SG11202108161TA - System and method of object inspection using multispectral 3d laser scanning - Google Patents
System and method of object inspection using multispectral 3d laser scanningInfo
- Publication number
- SG11202108161TA SG11202108161TA SG11202108161TA SG11202108161TA SG11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA SG 11202108161T A SG11202108161T A SG 11202108161TA
- Authority
- SG
- Singapore
- Prior art keywords
- multispectral
- laser scanning
- object inspection
- inspection
- scanning
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2504—Calibration devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T15/00—3D [Three Dimensional] image rendering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T15/00—3D [Three Dimensional] image rendering
- G06T15/005—General purpose rendering architectures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2019/050064 WO2020159434A1 (en) | 2019-02-01 | 2019-02-01 | System and method of object inspection using multispectral 3d laser scanning |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202108161TA true SG11202108161TA (en) | 2021-08-30 |
Family
ID=71842291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202108161TA SG11202108161TA (en) | 2019-02-01 | 2019-02-01 | System and method of object inspection using multispectral 3d laser scanning |
Country Status (4)
Country | Link |
---|---|
US (1) | US11953312B2 (en) |
CN (1) | CN113474618B (en) |
SG (1) | SG11202108161TA (en) |
WO (1) | WO2020159434A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109141289B (en) * | 2018-08-01 | 2020-12-29 | 先临三维科技股份有限公司 | Three-dimensional scanning method and system |
CN113655066A (en) * | 2021-08-13 | 2021-11-16 | 南方海洋科学与工程广东省实验室(湛江) | Device, system and method for detecting damage of net cage |
CN114295076B (en) * | 2022-01-05 | 2023-10-20 | 南昌航空大学 | Measuring method for solving shadow measuring problem of tiny object based on structured light |
CN117218041B (en) * | 2023-11-08 | 2024-03-12 | 深圳长盛高精密五金有限公司 | Metal shaft surface image acquisition method based on line scanning |
CN117516639A (en) * | 2024-01-08 | 2024-02-06 | 吉林农业大学 | High-flux greenhouse plant phenotype measurement system based on multispectral point cloud fusion |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2536127B2 (en) * | 1989-02-17 | 1996-09-18 | オムロン株式会社 | Board inspection equipment |
US5039868A (en) * | 1988-11-24 | 1991-08-13 | Omron Corporation | Method of and apparatus for inspecting printed circuit boards and the like |
US5406372A (en) | 1993-04-16 | 1995-04-11 | Modular Vision Systems Inc. | QFP lead quality inspection system and method |
US6750974B2 (en) | 2002-04-02 | 2004-06-15 | Gsi Lumonics Corporation | Method and system for 3D imaging of target regions |
JP4401989B2 (en) | 2005-03-15 | 2010-01-20 | 三井造船株式会社 | 3D image information acquisition system |
CN101533529B (en) * | 2009-01-23 | 2011-11-30 | 北京建筑工程学院 | Range image-based 3D spatial data processing method and device |
CN101706264B (en) * | 2009-04-01 | 2012-11-21 | 姚征远 | Projection three-dimensional measuring device |
DE102011000304B4 (en) * | 2011-01-25 | 2016-08-04 | Data M Sheet Metal Solutions Gmbh | Calibration of laser light section sensors with simultaneous measurement |
GB2490872B (en) | 2011-05-09 | 2015-07-29 | Toshiba Res Europ Ltd | Methods and systems for capturing 3d surface geometry |
US9098908B2 (en) * | 2011-10-21 | 2015-08-04 | Microsoft Technology Licensing, Llc | Generating a depth map |
CN202770413U (en) | 2012-08-23 | 2013-03-06 | 杭州先临三维科技股份有限公司 | 3D scanner for obtaining colorful image by monochrome camera |
CN102980526B (en) * | 2012-08-23 | 2016-08-24 | 杭州先临三维科技股份有限公司 | Spatial digitizer and the scan method thereof of coloured image is obtained with black and white camera |
CN103713463B (en) * | 2012-10-09 | 2016-08-24 | 耿征 | True three-dimensional image display systems and display packing |
KR101438157B1 (en) * | 2012-11-12 | 2014-09-05 | 주식회사 고영테크놀러지 | Board inspection method |
EP2799810A1 (en) * | 2013-04-30 | 2014-11-05 | Aimess Services GmbH | Apparatus and method for simultaneous three-dimensional measuring of surfaces with multiple wavelengths |
CN103759671B (en) * | 2014-01-10 | 2016-05-18 | 西北农林科技大学 | A kind of dental model three-dimensional surface data non-contact scanning method |
KR102025038B1 (en) * | 2014-09-11 | 2019-09-24 | 사이버옵틱스 코포레이션 | Point cloud merging from multiple cameras and sources in three-dimensional profilometry |
CN105203046B (en) * | 2015-09-10 | 2018-09-18 | 北京天远三维科技股份有限公司 | Multi-thread array laser 3 D scanning system and multi-thread array laser 3-D scanning method |
CN106500628B (en) | 2016-10-19 | 2019-02-19 | 杭州思看科技有限公司 | A kind of 3-D scanning method and scanner containing multiple and different long wavelength lasers |
CN106500627B (en) * | 2016-10-19 | 2019-02-01 | 杭州思看科技有限公司 | 3-D scanning method and scanner containing multiple and different long wavelength lasers |
BR112019016646B1 (en) * | 2017-02-13 | 2023-10-17 | Vale S.A. | MULTI-GROUND ROBOTIC INSPECTION DEVICE AND METHOD FOR GUIDING THE MULTI-GROUND ROBOTIC INSPECTION DEVICE |
US11726184B2 (en) * | 2019-03-08 | 2023-08-15 | Leddartech Inc. | Component for a LIDAR sensor system, LIDAR sensor system, LIDAR sensor device, method for a LIDAR sensor system and method for a LIDAR sensor device |
-
2019
- 2019-02-01 SG SG11202108161TA patent/SG11202108161TA/en unknown
- 2019-02-01 US US17/426,674 patent/US11953312B2/en active Active
- 2019-02-01 CN CN201980091103.4A patent/CN113474618B/en active Active
- 2019-02-01 WO PCT/SG2019/050064 patent/WO2020159434A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20220107174A1 (en) | 2022-04-07 |
CN113474618B (en) | 2024-03-15 |
CN113474618A (en) | 2021-10-01 |
US11953312B2 (en) | 2024-04-09 |
WO2020159434A1 (en) | 2020-08-06 |
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