SG11202009074UA - C-containing sputtering target and method for producing same - Google Patents
C-containing sputtering target and method for producing sameInfo
- Publication number
- SG11202009074UA SG11202009074UA SG11202009074UA SG11202009074UA SG11202009074UA SG 11202009074U A SG11202009074U A SG 11202009074UA SG 11202009074U A SG11202009074U A SG 11202009074UA SG 11202009074U A SG11202009074U A SG 11202009074UA SG 11202009074U A SG11202009074U A SG 11202009074UA
- Authority
- SG
- Singapore
- Prior art keywords
- sputtering target
- producing same
- containing sputtering
- producing
- same
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0433—Nickel- or cobalt-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0466—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C33/00—Making ferrous alloys
- C22C33/02—Making ferrous alloys by powder metallurgy
- C22C33/0257—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
- C22C33/0278—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5%
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018086305A JP6878349B2 (en) | 2018-04-27 | 2018-04-27 | C-containing sputtering target and its manufacturing method |
PCT/JP2019/016922 WO2019208463A1 (en) | 2018-04-27 | 2019-04-22 | C-containing sputtering target and method for producing same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202009074UA true SG11202009074UA (en) | 2020-11-27 |
Family
ID=68295119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202009074UA SG11202009074UA (en) | 2018-04-27 | 2019-04-22 | C-containing sputtering target and method for producing same |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210040602A1 (en) |
JP (1) | JP6878349B2 (en) |
CN (1) | CN112004957A (en) |
SG (1) | SG11202009074UA (en) |
TW (1) | TWI691605B (en) |
WO (1) | WO2019208463A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7462511B2 (en) * | 2020-08-12 | 2024-04-05 | 田中貴金属工業株式会社 | Fe-Pt-BN sputtering target and manufacturing method thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000282229A (en) * | 1999-03-29 | 2000-10-10 | Hitachi Metals Ltd | CoPt SPUTTERING TARGET, ITS PRODUCTION, MAGNETIC RECORDING FILM AND CoPt MAGNETIC RECORDING MEDIUM |
JP2011175725A (en) * | 2010-01-26 | 2011-09-08 | Mitsubishi Materials Corp | Sputtering target for forming magnetic recording medium film and method for manufacturing the same |
JP5590322B2 (en) * | 2010-11-12 | 2014-09-17 | 三菱マテリアル株式会社 | Sputtering target for forming a magnetic recording medium film and method for producing the same |
JP6037206B2 (en) * | 2011-07-05 | 2016-12-07 | 三菱マテリアル株式会社 | Sputtering target for forming a magnetic recording medium film and method for producing the same |
JP2014034730A (en) * | 2012-08-10 | 2014-02-24 | Mitsui Mining & Smelting Co Ltd | Sintered body and sputtering target |
JP5965539B2 (en) * | 2013-03-01 | 2016-08-10 | 田中貴金属工業株式会社 | FePt-C sputtering target |
JP6366095B2 (en) * | 2014-07-29 | 2018-08-01 | 株式会社フルヤ金属 | Sputtering target for magnetic recording media |
WO2016047578A1 (en) * | 2014-09-26 | 2016-03-31 | Jx金属株式会社 | Sputtering target for magnetic recording film formation and production method therefor |
-
2018
- 2018-04-27 JP JP2018086305A patent/JP6878349B2/en active Active
-
2019
- 2019-04-22 SG SG11202009074UA patent/SG11202009074UA/en unknown
- 2019-04-22 US US17/044,687 patent/US20210040602A1/en not_active Abandoned
- 2019-04-22 CN CN201980027092.3A patent/CN112004957A/en active Pending
- 2019-04-22 WO PCT/JP2019/016922 patent/WO2019208463A1/en active Application Filing
- 2019-04-25 TW TW108114468A patent/TWI691605B/en active
Also Published As
Publication number | Publication date |
---|---|
JP6878349B2 (en) | 2021-05-26 |
JP2019189923A (en) | 2019-10-31 |
US20210040602A1 (en) | 2021-02-11 |
WO2019208463A1 (en) | 2019-10-31 |
TW201945551A (en) | 2019-12-01 |
TWI691605B (en) | 2020-04-21 |
CN112004957A (en) | 2020-11-27 |
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