SG11201810344RA - Coated electrical assembly - Google Patents

Coated electrical assembly

Info

Publication number
SG11201810344RA
SG11201810344RA SG11201810344RA SG11201810344RA SG11201810344RA SG 11201810344R A SG11201810344R A SG 11201810344RA SG 11201810344R A SG11201810344R A SG 11201810344RA SG 11201810344R A SG11201810344R A SG 11201810344RA SG 11201810344R A SG11201810344R A SG 11201810344RA
Authority
SG
Singapore
Prior art keywords
electrical assembly
coated electrical
coated
assembly
electrical
Prior art date
Application number
SG11201810344RA
Inventor
Shailendra Vikram Singh
Gianfranco Aresta
Andrew Simon Hall Brooks
Gareth Hennighan
Original Assignee
Semblant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semblant Ltd filed Critical Semblant Ltd
Publication of SG11201810344RA publication Critical patent/SG11201810344RA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1338—Chemical vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
SG11201810344RA 2016-01-22 2017-01-19 Coated electrical assembly SG11201810344RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB1601221.3A GB201601221D0 (en) 2016-01-22 2016-01-22 Coated electrical assembly
PCT/GB2017/050125 WO2017125741A1 (en) 2016-01-22 2017-01-19 Coated electrical assembly

Publications (1)

Publication Number Publication Date
SG11201810344RA true SG11201810344RA (en) 2018-12-28

Family

ID=55534792

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810344RA SG11201810344RA (en) 2016-01-22 2017-01-19 Coated electrical assembly

Country Status (12)

Country Link
US (1) US20190037705A1 (en)
EP (1) EP3406115A1 (en)
JP (1) JP7122967B2 (en)
KR (1) KR20180120678A (en)
CN (1) CN108781514A (en)
AU (1) AU2017209986A1 (en)
CA (1) CA3025043A1 (en)
GB (2) GB201601221D0 (en)
RU (1) RU2018130110A (en)
SG (1) SG11201810344RA (en)
TW (1) TW201739960A (en)
WO (1) WO2017125741A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109679490A (en) * 2017-10-18 2019-04-26 上海稷以科技有限公司 The method of protective layer and the product of surface formation matcoveredn are formed in body surface
CN109686672A (en) * 2017-10-18 2019-04-26 上海稷以科技有限公司 The method of protective layer and the product of surface formation matcoveredn are formed in body surface
CN109675770A (en) * 2017-10-18 2019-04-26 上海稷以科技有限公司 The method of protective layer and the product of surface formation matcoveredn are formed in body surface
CN109675776A (en) * 2017-10-18 2019-04-26 上海稷以科技有限公司 The method of protective layer and the product of surface formation matcoveredn are formed in body surface
US12016124B2 (en) * 2020-04-27 2024-06-18 Covidien Lp Coating for electrical components of surgical devices
US11439024B2 (en) * 2020-07-16 2022-09-06 Steering Solutions Ip Holding Corporation Method for manufacturing water resistant printed circuit board
LU503697B1 (en) * 2023-03-20 2024-09-23 Luxembourg Inst Science & Tech List Plasma-polymer surface coating

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0323295D0 (en) * 2003-10-04 2003-11-05 Dow Corning Deposition of thin films
US8962097B1 (en) * 2007-09-07 2015-02-24 Edward Maxwell Yokley Surface properties of polymeric materials with nanoscale functional coating
EP2438109A2 (en) * 2009-06-01 2012-04-11 Board of Regents, The University of Texas System Non-fouling receptor labeled multi-functional surfaces
US8995146B2 (en) * 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201003067D0 (en) 2010-02-23 2010-04-07 Semblant Ltd Plasma-polymerized polymer coating
JP2012196965A (en) * 2011-03-10 2012-10-18 Mitsubishi Rayon Co Ltd Laminate and method for producing the same
CA2864202A1 (en) 2012-03-06 2013-09-12 Semblant Limited Coated electrical assembly
WO2014015241A1 (en) 2012-07-20 2014-01-23 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Organosilane precursors for ald/cvd silicon-containing film applications
GB2521137A (en) * 2013-12-10 2015-06-17 Europlasma Nv Surface Coatings

Also Published As

Publication number Publication date
GB2550743A (en) 2017-11-29
AU2017209986A1 (en) 2018-09-06
US20190037705A1 (en) 2019-01-31
WO2017125741A1 (en) 2017-07-27
GB2550743B (en) 2019-10-23
CA3025043A1 (en) 2017-07-27
GB201712496D0 (en) 2017-09-20
CN108781514A (en) 2018-11-09
RU2018130110A (en) 2020-02-26
JP7122967B2 (en) 2022-08-22
GB201601221D0 (en) 2016-03-09
RU2018130110A3 (en) 2020-03-04
EP3406115A1 (en) 2018-11-28
TW201739960A (en) 2017-11-16
JP2019505095A (en) 2019-02-21
KR20180120678A (en) 2018-11-06

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