SG11202010737UA - Use of compositions comprising a solvent mixture for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below - Google Patents

Use of compositions comprising a solvent mixture for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below

Info

Publication number
SG11202010737UA
SG11202010737UA SG11202010737UA SG11202010737UA SG11202010737UA SG 11202010737U A SG11202010737U A SG 11202010737UA SG 11202010737U A SG11202010737U A SG 11202010737UA SG 11202010737U A SG11202010737U A SG 11202010737UA SG 11202010737U A SG11202010737U A SG 11202010737UA
Authority
SG
Singapore
Prior art keywords
compositions
line
solvent mixture
pattern collapse
space dimensions
Prior art date
Application number
SG11202010737UA
Inventor
Marcel Brill
Daniel Loeffler
Yeni Burk
Frank Pirrung
Lothar Engelbrecht
Szilard Csihony
Maike Bergeler
Volodymyr Boyko
Patrick Wilke
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG11202010737UA publication Critical patent/SG11202010737UA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5022Organic solvents containing oxygen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2003Alcohols; Phenols
    • C11D3/2006Monohydric alcohols
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2003Alcohols; Phenols
    • C11D3/2006Monohydric alcohols
    • C11D3/201Monohydric alcohols linear
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2093Esters; Carbonates
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/261Alcohols; Phenols
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/266Esters or carbonates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11202010737UA 2018-05-25 2019-05-13 Use of compositions comprising a solvent mixture for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below SG11202010737UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18174211 2018-05-25
PCT/EP2019/062178 WO2019224032A1 (en) 2018-05-25 2019-05-13 Use of compositions comprising a solvent mixture for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below

Publications (1)

Publication Number Publication Date
SG11202010737UA true SG11202010737UA (en) 2020-12-30

Family

ID=62386071

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202010737UA SG11202010737UA (en) 2018-05-25 2019-05-13 Use of compositions comprising a solvent mixture for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below

Country Status (9)

Country Link
US (1) US20210198602A1 (en)
EP (1) EP3802768A1 (en)
JP (2) JP2021525388A (en)
KR (1) KR20210015801A (en)
CN (1) CN112135899B (en)
IL (1) IL278848A (en)
SG (1) SG11202010737UA (en)
TW (1) TWI834671B (en)
WO (1) WO2019224032A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10284860B1 (en) 2018-07-02 2019-05-07 Tencent America LLC Method and apparatus for video coding
US10284844B1 (en) * 2018-07-02 2019-05-07 Tencent America LLC Method and apparatus for video coding
EP4158678A1 (en) 2020-05-27 2023-04-05 Basf Se Use of a composition consisting of ammonia and an alkanol for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below

Family Cites Families (24)

* Cited by examiner, † Cited by third party
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JP3978255B2 (en) * 1997-06-24 2007-09-19 Azエレクトロニックマテリアルズ株式会社 Lithographic cleaning agent
KR100594815B1 (en) * 1999-12-24 2006-07-03 삼성전자주식회사 thinner for rinsing photoresist and method of treating photoresist layer
JP4045180B2 (en) * 2002-12-03 2008-02-13 Azエレクトロニックマテリアルズ株式会社 Rinsing liquid for lithography and resist pattern forming method using the same
KR20070058560A (en) * 2004-09-01 2007-06-08 토쿄오오카코교 가부시기가이샤 Rinsing liquid for lithography and method for resist pattern formation
US20080299487A1 (en) 2007-05-31 2008-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography material and lithography process
JP5537859B2 (en) * 2009-07-31 2014-07-02 富士フイルム株式会社 Treatment liquid for pattern formation by chemically amplified resist composition and resist pattern formation method using the same
RS52204B (en) * 2009-10-09 2012-10-31 Flexoclean Engineering B.V. A polymer washout solvent and the use thereof for developing a flexographic printing plate
JP5422497B2 (en) * 2010-06-23 2014-02-19 株式会社東芝 Substrate drying method
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MY161218A (en) * 2011-01-25 2017-04-14 Basf Se Use of surfactants having at least three short-chain perfluorinated groups rf for manufacturing integrated circuits having patterns with line-space dimensions below 50nm
JP2012181523A (en) * 2011-02-28 2012-09-20 Rohm & Haas Electronic Materials Llc Developer composition and method of forming photolithographic pattern
JP6027779B2 (en) * 2012-06-11 2016-11-16 メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 Lithographic development or rinsing solution and pattern forming method using the same
WO2013192534A1 (en) * 2012-06-22 2013-12-27 Avantor Performance Materials, Inc. Rinsing solution to prevent tin pattern collapse
CN104871289B (en) * 2012-12-14 2017-10-10 巴斯夫欧洲公司 Composition comprising surfactant and hydrophobizers avoids the purposes of pattern collapse when handling the patterning materials that line spacing dimensions are 50nm or lower
KR102153113B1 (en) * 2013-10-21 2020-09-08 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. Cleaning formulations for removing residues on surfaces
JP6371057B2 (en) * 2013-12-27 2018-08-08 東京応化工業株式会社 Pattern formation method
CN104049476B (en) * 2014-05-30 2017-11-14 青岛华仁技术孵化器有限公司 Light carving rubber stripper
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KR101617169B1 (en) * 2015-07-17 2016-05-03 영창케미칼 주식회사 Cleaning composition for photolithography and method for forming photoresist pattern using the same
WO2017057255A1 (en) * 2015-09-30 2017-04-06 富士フイルム株式会社 Polarizing plate protective film, method for manufacturing same, polarizing plate, and image display device
US10162265B2 (en) * 2015-12-09 2018-12-25 Rohm And Haas Electronic Materials Llc Pattern treatment methods
JP2017138514A (en) * 2016-02-04 2017-08-10 アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ Composition for surface treatment and surface treatment method of resist pattern using the same
KR20200084045A (en) * 2017-11-28 2020-07-09 바스프 에스이 Compositions comprising primary and secondary surfactants for cleaning or rinsing the product
KR20210154971A (en) * 2019-04-16 2021-12-21 바스프 에스이 Compositions that avoid pattern collapse upon processing of patterned materials having line-spacing dimensions of 50 nm or less comprising boron type additives

Also Published As

Publication number Publication date
CN112135899A (en) 2020-12-25
EP3802768A1 (en) 2021-04-14
WO2019224032A1 (en) 2019-11-28
TWI834671B (en) 2024-03-11
TW202003826A (en) 2020-01-16
US20210198602A1 (en) 2021-07-01
JP2024079733A (en) 2024-06-11
JP2021525388A (en) 2021-09-24
KR20210015801A (en) 2021-02-10
IL278848A (en) 2021-01-31
WO2019224032A8 (en) 2020-12-03
CN112135899B (en) 2022-10-25

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