SG11201705795PA - Microvia pad repair - Google Patents

Microvia pad repair

Info

Publication number
SG11201705795PA
SG11201705795PA SG11201705795PA SG11201705795PA SG11201705795PA SG 11201705795P A SG11201705795P A SG 11201705795PA SG 11201705795P A SG11201705795P A SG 11201705795PA SG 11201705795P A SG11201705795P A SG 11201705795PA SG 11201705795P A SG11201705795P A SG 11201705795PA
Authority
SG
Singapore
Prior art keywords
pad repair
microvia pad
microvia
repair
pad
Prior art date
Application number
SG11201705795PA
Inventor
Thomas Rovere
Jenai Beddow
Daniel Lee Blass
Alfred A Zinn
Original Assignee
Lockheed Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/597,949 external-priority patent/US20150189759A1/en
Application filed by Lockheed Corp filed Critical Lockheed Corp
Publication of SG11201705795PA publication Critical patent/SG11201705795PA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
SG11201705795PA 2015-01-15 2016-01-14 Microvia pad repair SG11201705795PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/597,949 US20150189759A1 (en) 2011-04-04 2015-01-15 Microvia pad repair
PCT/US2016/013405 WO2016115342A1 (en) 2015-01-15 2016-01-14 Microvia pad repair

Publications (1)

Publication Number Publication Date
SG11201705795PA true SG11201705795PA (en) 2017-08-30

Family

ID=55310929

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201705795PA SG11201705795PA (en) 2015-01-15 2016-01-14 Microvia pad repair

Country Status (2)

Country Link
SG (1) SG11201705795PA (en)
WO (1) WO2016115342A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7399930B1 (en) * 2007-01-16 2008-07-15 International Business Machines Corporation Method and device for repair of a contact pad of a printed circuit board
US8105414B2 (en) * 2008-09-15 2012-01-31 Lockheed Martin Corporation Lead solder-free electronics
US9011570B2 (en) * 2009-07-30 2015-04-21 Lockheed Martin Corporation Articles containing copper nanoparticles and methods for production and use thereof
US20130341077A1 (en) * 2012-06-25 2013-12-26 Ibiden Co., Ltd. Method for repairing disconnection in wiring board, method for manufacturing wiring board, method for forming wiring in wiring board and wiring board

Also Published As

Publication number Publication date
WO2016115342A1 (en) 2016-07-21

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