SG11202007285UA - Perpendicular inductors integrated in a substrate - Google Patents
Perpendicular inductors integrated in a substrateInfo
- Publication number
- SG11202007285UA SG11202007285UA SG11202007285UA SG11202007285UA SG11202007285UA SG 11202007285U A SG11202007285U A SG 11202007285UA SG 11202007285U A SG11202007285U A SG 11202007285UA SG 11202007285U A SG11202007285U A SG 11202007285UA SG 11202007285U A SG11202007285U A SG 11202007285UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- inductors integrated
- perpendicular inductors
- integrated
- inductors
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862629345P | 2018-02-12 | 2018-02-12 | |
US16/254,735 US11011461B2 (en) | 2018-02-12 | 2019-01-23 | Perpendicular inductors integrated in a substrate |
PCT/US2019/016483 WO2019156922A2 (en) | 2018-02-12 | 2019-02-04 | Perpendicular inductors integrated in a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202007285UA true SG11202007285UA (en) | 2020-08-28 |
Family
ID=67541111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202007285UA SG11202007285UA (en) | 2018-02-12 | 2019-02-04 | Perpendicular inductors integrated in a substrate |
Country Status (5)
Country | Link |
---|---|
US (1) | US11011461B2 (en) |
EP (1) | EP3753031A2 (en) |
CN (1) | CN111699536B (en) |
SG (1) | SG11202007285UA (en) |
WO (1) | WO2019156922A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021097129A (en) * | 2019-12-17 | 2021-06-24 | イビデン株式会社 | Inductor built-in substrate |
US20230082743A1 (en) * | 2021-09-13 | 2023-03-16 | RF360 Europe GmbH | Integrated passive devices |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6420773B1 (en) * | 2000-10-04 | 2002-07-16 | Winbond Electronics Corp. | Multi-level spiral inductor structure having high inductance (L) and high quality factor (Q) |
KR100368930B1 (en) | 2001-03-29 | 2003-01-24 | 한국과학기술원 | Three-Dimensional Metal Devices Highly Suspended above Semiconductor Substrate, Their Circuit Model, and Method for Manufacturing the Same |
US6927664B2 (en) * | 2003-05-16 | 2005-08-09 | Matsushita Electric Industrial Co., Ltd. | Mutual induction circuit |
US8058960B2 (en) * | 2007-03-27 | 2011-11-15 | Alpha And Omega Semiconductor Incorporated | Chip scale power converter package having an inductor substrate |
US7733207B2 (en) | 2007-05-31 | 2010-06-08 | Electronics And Telecommunications Research Institute | Vertically formed inductor and electronic device having the same |
US9508480B2 (en) * | 2011-08-31 | 2016-11-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Vertical slow-wave symmetric inductor structure for semiconductor devices |
US9431473B2 (en) | 2012-11-21 | 2016-08-30 | Qualcomm Incorporated | Hybrid transformer structure on semiconductor devices |
US9806144B2 (en) * | 2013-11-13 | 2017-10-31 | Qualcomm Incorporated | Solenoid inductor in a substrate |
US9275786B2 (en) * | 2014-07-18 | 2016-03-01 | Qualcomm Incorporated | Superposed structure 3D orthogonal through substrate inductor |
US9711272B2 (en) | 2015-07-09 | 2017-07-18 | Te Connectivity Corporation | Printed circuit for wireless power transfer |
-
2019
- 2019-01-23 US US16/254,735 patent/US11011461B2/en active Active
- 2019-02-04 WO PCT/US2019/016483 patent/WO2019156922A2/en unknown
- 2019-02-04 CN CN201980012637.3A patent/CN111699536B/en active Active
- 2019-02-04 EP EP19721876.1A patent/EP3753031A2/en active Pending
- 2019-02-04 SG SG11202007285UA patent/SG11202007285UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201941231A (en) | 2019-10-16 |
EP3753031A2 (en) | 2020-12-23 |
CN111699536B (en) | 2023-07-18 |
CN111699536A (en) | 2020-09-22 |
US20190252316A1 (en) | 2019-08-15 |
US11011461B2 (en) | 2021-05-18 |
WO2019156922A3 (en) | 2019-09-19 |
WO2019156922A2 (en) | 2019-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ZA202100439B (en) | Clove-containing aerosol-generating substrate | |
GB202104912D0 (en) | A transporting device | |
TWI563633B (en) | Integrated circuit and method for manufacturing the same | |
EP3238250A4 (en) | Integrated passive components in a stacked integrated circuit package | |
GB201707426D0 (en) | A Substrate | |
CA193330S (en) | Package with surface ornamentation | |
GB202317937D0 (en) | Compound distribution in microfluidic devices | |
IL285779B1 (en) | Electronic grinder | |
SI3192910T1 (en) | Method for manufacturing a laminate and laminate | |
GB2608902B (en) | Multilayer piezolelectric substrate | |
SG11202002830TA (en) | A strain-balanced semiconductor structure | |
ZA201806115B (en) | A circuit layer for an integrated circuit card | |
SG11202007285UA (en) | Perpendicular inductors integrated in a substrate | |
PT3483359T (en) | Auxiliary device for placing elements in the form of a plate | |
GB201717934D0 (en) | Structure for protecting a substrate | |
SG10201900158PA (en) | Manufacturing facility | |
KR102367120B9 (en) | A surface enhanced transparent substrate and method for manufacturing thereof | |
PL3768654T3 (en) | Copper-ceramic substrate | |
PL3192765T3 (en) | Load clamp for engagement in a hole in the load | |
KR102264468B9 (en) | SERS Durable SERS substrate and a method for manufacturing the same | |
GB202016477D0 (en) | Printable coating in a substrate | |
GB2576497B (en) | A semiconductor structure | |
GB201814663D0 (en) | Improvements in manufacturing | |
GB201916745D0 (en) | Device fabrication techniques | |
EP3803969A4 (en) | Magnetic structures in integrated circuit packages |