SG11202103710UA - Transducer, device and method for monitoring integrity of an adhesive bond - Google Patents

Transducer, device and method for monitoring integrity of an adhesive bond

Info

Publication number
SG11202103710UA
SG11202103710UA SG11202103710UA SG11202103710UA SG11202103710UA SG 11202103710U A SG11202103710U A SG 11202103710UA SG 11202103710U A SG11202103710U A SG 11202103710UA SG 11202103710U A SG11202103710U A SG 11202103710UA SG 11202103710U A SG11202103710U A SG 11202103710UA
Authority
SG
Singapore
Prior art keywords
transducer
adhesive bond
monitoring integrity
integrity
monitoring
Prior art date
Application number
SG11202103710UA
Inventor
Zheng Zheng Wong
Kui Yao
Shuting Chen
Lei Zhang
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Publication of SG11202103710UA publication Critical patent/SG11202103710UA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/11—Analysing solids by measuring attenuation of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0235—Plastics; polymers; soft materials, e.g. rubber
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0237—Thin materials, e.g. paper, membranes, thin films
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/267—Welds
SG11202103710UA 2018-10-26 2019-10-25 Transducer, device and method for monitoring integrity of an adhesive bond SG11202103710UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG10201809486R 2018-10-26
PCT/SG2019/050526 WO2020086003A1 (en) 2018-10-26 2019-10-25 Transducer, device and method for monitoring integrity of an adhesive bond

Publications (1)

Publication Number Publication Date
SG11202103710UA true SG11202103710UA (en) 2021-05-28

Family

ID=70332738

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202103710UA SG11202103710UA (en) 2018-10-26 2019-10-25 Transducer, device and method for monitoring integrity of an adhesive bond

Country Status (3)

Country Link
US (1) US20210341427A1 (en)
SG (1) SG11202103710UA (en)
WO (1) WO2020086003A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023250405A2 (en) * 2022-06-23 2023-12-28 University Of Washington Bonding of structures using high intensity focused ultrasound (hifu)
CN116774425A (en) * 2023-05-24 2023-09-19 上海大学 Adjustable super-surface light beam deflection device, application method and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2583579B1 (en) * 1985-06-14 1987-08-07 Thomson Csf PROCESS FOR OBTAINING A PIEZOELECTRIC MATERIAL AND IMPLEMENTING DEVICE
US6051327A (en) * 1997-12-17 2000-04-18 Aluminum Company Of America Non-corrosive metal laminated on aluminum
DE19805584C2 (en) * 1998-02-12 2000-04-13 Daimler Chrysler Ag System and method for material verification of materials, as well as material and method for its production
KR100755908B1 (en) * 2004-11-23 2007-09-06 한국과학기술원 Nondestructive reliability monitoring method for adhesively bonded structures whose sensitivity is improved by using piezoelectric or conductive materials
JP2011081892A (en) * 2009-07-31 2011-04-21 Sanyo Electric Co Ltd Mounting structure of optical member, pickup apparatus with the same, and disk apparatus
US9267906B2 (en) * 2011-04-12 2016-02-23 The Boeing Company Bondline embedded current sensor
US20160133826A1 (en) * 2014-11-06 2016-05-12 Agency For Science, Technology & Research Method of making lead-free ceramic coating
EP3391040A1 (en) * 2015-12-18 2018-10-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method and device for determining quality of a bond
CN107807175B (en) * 2017-10-12 2019-04-23 南京航空航天大学 A kind of improved frequency dispersion ultrasonic guided wave signals domain transform method

Also Published As

Publication number Publication date
US20210341427A1 (en) 2021-11-04
WO2020086003A1 (en) 2020-04-30

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