SG11202107945QA - Test and burn-in apparatus that provides variable thermal resistance - Google Patents

Test and burn-in apparatus that provides variable thermal resistance

Info

Publication number
SG11202107945QA
SG11202107945QA SG11202107945QA SG11202107945QA SG11202107945QA SG 11202107945Q A SG11202107945Q A SG 11202107945QA SG 11202107945Q A SG11202107945Q A SG 11202107945QA SG 11202107945Q A SG11202107945Q A SG 11202107945QA SG 11202107945Q A SG11202107945Q A SG 11202107945QA
Authority
SG
Singapore
Prior art keywords
burn
test
thermal resistance
provides variable
variable thermal
Prior art date
Application number
SG11202107945QA
Inventor
Ballson Gopal
Jesse Killion
Original Assignee
Kes Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kes Systems Inc filed Critical Kes Systems Inc
Publication of SG11202107945QA publication Critical patent/SG11202107945QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG11202107945QA 2019-01-29 2020-01-28 Test and burn-in apparatus that provides variable thermal resistance SG11202107945QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962798117P 2019-01-29 2019-01-29
PCT/US2020/015359 WO2020159954A1 (en) 2019-01-29 2020-01-28 Test and burn-in apparatus that provides variable thermal resistance

Publications (1)

Publication Number Publication Date
SG11202107945QA true SG11202107945QA (en) 2021-08-30

Family

ID=71840596

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202107945QA SG11202107945QA (en) 2019-01-29 2020-01-28 Test and burn-in apparatus that provides variable thermal resistance

Country Status (4)

Country Link
US (1) US11768224B2 (en)
EP (1) EP3918353A4 (en)
SG (1) SG11202107945QA (en)
WO (1) WO2020159954A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US20220155364A1 (en) 2020-11-19 2022-05-19 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) * 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
US11835549B2 (en) 2022-01-26 2023-12-05 Advantest Test Solutions, Inc. Thermal array with gimbal features and enhanced thermal performance

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821505A (en) * 1997-04-04 1998-10-13 Unisys Corporation Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink
US6184504B1 (en) * 1999-04-13 2001-02-06 Silicon Thermal, Inc. Temperature control system for electronic devices
US6501290B2 (en) * 1999-09-29 2002-12-31 Intel Corporation Direct to chuck coolant delivery for integrated circuit testing
US7296430B2 (en) * 2003-11-14 2007-11-20 Micro Control Company Cooling air flow control valve for burn-in system
US20060290370A1 (en) * 2004-02-27 2006-12-28 Wells-Cti, Llc, An Oregon Limited Liability Company Temperature control in ic sockets
US7259580B2 (en) * 2005-02-22 2007-08-21 International Business Machines Corporation Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test
JP2007315906A (en) 2006-05-25 2007-12-06 Fujitsu Ltd Method and apparatus for controlling temperature of semiconductor device, and method and apparatus for testing semiconductor device
KR100899142B1 (en) 2007-07-05 2009-05-27 삼성전자주식회사 Test socket
US8628240B2 (en) 2009-07-14 2014-01-14 Delta Design, Inc. Temperature measurement using a diode with saturation current cancellation
US9377486B2 (en) * 2014-03-28 2016-06-28 Intel Corporation Thermal interface material handling for thermal control of an electronic component under test
US9921265B2 (en) 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto

Also Published As

Publication number Publication date
EP3918353A4 (en) 2022-11-02
EP3918353A1 (en) 2021-12-08
US11768224B2 (en) 2023-09-26
WO2020159954A1 (en) 2020-08-06
US20220082587A1 (en) 2022-03-17

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