SG11201806026UA - Polyamide composition containing a polyamide and an additive - Google Patents

Polyamide composition containing a polyamide and an additive

Info

Publication number
SG11201806026UA
SG11201806026UA SG11201806026UA SG11201806026UA SG11201806026UA SG 11201806026U A SG11201806026U A SG 11201806026UA SG 11201806026U A SG11201806026U A SG 11201806026UA SG 11201806026U A SG11201806026U A SG 11201806026UA SG 11201806026U A SG11201806026U A SG 11201806026UA
Authority
SG
Singapore
Prior art keywords
polyamide
additive
composition containing
polyamide composition
present
Prior art date
Application number
SG11201806026UA
Inventor
Claus Gabriel
Simon Gramlich
Rainer Ostermann
Florian Richter
Raphael Dabbous
Thomas Meier
Wolfgang Schrof
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG11201806026UA publication Critical patent/SG11201806026UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3462—Six-membered rings
    • C08K5/3465—Six-membered rings condensed with carbocyclic rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45—Heterocyclic compounds having sulfur in the ring
    • C08K5/46—Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
    • C09B67/0097—Dye preparations of special physical nature; Tablets, films, extrusion, microcapsules, sheets, pads, bags with dyes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Nitrogen- Or Sulfur-Containing Heterocyclic Ring Compounds With Rings Of Six Or More Members (AREA)

Abstract

BASFSE PF8 SE/WOW 27 EB14-6958PC “as originally filed” Polyamide composition comprising a polyamide and an additive The present invention relates to a polyamide composition (PC) which comprises at 5 least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process. 10 15 20 25 30 35 40
SG11201806026UA 2016-02-19 2017-02-16 Polyamide composition containing a polyamide and an additive SG11201806026UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16156545 2016-02-19
PCT/EP2017/053526 WO2017140795A1 (en) 2016-02-19 2017-02-16 Polyamide composition containing a polyamide and an additive

Publications (1)

Publication Number Publication Date
SG11201806026UA true SG11201806026UA (en) 2018-09-27

Family

ID=55409757

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201806026UA SG11201806026UA (en) 2016-02-19 2017-02-16 Polyamide composition containing a polyamide and an additive

Country Status (11)

Country Link
US (1) US11078362B2 (en)
EP (1) EP3416808B1 (en)
JP (1) JP6907224B2 (en)
KR (1) KR102667488B1 (en)
CN (1) CN108698316A (en)
AU (1) AU2017221117A1 (en)
CA (1) CA3012792A1 (en)
IL (1) IL261081A (en)
MX (1) MX2018010012A (en)
SG (1) SG11201806026UA (en)
WO (1) WO2017140795A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180115689A (en) 2016-02-19 2018-10-23 바스프 에스이 Kaolin for Mechanical Reinforcement of Polymeric Laser Sintered Powders
EP3222651A1 (en) 2016-03-21 2017-09-27 Basf Se Desalination of polyaryl ethers by means of melt extraction
JP7118075B2 (en) 2017-02-01 2022-08-15 ビーエーエスエフ ソシエタス・ヨーロピア Method for producing polyamide powder by precipitation
WO2018165641A1 (en) 2017-03-10 2018-09-13 Advansix Resins & Chemicals Llc Wire and cable jacket composition of pa6/66 copolymer base resin for improved processability and properties
US11613074B2 (en) 2017-10-04 2023-03-28 Basf Se Sinter powder containing a mineral flame retardant for producing moulded bodies
WO2019121506A1 (en) 2017-12-18 2019-06-27 Basf Se Polyamide moulding compounds with improved optical properties and use of colourants therein
EP3594272A1 (en) * 2018-07-10 2020-01-15 Basf Se Method for the continuous production of a polyamide powder
CN110146539B (en) * 2019-05-13 2021-09-10 南京理工大学 Method for evaluating minimum decomposition starting temperature of material thermal decomposition reaction

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Also Published As

Publication number Publication date
KR102667488B1 (en) 2024-05-22
MX2018010012A (en) 2018-11-09
JP2019511592A (en) 2019-04-25
WO2017140795A1 (en) 2017-08-24
EP3416808A1 (en) 2018-12-26
CA3012792A1 (en) 2017-08-24
AU2017221117A1 (en) 2018-09-06
KR20180109934A (en) 2018-10-08
IL261081A (en) 2018-10-31
CN108698316A (en) 2018-10-23
US11078362B2 (en) 2021-08-03
JP6907224B2 (en) 2021-07-21
US20190071568A1 (en) 2019-03-07
EP3416808B1 (en) 2022-10-26

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