SG11201706110SA - Imaging method, imaging device, and electronic device - Google Patents
Imaging method, imaging device, and electronic deviceInfo
- Publication number
- SG11201706110SA SG11201706110SA SG11201706110SA SG11201706110SA SG11201706110SA SG 11201706110S A SG11201706110S A SG 11201706110SA SG 11201706110S A SG11201706110S A SG 11201706110SA SG 11201706110S A SG11201706110S A SG 11201706110SA SG 11201706110S A SG11201706110S A SG 11201706110SA
- Authority
- SG
- Singapore
- Prior art keywords
- imaging
- electronic device
- imaging method
- electronic
- imaging device
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
- H04N5/265—Mixing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/76—Circuitry for compensating brightness variation in the scene by influencing the image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/14—Picture signal circuitry for video frequency region
- H04N5/21—Circuitry for suppressing or minimising disturbance, e.g. moiré or halo
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510964215.XA CN105578072A (en) | 2015-12-18 | 2015-12-18 | Imaging method, imaging device and electronic device |
PCT/CN2016/091944 WO2017101451A1 (en) | 2015-12-18 | 2016-07-27 | Imaging method, imaging device, and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201706110SA true SG11201706110SA (en) | 2017-08-30 |
Family
ID=55887678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201706110SA SG11201706110SA (en) | 2015-12-18 | 2016-07-27 | Imaging method, imaging device, and electronic device |
Country Status (11)
Country | Link |
---|---|
US (1) | US10257447B2 (en) |
EP (1) | EP3229467A4 (en) |
JP (1) | JP6377855B2 (en) |
KR (1) | KR20170118197A (en) |
CN (1) | CN105578072A (en) |
AU (1) | AU2016370324B2 (en) |
MY (1) | MY180913A (en) |
SG (1) | SG11201706110SA (en) |
TW (1) | TW201724015A (en) |
WO (1) | WO2017101451A1 (en) |
ZA (1) | ZA201706395B (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105578072A (en) | 2015-12-18 | 2016-05-11 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic device |
CN106454288B (en) * | 2016-11-29 | 2018-01-19 | 广东欧珀移动通信有限公司 | Control method, control device, imaging device and electronic installation |
CN106454054B (en) | 2016-11-29 | 2019-03-19 | Oppo广东移动通信有限公司 | Control method, control device and electronic device |
CN106713790B (en) * | 2016-11-29 | 2019-05-10 | Oppo广东移动通信有限公司 | Control method, control device and electronic device |
CN106504218B (en) * | 2016-11-29 | 2019-03-12 | Oppo广东移动通信有限公司 | Control method, control device and electronic device |
CN106341670B (en) | 2016-11-29 | 2017-09-22 | 广东欧珀移动通信有限公司 | Control method, control device and electronic installation |
CN106507068B (en) | 2016-11-29 | 2018-05-04 | 广东欧珀移动通信有限公司 | Image processing method and device, control method and device, imaging and electronic device |
US10848631B2 (en) | 2018-09-26 | 2020-11-24 | Ricoh Company, Ltd. | Reading device and image forming apparatus |
KR20200097841A (en) | 2019-02-08 | 2020-08-20 | 삼성전자주식회사 | Image sensor device |
KR102661820B1 (en) | 2019-02-11 | 2024-05-02 | 삼성전자주식회사 | Image sensor and driving method thereof |
KR102695388B1 (en) | 2019-02-12 | 2024-08-19 | 삼성전자주식회사 | Image sensor comprising digital pixel |
US10764507B1 (en) * | 2019-04-18 | 2020-09-01 | Kneron (Taiwan) Co., Ltd. | Image processing system capable of generating a snapshot image with high image quality by using a zero-shutter-lag snapshot operation |
CN110161530A (en) * | 2019-06-10 | 2019-08-23 | 炬佑智能科技(苏州)有限公司 | TOF sensor and forming method thereof, NI Vision Builder for Automated Inspection |
