SG11202003988TA - Power over data line (podl) board design method to improve data channel performance - Google Patents
Power over data line (podl) board design method to improve data channel performanceInfo
- Publication number
- SG11202003988TA SG11202003988TA SG11202003988TA SG11202003988TA SG11202003988TA SG 11202003988T A SG11202003988T A SG 11202003988TA SG 11202003988T A SG11202003988T A SG 11202003988TA SG 11202003988T A SG11202003988T A SG 11202003988TA SG 11202003988T A SG11202003988T A SG 11202003988TA
- Authority
- SG
- Singapore
- Prior art keywords
- podl
- design method
- power over
- board design
- channel performance
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/38—Transmitter circuitry for the transmission of television signals according to analogue transmission standards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/02—Details
- H04L12/10—Current supply arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/003—Transmission of data between radar, sonar or lidar systems and remote stations
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J4/00—Circuit arrangements for mains or distribution networks not specified as ac or dc
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/54—Systems for transmission via power distribution lines
- H04B3/548—Systems for transmission via power distribution lines the power on the line being DC
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/54—Systems for transmission via power distribution lines
- H04B3/56—Circuits for coupling, blocking, or by-passing of signals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/86—Combinations of lidar systems with systems other than lidar, radar or sonar, e.g. with direction finders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/93—Lidar systems specially adapted for specific applications for anti-collision purposes
- G01S17/931—Lidar systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L5/00—Arrangements affording multiple use of the transmission path
- H04L5/14—Two-way operation using the same type of signal, i.e. duplex
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Traffic Control Systems (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/817,976 US10447959B2 (en) | 2017-11-20 | 2017-11-20 | Power over data line (PODL) board design method to improve data channel performance |
PCT/US2018/061535 WO2019099839A1 (en) | 2017-11-20 | 2018-11-16 | Power over data line (podl) board design method to improve data channel performance |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202003988TA true SG11202003988TA (en) | 2020-06-29 |
Family
ID=66532672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202003988TA SG11202003988TA (en) | 2017-11-20 | 2018-11-16 | Power over data line (podl) board design method to improve data channel performance |
Country Status (9)
Country | Link |
---|---|
US (2) | US10447959B2 (en) |
EP (1) | EP3714574A4 (en) |
JP (2) | JP6823228B1 (en) |
KR (2) | KR102527804B1 (en) |
CN (2) | CN111373695B (en) |
AU (2) | AU2018368732B2 (en) |
CA (1) | CA3082800A1 (en) |
SG (1) | SG11202003988TA (en) |
WO (1) | WO2019099839A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10447959B2 (en) | 2017-11-20 | 2019-10-15 | Waymo Llc | Power over data line (PODL) board design method to improve data channel performance |
JP2022179027A (en) * | 2021-05-21 | 2022-12-02 | 日立Astemo株式会社 | Differential transmission substrate and electric power superposition differential data communication device |
Family Cites Families (33)
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US5818127A (en) * | 1989-04-28 | 1998-10-06 | Videocom, Inc. | Transmission of FM video signals over various lines |
JP3893828B2 (en) | 2000-01-14 | 2007-03-14 | 三菱電機株式会社 | Impedance adjustment circuit |
JP3539391B2 (en) | 2001-03-15 | 2004-07-07 | 株式会社村田製作所 | High-frequency amplifier, high-frequency module, and communication device |
CN100468417C (en) * | 2003-06-16 | 2009-03-11 | 日本电气株式会社 | Printed circuit wiring board designing support device, printed circuit board designing method, and its program |
US20050195583A1 (en) * | 2004-03-03 | 2005-09-08 | Hubbell Incorporated. | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection |
TWI273871B (en) * | 2004-10-04 | 2007-02-11 | Via Tech Inc | Signal transmission structure |
JP4499598B2 (en) | 2005-03-31 | 2010-07-07 | 矢崎総業株式会社 | Power superimposed multiplex communication system |
US7385459B2 (en) | 2005-09-08 | 2008-06-10 | Northrop Grumman Corporation | Broadband DC block impedance matching network |
US7459985B2 (en) * | 2005-12-29 | 2008-12-02 | Intel Corporation | Connector having a cut-out for reduced crosstalk between differential conductors |
SG169241A1 (en) * | 2009-08-12 | 2011-03-30 | Sony Corp | An integrated circuit |
CN102402496B (en) * | 2010-09-17 | 2015-07-01 | 光宝电子(广州)有限公司 | Communication circuit and adapter with same |
