SG11202106419XA - Method of fabricating a device comprising a membrane overhanging a cavity - Google Patents

Method of fabricating a device comprising a membrane overhanging a cavity

Info

Publication number
SG11202106419XA
SG11202106419XA SG11202106419XA SG11202106419XA SG11202106419XA SG 11202106419X A SG11202106419X A SG 11202106419XA SG 11202106419X A SG11202106419X A SG 11202106419XA SG 11202106419X A SG11202106419X A SG 11202106419XA SG 11202106419X A SG11202106419X A SG 11202106419XA
Authority
SG
Singapore
Prior art keywords
fabricating
cavity
overhanging
membrane
membrane overhanging
Prior art date
Application number
SG11202106419XA
Inventor
Bruno Ghyselen
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11202106419XA publication Critical patent/SG11202106419XA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158Diaphragms, membranes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/03Static structures
    • B81B2203/0315Cavities
SG11202106419XA 2018-12-20 2019-12-12 Method of fabricating a device comprising a membrane overhanging a cavity SG11202106419XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1873602A FR3090615B1 (en) 2018-12-20 2018-12-20 Method for manufacturing a device comprising a membrane overhanging a cavity
PCT/FR2019/053039 WO2020128245A1 (en) 2018-12-20 2019-12-12 Method for manufacturing a device comprising a membrane extending over a cavity

Publications (1)

Publication Number Publication Date
SG11202106419XA true SG11202106419XA (en) 2021-07-29

Family

ID=66676725

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106419XA SG11202106419XA (en) 2018-12-20 2019-12-12 Method of fabricating a device comprising a membrane overhanging a cavity

Country Status (9)

Country Link
US (1) US11939214B2 (en)
EP (1) EP3898503A1 (en)
JP (1) JP7368057B2 (en)
KR (1) KR20210104823A (en)
CN (1) CN113226978A (en)
FR (1) FR3090615B1 (en)
SG (1) SG11202106419XA (en)
TW (1) TWI800699B (en)
WO (1) WO2020128245A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3111628B1 (en) 2020-06-18 2022-06-17 Commissariat Energie Atomique Method for manufacturing a microelectronic device comprising a membrane suspended above a cavity
FR3138657A1 (en) 2022-08-08 2024-02-09 Airmems Multi-deformation MEMS switch and switch comprising one or more MEMS switches

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4214567B2 (en) * 1997-08-05 2009-01-28 株式会社デンソー Manufacturing method of semiconductor substrate for pressure sensor
JP3435665B2 (en) * 2000-06-23 2003-08-11 株式会社村田製作所 Composite sensor element and method of manufacturing the same
JP3782095B2 (en) 2002-06-24 2006-06-07 松下電器産業株式会社 Infrared sensor manufacturing method
DE102004027501A1 (en) * 2004-06-04 2005-12-22 Robert Bosch Gmbh Micromechanical device with several caverns and manufacturing process
JP5497746B2 (en) * 2009-04-17 2014-05-21 株式会社日立製作所 Inertial sensor and manufacturing method thereof
JP5732203B2 (en) * 2010-05-21 2015-06-10 日立オートモティブシステムズ株式会社 Manufacturing method of composite sensor
JP5751332B2 (en) 2011-08-25 2015-07-22 株式会社ニコン Spatial light modulation element manufacturing method, spatial light modulation element, spatial light modulator, and exposure apparatus
WO2014142841A1 (en) 2013-03-13 2014-09-18 Illumina, Inc. Multilayer fluidic devices and methods for their fabrication
JP2017106857A (en) * 2015-12-11 2017-06-15 ローム株式会社 Semiconductor gas sensor, manufacturing method therefor, and sensor network system
DE102016113347A1 (en) * 2016-07-20 2018-01-25 Infineon Technologies Ag METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
KR102656824B1 (en) * 2016-12-22 2024-04-11 일루미나, 인코포레이티드 Flow cell package and method of manufacturing the same

Also Published As

Publication number Publication date
US11939214B2 (en) 2024-03-26
TW202029289A (en) 2020-08-01
JP7368057B2 (en) 2023-10-24
TWI800699B (en) 2023-05-01
US20210387853A1 (en) 2021-12-16
FR3090615A1 (en) 2020-06-26
CN113226978A (en) 2021-08-06
JP2022513753A (en) 2022-02-09
FR3090615B1 (en) 2020-12-11
EP3898503A1 (en) 2021-10-27
WO2020128245A1 (en) 2020-06-25
KR20210104823A (en) 2021-08-25

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