CN110161529A (en) * | 2019-06-10 | 2019-08-23 | 炬佑智能科技(苏州)有限公司 | TOF sensor and forming method thereof, NI Vision Builder for Automated Inspection |
CN110418044B (en) * | 2019-07-31 | 2021-04-23 | Oppo广东移动通信有限公司 | Optical system and electronic apparatus |
KR102625261B1 (en) | 2019-10-21 | 2024-01-12 | 삼성전자주식회사 | Image device |
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US6999119B1 (en) * | 1998-04-10 | 2006-02-14 | Nikon Corporation | Image-capturing element, image-capturing circuit for processing signal from image-capturing element, image-capturing device, driving method of image-capturing element |
US20060125947A1 (en) * | 2004-12-09 | 2006-06-15 | Packer Jimmy L | Imaging with clustered photosite arrays |
US7924483B2 (en) | 2006-03-06 | 2011-04-12 | Smith Scott T | Fused multi-array color image sensor |
JP2008109369A (en) * | 2006-10-25 | 2008-05-08 | Olympus Imaging Corp | Imaging apparatus and image processing method |
KR100976284B1 (en) | 2007-06-07 | 2010-08-16 | 가부시끼가이샤 도시바 | Image pickup device |
JP5068158B2 (en) | 2007-12-28 | 2012-11-07 | イーストマン コダック カンパニー | Imaging device |
US7745779B2 (en) | 2008-02-08 | 2010-06-29 | Aptina Imaging Corporation | Color pixel arrays having common color filters for multiple adjacent pixels for use in CMOS imagers |
TWI504256B (en) * | 2008-04-07 | 2015-10-11 | Sony Corp | Solid-state imaging device, signal processing method of solid-state imaging device, and electronic apparatus |
US8218068B2 (en) | 2009-04-01 | 2012-07-10 | Omnivision Technologies, Inc. | Exposing pixel groups in producing digital images |
US8134115B2 (en) * | 2009-06-23 | 2012-03-13 | Nokia Corporation | Color filters for sub-diffraction limit-sized light sensors |
JP5471117B2 (en) * | 2009-07-24 | 2014-04-16 | ソニー株式会社 | Solid-state imaging device, manufacturing method thereof, and camera |
US8724928B2 (en) | 2009-08-31 | 2014-05-13 | Intellectual Ventures Fund 83 Llc | Using captured high and low resolution images |
JP5044673B2 (en) * | 2010-03-25 | 2012-10-10 | 株式会社東芝 | Solid-state imaging device and image recording device |
JP5644177B2 (en) * | 2010-05-07 | 2014-12-24 | ソニー株式会社 | Solid-state imaging device, manufacturing method thereof, and electronic apparatus |
JP5664141B2 (en) * | 2010-11-08 | 2015-02-04 | ソニー株式会社 | Solid-state imaging device and camera system |
US8742309B2 (en) * | 2011-01-28 | 2014-06-03 | Aptina Imaging Corporation | Imagers with depth sensing capabilities |
DE102011100350A1 (en) | 2011-05-03 | 2012-11-08 | Conti Temic Microelectronic Gmbh | Image sensor with adjustable resolution |
JP2015012303A (en) * | 2013-06-26 | 2015-01-19 | ソニー株式会社 | Solid-state imaging device and electronic apparatus |
US20150062422A1 (en) * | 2013-08-27 | 2015-03-05 | Semiconductor Components Industries, Llc | Lens alignment in camera modules using phase detection pixels |
KR102136852B1 (en) * | 2013-12-30 | 2020-07-22 | 삼성전자 주식회사 | CMOS Image Sensor based on a Thin-Film on ASIC and operating method thereof |
US9438866B2 (en) * | 2014-04-23 | 2016-09-06 | Omnivision Technologies, Inc. | Image sensor with scaled filter array and in-pixel binning |
US9711553B2 (en) * | 2014-04-28 | 2017-07-18 | Samsung Electronics Co., Ltd. | Image sensor including a pixel having photoelectric conversion elements and image processing device having the image sensor |
US9888198B2 (en) * | 2014-06-03 | 2018-02-06 | Semiconductor Components Industries, Llc | Imaging systems having image sensor pixel arrays with sub-pixel resolution capabilities |
TWI552594B (en) * | 2014-10-27 | 2016-10-01 | 聯詠科技股份有限公司 | Color filter array for image sensing device and manufacturing method thereof |
