10—Different kinds of radiation or particles
- G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
- G01N2223/1016—X-ray
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962836261P | 2019-04-19 | 2019-04-19 | |
US16/847,388 US11990380B2 (en) | 2019-04-19 | 2020-04-13 | Methods and systems for combining x-ray metrology data sets to improve parameter estimation |
PCT/US2020/028386 WO2020214745A1 (en) | 2019-04-19 | 2020-04-16 | Methods and systems for combining x-ray metrology data sets to improve parameter estimation |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202111073XA true SG11202111073XA (en) | 2021-11-29 |
Family
ID=72830850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202111073XA SG11202111073XA (en) | 2019-04-19 | 2020-04-16 | Methods and systems for combining x-ray metrology data sets to improve parameter estimation |
Country Status (9)
Country | Link |
---|---|
US (1) | US11990380B2 (en) |
JP (1) | JP2022529043A (en) |
KR (1) | KR20210143922A (en) |
CN (1) | CN113677983B (en) |
DE (1) | DE112020002023T5 (en) |
IL (1) | IL287034A (en) |
SG (1) | SG11202111073XA (en) |
TW (1) | TW202104841A (en) |
WO (1) | WO2020214745A1 (en) |
Families Citing this family (10)
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WO2018154587A1 (en) * | 2017-02-27 | 2018-08-30 | Nova Measuring Instruments Ltd. | Tem-based metrology method and system |
US11876022B2 (en) * | 2019-12-17 | 2024-01-16 | Tokyo Electron Limited | Substrate treatment method and substrate treatment system |
JP7191902B2 (en) * | 2020-07-27 | 2022-12-19 | 日本電子株式会社 | Sample analysis device and method |
US12013355B2 (en) | 2020-12-17 | 2024-06-18 | Kla Corporation | Methods and systems for compact, small spot size soft x-ray scatterometry |
US20220252395A1 (en) * | 2021-02-10 | 2022-08-11 | Kla Corporation | Methods And Systems For Accurate Measurement Of Deep Structures Having Distorted Geometry |
US20220352041A1 (en) * | 2021-04-30 | 2022-11-03 | Kla Corporation | High Resolution Profile Measurement Based On A Trained Parameter Conditioned Measurement Model |
KR102582498B1 (en) * | 2021-10-18 | 2023-09-26 | 라이트비전 주식회사 | System and method of generating tem sadp image with high discernment |
WO2023068632A1 (en) * | 2021-10-18 | 2023-04-27 | 라이트비전 주식회사 | Diffraction pattern image conversion system and method for interconverting virtual tem sadp image and real tem sadp image by using deep learning |
US20230258585A1 (en) * | 2022-02-16 | 2023-08-17 | Kla Corporation | Semiconductor Measurements With Robust In-Line Tool Matching |
CN115983738B (en) * | 2023-03-21 | 2023-06-27 | 广东仁懋电子有限公司 | Method and device for improving gallium nitride preparation efficiency |
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US7068833B1 (en) | 2000-08-30 | 2006-06-27 | Kla-Tencor Corporation | Overlay marks, methods of overlay mark design and methods of overlay measurements |
US7541201B2 (en) | 2000-08-30 | 2009-06-02 | Kla-Tencor Technologies Corporation | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
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-
2020
- 2020-04-13 US US16/847,388 patent/US11990380B2/en active Active
- 2020-04-16 KR KR1020217036815A patent/KR20210143922A/en unknown
- 2020-04-16 JP JP2021561822A patent/JP2022529043A/en active Pending
- 2020-04-16 SG SG11202111073XA patent/SG11202111073XA/en unknown
- 2020-04-16 WO PCT/US2020/028386 patent/WO2020214745A1/en active Application Filing
- 2020-04-16 CN CN202080028145.6A patent/CN113677983B/en active Active
- 2020-04-16 DE DE112020002023.1T patent/DE112020002023T5/en active Pending
- 2020-04-17 TW TW109113100A patent/TW202104841A/en unknown
-
2021
- 2021-10-06 IL IL287034A patent/IL287034A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2020214745A1 (en) | 2020-10-22 |
TW202104841A (en) | 2021-02-01 |
US11990380B2 (en) | 2024-05-21 |
KR20210143922A (en) | 2021-11-29 |
DE112020002023T5 (en) | 2022-01-05 |
JP2022529043A (en) | 2022-06-16 |
US20200335406A1 (en) | 2020-10-22 |
IL287034A (en) | 2021-12-01 |
CN113677983B (en) | 2022-11-15 |
CN113677983A (en) | 2021-11-19 |
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