DE102010042720A1 (en) * | 2010-10-20 | 2012-04-26 | Bayerische Motoren Werke Aktiengesellschaft | Electric device for a powerline system for data transmission and powerline system for data transmission |
US8552811B2 (en) * | 2011-01-27 | 2013-10-08 | National Taiwan University | Electromagnetic noise suppression circuit |
FR2981806B1 (en) * | 2011-10-19 | 2015-03-13 | Nexans | LOW VOLTAGE CONTINUOUS POWER SUPPLY FOR COMMUNICATION ELECTRONIC DEVICES |
WO2013173135A1 (en) * | 2012-05-14 | 2013-11-21 | Microsemi Corporation | Power over ethernet for bi-directional ethernet over single pair |
US20150222125A1 (en) | 2012-06-21 | 2015-08-06 | Molex Incorporated | Connector with load circuit |
US8806415B1 (en) * | 2013-02-15 | 2014-08-12 | International Business Machines Corporation | Integrated circuit pad modeling |
US9209981B2 (en) * | 2013-06-18 | 2015-12-08 | Linear Technology Corporation | Power over Ethernet on data pairs and spare pairs |
US9859951B2 (en) * | 2013-11-26 | 2018-01-02 | Linear Technology Corporation | Power over data lines detection and classification scheme |
US9780974B2 (en) | 2014-04-09 | 2017-10-03 | Linear Technology Corporation | Broadband power coupling/decoupling network for PoDL |
US9853838B2 (en) * | 2014-05-15 | 2017-12-26 | Linear Technology Corporation | PoDL system with active dV/dt and dI/dt control |
JP2016016815A (en) | 2014-07-10 | 2016-02-01 | 三菱自動車工業株式会社 | Liquid supply device with remaining capacity notification function |
US9851772B2 (en) | 2014-08-22 | 2017-12-26 | Linear Technology Corporation | 1-wire bus PD detection and classification scheme for ethernet PoDL |
US9967104B2 (en) * | 2014-11-19 | 2018-05-08 | Linear Technology Corporation | Detecting ground isolation fault in ethernet PoDL system |
US10135626B2 (en) | 2015-04-14 | 2018-11-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Power coupling circuits for single-pair ethernet with automotive applications |
WO2017053787A1 (en) | 2015-09-26 | 2017-03-30 | Yundt George B | System and method for improved dc power line communication |
CN105680816A (en) | 2015-12-31 | 2016-06-15 | 富士康(昆山)电脑接插件有限公司 | Network signal filtering circuit |
KR102525573B1 (en) | 2016-03-17 | 2023-04-24 | 현대자동차주식회사 | Power control method for power over data lines system |
EP3433697B1 (en) | 2016-03-25 | 2023-04-26 | Hewlett-Packard Development Company, L.P. | Data transfer via a data and power connection |
US10313139B2 (en) | 2016-04-20 | 2019-06-04 | Linear Technology Corporation | Power over data lines system with redundant power connections |
US10560154B2 (en) * | 2016-07-11 | 2020-02-11 | Esker Technologies, LLC | Power line signal coupler |
US10643404B2 (en) * | 2017-04-26 | 2020-05-05 | Cisco Technology, Inc. | Interfacing a vehicle with a fog device during fueling |
US10447959B2 (en) | 2017-11-20 | 2019-10-15 | Waymo Llc | Power over data line (PODL) board design method to improve data channel performance |
-
2017
- 2017-11-20 US US15/817,976 patent/US10447959B2/en active Active
-
2018
- 2018-11-16 JP JP2020525922A patent/JP6823228B1/en active Active
- 2018-11-16 KR KR1020217020712A patent/KR102527804B1/en active IP Right Grant
- 2018-11-16 AU AU2018368732A patent/AU2018368732B2/en active Active
- 2018-11-16 SG SG11202003988TA patent/SG11202003988TA/en unknown
- 2018-11-16 WO PCT/US2018/061535 patent/WO2019099839A1/en unknown
- 2018-11-16 CA CA3082800A patent/CA3082800A1/en not_active Abandoned
- 2018-11-16 EP EP18877643.9A patent/EP3714574A4/en active Pending
- 2018-11-16 CN CN201880074832.4A patent/CN111373695B/en active Active
- 2018-11-16 CN CN202110447001.0A patent/CN113193969B/en active Active
- 2018-11-16 KR KR1020207013993A patent/KR102274609B1/en active IP Right Grant
-
2019
- 2019-09-04 US US16/559,886 patent/US11277581B2/en active Active
-
2020
- 2020-08-27 AU AU2020223713A patent/AU2020223713B2/en active Active
-
2021
- 2021-01-07 JP JP2021001263A patent/JP6982703B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
AU2020223713B2 (en) | 2021-08-12 |
JP6982703B2 (en) | 2021-12-17 |
EP3714574A1 (en) | 2020-09-30 |
KR102527804B1 (en) | 2023-05-03 |
KR20210087116A (en) | 2021-07-09 |
WO2019099839A1 (en) | 2019-05-23 |
CN111373695B (en) | 2021-05-18 |
US10447959B2 (en) | 2019-10-15 |
CA3082800A1 (en) | 2019-05-23 |
JP6823228B1 (en) | 2021-01-27 |
KR102274609B1 (en) | 2021-07-07 |
KR20200058573A (en) | 2020-05-27 |
CN111373695A (en) | 2020-07-03 |
AU2020223713A1 (en) | 2020-09-10 |
US20200014875A1 (en) | 2020-01-09 |
US11277581B2 (en) | 2022-03-15 |
JP2021057922A (en) | 2021-04-08 |
EP3714574A4 (en) | 2021-08-25 |
US20190158773A1 (en) | 2019-05-23 |
CN113193969A (en) | 2021-07-30 |
AU2018368732B2 (en) | 2020-06-18 |
CN113193969B (en) | 2023-06-13 |
JP2021503746A (en) | 2021-02-12 |
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