CN104486602B (en) | 2014-12-29 | 2018-04-06 | 上海集成电路研发中心有限公司 | A kind of structures and methods realized pixel physics and merged |
CN105554485B (en) | 2015-12-18 | 2019-04-12 | Oppo广东移动通信有限公司 | Imaging method, imaging device and electronic device |
CN105578080B (en) | 2015-12-18 | 2019-02-05 | Oppo广东移动通信有限公司 | Imaging method, imaging device and electronic device |
CN105611185B (en) | 2015-12-18 | 2017-10-31 | 广东欧珀移动通信有限公司 | image generating method, device and terminal device |
CN105516697B (en) | 2015-12-18 | 2018-04-17 | 广东欧珀移动通信有限公司 | Imaging sensor, imaging device, mobile terminal and imaging method |
CN105578006B (en) * | 2015-12-18 | 2018-02-13 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic installation |
CN105430360B (en) | 2015-12-18 | 2018-01-23 | 广东欧珀移动通信有限公司 | Imaging method, imaging sensor, imaging device and electronic installation |
CN105430361B (en) | 2015-12-18 | 2018-03-20 | 广东欧珀移动通信有限公司 | Imaging method, imaging sensor, imaging device and electronic installation |
CN105578076A (en) * | 2015-12-18 | 2016-05-11 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic device |
CN105578077A (en) | 2015-12-18 | 2016-05-11 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic device |
CN105430362B (en) | 2015-12-18 | 2017-09-19 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic installation |
CN105592303B (en) | 2015-12-18 | 2018-09-11 | 广东欧珀移动通信有限公司 | imaging method, imaging device and electronic device |
CN105578072A (en) | 2015-12-18 | 2016-05-11 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic device |
CN105611125B (en) * | 2015-12-18 | 2018-04-10 | 广东欧珀移动通信有限公司 | Imaging method, imaging device and electronic installation |
CN105430359B (en) * | 2015-12-18 | 2018-07-10 | 广东欧珀移动通信有限公司 | Imaging method, imaging sensor, imaging device and electronic device |
CN105578081B (en) | 2015-12-18 | 2018-03-06 | 广东欧珀移动通信有限公司 | Imaging method, imaging sensor, imaging device and electronic installation |
CN105430363B (en) | 2015-12-18 | 2018-07-17 | 广东欧珀移动通信有限公司 | imaging method, imaging device and electronic device |
CN105611257B (en) | 2015-12-18 | 2018-09-11 | 广东欧珀移动通信有限公司 | Imaging method, imaging sensor, imaging device and electronic device |
-
2015
- 2015-12-18 CN CN201510964215.XA patent/CN105578072A/en active Pending
-
2016
- 2016-07-27 MY MYPI2017702799A patent/MY180913A/en unknown
- 2016-07-27 US US15/514,798 patent/US10257447B2/en active Active
- 2016-07-27 EP EP16874512.3A patent/EP3229467A4/en not_active Ceased
- 2016-07-27 WO PCT/CN2016/091944 patent/WO2017101451A1/en active Application Filing
- 2016-07-27 JP JP2017528779A patent/JP6377855B2/en active Active
- 2016-07-27 SG SG11201706110SA patent/SG11201706110SA/en unknown
- 2016-07-27 KR KR1020177026302A patent/KR20170118197A/en not_active Application Discontinuation
- 2016-07-27 AU AU2016370324A patent/AU2016370324B2/en active Active
- 2016-12-15 TW TW105141528A patent/TW201724015A/en unknown
-
2017
- 2017-09-21 ZA ZA2017/06395A patent/ZA201706395B/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20170332022A1 (en) | 2017-11-16 |
WO2017101451A1 (en) | 2017-06-22 |
US10257447B2 (en) | 2019-04-09 |
MY180913A (en) | 2020-12-11 |
JP6377855B2 (en) | 2018-08-22 |
TW201724015A (en) | 2017-07-01 |
ZA201706395B (en) | 2019-01-30 |
EP3229467A4 (en) | 2018-04-18 |
KR20170118197A (en) | 2017-10-24 |
CN105578072A (en) | 2016-05-11 |
EP3229467A1 (en) | 2017-10-11 |
JP2018502492A (en) | 2018-01-25 |
AU2016370324B2 (en) | 2018-09-06 |
AU2016370324A1 (en) | 2017-07-27 |
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