SG11202110781WA - Substrate pattern filling composition and use of the same - Google Patents
Substrate pattern filling composition and use of the sameInfo
- Publication number
- SG11202110781WA SG11202110781WA SG11202110781WA SG11202110781WA SG11202110781WA SG 11202110781W A SG11202110781W A SG 11202110781WA SG 11202110781W A SG11202110781W A SG 11202110781WA SG 11202110781W A SG11202110781W A SG 11202110781WA SG 11202110781W A SG11202110781W A SG 11202110781WA
- Authority
- SG
- Singapore
- Prior art keywords
- same
- filling composition
- substrate pattern
- pattern filling
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2072—Aldehydes-ketones
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/40—Specific cleaning or washing processes
- C11D2111/42—Application of foam or a temporary coating on the surface to be cleaned
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Detergent Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019079906A JP2020178062A (en) | 2019-04-19 | 2019-04-19 | Substrate pattern filling composition and usage thereof |
| PCT/EP2020/060533 WO2020212389A1 (en) | 2019-04-19 | 2020-04-15 | Substrate pattern filling composition and use of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202110781WA true SG11202110781WA (en) | 2021-11-29 |
Family
ID=70292961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202110781WA SG11202110781WA (en) | 2019-04-19 | 2020-04-15 | Substrate pattern filling composition and use of the same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11859152B2 (en) |
| JP (2) | JP2020178062A (en) |
| KR (1) | KR102635633B1 (en) |
| CN (1) | CN113785041B (en) |
| SG (1) | SG11202110781WA (en) |
| TW (1) | TWI834866B (en) |
| WO (1) | WO2020212389A1 (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5006235B2 (en) * | 2008-03-19 | 2012-08-22 | 富士フイルム株式会社 | Method for producing functional film |
| JP2013042093A (en) * | 2011-08-19 | 2013-02-28 | Central Glass Co Ltd | Wafer cleaning method |
| JP2013042094A (en) * | 2011-08-19 | 2013-02-28 | Central Glass Co Ltd | Wafer cleaning method |
| JP6216188B2 (en) | 2013-09-04 | 2017-10-18 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate drying apparatus and substrate drying method |
| US11009795B2 (en) * | 2016-03-30 | 2021-05-18 | Nissan Chemical Corporation | Aqueous solution for resist pattern coating and pattern forming methods using the same |
| JP2017187609A (en) | 2016-04-05 | 2017-10-12 | アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ | Gap filling composition and pattern forming method using low molecular weight compound |
| JP2017215561A (en) * | 2016-05-30 | 2017-12-07 | アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ | Gap filling composition and pattern forming method using composition containing polymer |
| JP6271775B2 (en) | 2017-01-05 | 2018-01-31 | 東芝メモリ株式会社 | Semiconductor device manufacturing method and chemical solution |
| JP7030440B2 (en) | 2017-07-27 | 2022-03-07 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method, substrate processing liquid and substrate processing equipment |
| WO2019021664A1 (en) | 2017-07-27 | 2019-01-31 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method, substrate processing solution, and substrate processing device |
| US10964525B2 (en) * | 2017-12-19 | 2021-03-30 | Micron Technology, Inc. | Removing a sacrificial material via sublimation in forming a semiconductor |
| JP2018139331A (en) | 2018-06-13 | 2018-09-06 | 東京エレクトロン株式会社 | Substrate drying method and substrate processing apparatus |
| JP7312008B2 (en) | 2018-06-29 | 2023-07-20 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method and substrate processing apparatus |
-
2019
- 2019-04-19 JP JP2019079906A patent/JP2020178062A/en active Pending
-
2020
- 2020-04-15 SG SG11202110781WA patent/SG11202110781WA/en unknown
- 2020-04-15 CN CN202080029342.XA patent/CN113785041B/en active Active
- 2020-04-15 KR KR1020217037610A patent/KR102635633B1/en active IP Right Grant
- 2020-04-15 WO PCT/EP2020/060533 patent/WO2020212389A1/en active Application Filing
- 2020-04-15 US US17/604,168 patent/US11859152B2/en active Active
- 2020-04-15 JP JP2021555352A patent/JP7219824B2/en active Active
- 2020-04-17 TW TW109112914A patent/TWI834866B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| US11859152B2 (en) | 2024-01-02 |
| TW202104574A (en) | 2021-02-01 |
| JP2020178062A (en) | 2020-10-29 |
| WO2020212389A1 (en) | 2020-10-22 |
| CN113785041B (en) | 2024-03-08 |
| KR102635633B1 (en) | 2024-02-14 |
| JP2022528609A (en) | 2022-06-15 |
| US20220213415A1 (en) | 2022-07-07 |
| KR20220002387A (en) | 2022-01-06 |
| CN113785041A (en) | 2021-12-10 |
| TWI834866B (en) | 2024-03-11 |
| JP7219824B2 (en) | 2023-02-08 |
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