SG11202001374SA - Method for cleaning silicon wafer - Google Patents
Method for cleaning silicon waferInfo
- Publication number
- SG11202001374SA SG11202001374SA SG11202001374SA SG11202001374SA SG11202001374SA SG 11202001374S A SG11202001374S A SG 11202001374SA SG 11202001374S A SG11202001374S A SG 11202001374SA SG 11202001374S A SG11202001374S A SG 11202001374SA SG 11202001374S A SG11202001374S A SG 11202001374SA
- Authority
- SG
- Singapore
- Prior art keywords
- silicon wafer
- cleaning silicon
- cleaning
- wafer
- silicon
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
- H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017158174A JP6399173B1 (en) | 2017-08-18 | 2017-08-18 | Cleaning method of silicon wafer |
PCT/JP2018/028519 WO2019035345A1 (en) | 2017-08-18 | 2018-07-31 | Method for cleaning silicon wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001374SA true SG11202001374SA (en) | 2020-03-30 |
Family
ID=63708624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001374SA SG11202001374SA (en) | 2017-08-18 | 2018-07-31 | Method for cleaning silicon wafer |
Country Status (8)
Country | Link |
---|---|
US (1) | US11878329B2 (en) |
JP (1) | JP6399173B1 (en) |
KR (1) | KR20200038255A (en) |
CN (1) | CN111033696B (en) |
DE (1) | DE112018003722T5 (en) |
SG (1) | SG11202001374SA (en) |
TW (1) | TWI778110B (en) |
WO (1) | WO2019035345A1 (en) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3838823B2 (en) | 1999-08-23 | 2006-10-25 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
US20050271985A1 (en) | 2004-06-07 | 2005-12-08 | Dainippon Screen Mfg. Co., Ltd. | Method, apparatus and system for rinsing substrate with pH-adjusted rinse solution |
JP4484639B2 (en) | 2004-09-06 | 2010-06-16 | 大日本スクリーン製造株式会社 | Substrate processing method and substrate processing apparatus |
US20060011214A1 (en) * | 2004-07-09 | 2006-01-19 | Zhi Liu | System and method for pre-gate cleaning of substrates |
JP5317529B2 (en) | 2008-05-02 | 2013-10-16 | Sumco Techxiv株式会社 | Semiconductor wafer processing method and processing apparatus |
KR101806191B1 (en) | 2010-06-17 | 2017-12-07 | 도쿄엘렉트론가부시키가이샤 | Substrate processing method, storage medium storing computer program for executing substrate processing method and substrate processing apparatus |
JP5223886B2 (en) | 2010-06-18 | 2013-06-26 | 東京エレクトロン株式会社 | Liquid processing apparatus, liquid processing method, and storage medium |
JP5615650B2 (en) * | 2010-09-28 | 2014-10-29 | 大日本スクリーン製造株式会社 | Substrate processing method and substrate processing apparatus |
JP5533624B2 (en) * | 2010-12-16 | 2014-06-25 | 信越半導体株式会社 | Semiconductor wafer cleaning method |
JP5852871B2 (en) * | 2011-12-12 | 2016-02-03 | 株式会社Screenホールディングス | Substrate processing method and substrate processing apparatus |
-
2017
- 2017-08-18 JP JP2017158174A patent/JP6399173B1/en active Active
-
2018
- 2018-07-31 US US16/637,012 patent/US11878329B2/en active Active
- 2018-07-31 SG SG11202001374SA patent/SG11202001374SA/en unknown
- 2018-07-31 DE DE112018003722.3T patent/DE112018003722T5/en active Pending
- 2018-07-31 WO PCT/JP2018/028519 patent/WO2019035345A1/en active Application Filing
- 2018-07-31 CN CN201880052419.8A patent/CN111033696B/en active Active
- 2018-07-31 KR KR1020207004456A patent/KR20200038255A/en not_active Application Discontinuation
- 2018-08-07 TW TW107127330A patent/TWI778110B/en active
Also Published As
Publication number | Publication date |
---|---|
CN111033696A (en) | 2020-04-17 |
US20200164410A1 (en) | 2020-05-28 |
CN111033696B (en) | 2023-10-20 |
WO2019035345A1 (en) | 2019-02-21 |
JP2019036665A (en) | 2019-03-07 |
JP6399173B1 (en) | 2018-10-03 |
DE112018003722T5 (en) | 2020-04-09 |
TWI778110B (en) | 2022-09-21 |
KR20200038255A (en) | 2020-04-10 |
US11878329B2 (en) | 2024-01-23 |
TW201913804A (en) | 2019-04-01 |
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