SG11202108161TA - System and method of object inspection using multispectral 3d laser scanning - Google Patents

System and method of object inspection using multispectral 3d laser scanning

Info

Publication number
SG11202108161TA
SG11202108161TA SG11202108161TA SG11202108161TA SG11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA
Authority
SG
Singapore
Prior art keywords
multispectral
laser scanning
object inspection
inspection
scanning
Prior art date
Application number
SG11202108161TA
Inventor
Kok Weng Wong
Albert Archmawety
Jun Kang Ng
Chee Chye Lee
Original Assignee
Mit Semiconductor Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mit Semiconductor Pte Ltd filed Critical Mit Semiconductor Pte Ltd
Publication of SG11202108161TA publication Critical patent/SG11202108161TA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2504Calibration devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/245Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518Projection by scanning of the object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T15/003D [Three Dimensional] image rendering
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T15/003D [Three Dimensional] image rendering
    • G06T15/005General purpose rendering architectures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
SG11202108161TA 2019-02-01 2019-02-01 System and method of object inspection using multispectral 3d laser scanning SG11202108161TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2019/050064 WO2020159434A1 (en) 2019-02-01 2019-02-01 System and method of object inspection using multispectral 3d laser scanning

Publications (1)

Publication Number Publication Date
SG11202108161TA true SG11202108161TA (en) 2021-08-30

Family

ID=71842291

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202108161TA SG11202108161TA (en) 2019-02-01 2019-02-01 System and method of object inspection using multispectral 3d laser scanning

Country Status (4)

Country Link
US (1) US11953312B2 (en)
CN (1) CN113474618B (en)
SG (1) SG11202108161TA (en)
WO (1) WO2020159434A1 (en)

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CN109141289B (en) * 2018-08-01 2020-12-29 先临三维科技股份有限公司 Three-dimensional scanning method and system
CN113655066A (en) * 2021-08-13 2021-11-16 南方海洋科学与工程广东省实验室(湛江) Device, system and method for detecting damage of net cage
CN114295076B (en) * 2022-01-05 2023-10-20 南昌航空大学 Measuring method for solving shadow measuring problem of tiny object based on structured light
CN117218041B (en) * 2023-11-08 2024-03-12 深圳长盛高精密五金有限公司 Metal shaft surface image acquisition method based on line scanning
CN117516639A (en) * 2024-01-08 2024-02-06 吉林农业大学 High-flux greenhouse plant phenotype measurement system based on multispectral point cloud fusion

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Also Published As

Publication number Publication date
US20220107174A1 (en) 2022-04-07
CN113474618B (en) 2024-03-15
CN113474618A (en) 2021-10-01
US11953312B2 (en) 2024-04-09
WO2020159434A1 (en) 2020-08-06

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