SG11202007833XA - Techniques for die tiling - Google Patents
Techniques for die tilingInfo
- Publication number
- SG11202007833XA SG11202007833XA SG11202007833XA SG11202007833XA SG11202007833XA SG 11202007833X A SG11202007833X A SG 11202007833XA SG 11202007833X A SG11202007833X A SG 11202007833XA SG 11202007833X A SG11202007833X A SG 11202007833XA SG 11202007833X A SG11202007833X A SG 11202007833XA
- Authority
- SG
- Singapore
- Prior art keywords
- techniques
- tiling
- die
- die tiling
- Prior art date
Links
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US20220230991A1 (en) * | 2021-01-21 | 2022-07-21 | Monolithic Power Systems, Inc. | Multi-die package structure and multi-die co-packing method |
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KR102509048B1 (en) * | 2016-04-26 | 2023-03-10 | 에스케이하이닉스 주식회사 | Semiconductor package |
US9935080B2 (en) * | 2016-04-29 | 2018-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three-layer Package-on-Package structure and method forming same |
US10586909B2 (en) * | 2016-10-11 | 2020-03-10 | Massachusetts Institute Of Technology | Cryogenic electronic packages and assemblies |
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2018
- 2018-04-10 US US15/949,141 patent/US20190312019A1/en active Pending
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2019
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DE112019001905T5 (en) | 2020-12-24 |
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US20190312019A1 (en) | 2019-10-10 |
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TWI799280B (en) | 2023-04-11 |
CN111557045A (en) | 2020-08-18 |
TWI797260B (en) | 2023-04-01 |
KR20220061277A (en) | 2022-05-12 |
CN113990853A (en) | 2022-01-28 |
TWI802948B (en) | 2023-05-21 |
KR102662164B1 (en) | 2024-05-13 |
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