SG11202010210VA - Universal adjustable blocker plate for flow distribution tuning - Google Patents
Universal adjustable blocker plate for flow distribution tuningInfo
- Publication number
- SG11202010210VA SG11202010210VA SG11202010210VA SG11202010210VA SG11202010210VA SG 11202010210V A SG11202010210V A SG 11202010210VA SG 11202010210V A SG11202010210V A SG 11202010210VA SG 11202010210V A SG11202010210V A SG 11202010210VA SG 11202010210V A SG11202010210V A SG 11202010210VA
- Authority
- SG
- Singapore
- Prior art keywords
- flow distribution
- blocker plate
- universal adjustable
- adjustable blocker
- distribution tuning
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Signal Processing For Digital Recording And Reproducing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN201841016760 | 2018-05-03 | ||
PCT/US2019/025481 WO2019212676A1 (en) | 2018-05-03 | 2019-04-03 | Universal adjustable blocker plate for flow distribution tuning |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202010210VA true SG11202010210VA (en) | 2020-11-27 |
Family
ID=68386142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202010210VA SG11202010210VA (en) | 2018-05-03 | 2019-04-03 | Universal adjustable blocker plate for flow distribution tuning |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210159094A1 (en) |
JP (1) | JP2021522687A (en) |
KR (1) | KR20200139841A (en) |
CN (1) | CN112074938A (en) |
SG (1) | SG11202010210VA (en) |
TW (2) | TWM644385U (en) |
WO (1) | WO2019212676A1 (en) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2610556C2 (en) * | 1976-03-12 | 1978-02-02 | Siemens AG, 1000 Berlin und 8000 München | Device for distributing flowing media over a flow cross-section |
JPH01283391A (en) * | 1988-05-09 | 1989-11-14 | Tokyo Electron Ltd | Etching device |
JP2565285B2 (en) * | 1993-06-15 | 1996-12-18 | 日本電気株式会社 | Semiconductor device manufacturing equipment |
JP2001053065A (en) * | 1999-08-13 | 2001-02-23 | Nec Kyushu Ltd | Plasma processing apparatus |
US6537420B2 (en) * | 1999-12-17 | 2003-03-25 | Texas Instruments Incorporated | Method and apparatus for restricting process fluid flow within a showerhead assembly |
WO2001075188A2 (en) * | 2000-03-30 | 2001-10-11 | Tokyo Electron Limited | Method of and apparatus for gas injection |
KR100400044B1 (en) * | 2001-07-16 | 2003-09-29 | 삼성전자주식회사 | Shower head of wafer treatment apparatus having gap controller |
US7524532B2 (en) * | 2002-04-22 | 2009-04-28 | Aixtron Ag | Process for depositing thin layers on a substrate in a process chamber of adjustable height |
KR100614801B1 (en) * | 2004-07-05 | 2006-08-22 | 삼성전자주식회사 | Method for forming a layer in a semiconductor device |
WO2010051233A2 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Adjustable gas distribution apparatus |
KR101924488B1 (en) * | 2010-05-12 | 2018-12-03 | 어플라이드 머티어리얼스, 인코포레이티드 | Confined process volume pecvd chamber |
US8721791B2 (en) * | 2010-07-28 | 2014-05-13 | Applied Materials, Inc. | Showerhead support structure for improved gas flow |
KR101435100B1 (en) * | 2012-06-20 | 2014-08-29 | 주식회사 엠티에스나노테크 | Atomic layer deposition apparatus |
KR102102787B1 (en) * | 2013-12-17 | 2020-04-22 | 삼성전자주식회사 | Substrate treating apparatus and blocker plate assembly |
US9657845B2 (en) * | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
CN109219863B (en) * | 2016-06-03 | 2021-02-09 | 应用材料公司 | Substrate distance monitoring |
US10640865B2 (en) * | 2016-09-09 | 2020-05-05 | Samsung Electronics Co., Ltd. | Substrate processing apparatus and method for manufacturing semiconductor device using the same |
-
2019
- 2019-04-03 SG SG11202010210VA patent/SG11202010210VA/en unknown
- 2019-04-03 WO PCT/US2019/025481 patent/WO2019212676A1/en active Application Filing
- 2019-04-03 CN CN201980029240.5A patent/CN112074938A/en active Pending
- 2019-04-03 KR KR1020207034626A patent/KR20200139841A/en not_active Application Discontinuation
- 2019-04-03 JP JP2020560481A patent/JP2021522687A/en active Pending
- 2019-04-03 US US17/046,916 patent/US20210159094A1/en active Pending
- 2019-04-10 TW TW111214268U patent/TWM644385U/en unknown
- 2019-04-10 TW TW108112425A patent/TW201947676A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201947676A (en) | 2019-12-16 |
US20210159094A1 (en) | 2021-05-27 |
JP2021522687A (en) | 2021-08-30 |
TWM644385U (en) | 2023-08-01 |
KR20200139841A (en) | 2020-12-14 |
WO2019212676A1 (en) | 2019-11-07 |
CN112074938A (en) | 2020-12-11 |
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