SG11201610852UA - Near infrared ray absorbent composition, near infrared ray cut filter, manufacturing method of near infrared ray cut filter, solid image pickup element, camera module - Google Patents
Near infrared ray absorbent composition, near infrared ray cut filter, manufacturing method of near infrared ray cut filter, solid image pickup element, camera moduleInfo
- Publication number
- SG11201610852UA SG11201610852UA SG11201610852UA SG11201610852UA SG11201610852UA SG 11201610852U A SG11201610852U A SG 11201610852UA SG 11201610852U A SG11201610852U A SG 11201610852UA SG 11201610852U A SG11201610852U A SG 11201610852UA SG 11201610852U A SG11201610852U A SG 11201610852UA
- Authority
- SG
- Singapore
- Prior art keywords
- infrared ray
- near infrared
- cut filter
- ray cut
- manufacturing
- Prior art date
Links
- 230000002745 absorbent Effects 0.000 title 1
- 239000002250 absorbent Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007787 solid Substances 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/75—Circuitry for compensating brightness variation in the scene by influencing optical camera components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Optical Filters (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014134257 | 2014-06-30 | ||
| PCT/JP2015/068642 WO2016002702A1 (en) | 2014-06-30 | 2015-06-29 | Near infrared absorbing composition, near infrared blocking filter, method for producing near infrared blocking filter, solid-state imaging element, and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201610852UA true SG11201610852UA (en) | 2017-02-27 |
Family
ID=55019237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201610852UA SG11201610852UA (en) | 2014-06-30 | 2015-06-29 | Near infrared ray absorbent composition, near infrared ray cut filter, manufacturing method of near infrared ray cut filter, solid image pickup element, camera module |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9958576B2 (en) |
| JP (1) | JP6243027B2 (en) |
| KR (1) | KR20170007387A (en) |
| CN (1) | CN106461831B (en) |
| SG (1) | SG11201610852UA (en) |
| TW (1) | TW201600574A (en) |
| WO (1) | WO2016002702A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6281395B2 (en) * | 2013-11-26 | 2018-02-21 | ソニー株式会社 | Image sensor |
| WO2017047230A1 (en) * | 2015-09-14 | 2017-03-23 | 富士フイルム株式会社 | Near-infrared absorbing composition, near-infrared blocking filter, method for producing near-infrared blocking filter, solid-state imaging element, camera module and image display device |
| TW201728732A (en) * | 2016-01-20 | 2017-08-16 | Fujifilm Corp | Near-infrared ray adsorbing composition, method of producing near-infrared ray cut filter, near-infrared ray cut filter, solid image sensor, camera module and infrared ray sensor |
| KR102104081B1 (en) * | 2016-02-24 | 2020-04-23 | 가부시키가이샤 오프토런 | Camera structure, information and communication equipment |
| US10838126B2 (en) * | 2016-09-19 | 2020-11-17 | Apple Inc. | Electronic devices with infrared blocking filters |
| CN108399633A (en) * | 2017-02-06 | 2018-08-14 | 罗伯团队家居有限公司 | Method and apparatus for stereoscopic vision |
| JP2018200980A (en) | 2017-05-29 | 2018-12-20 | ソニーセミコンダクタソリューションズ株式会社 | Imaging apparatus, solid-state imaging device, and electronic equipment |
| JP2018200423A (en) * | 2017-05-29 | 2018-12-20 | ソニーセミコンダクタソリューションズ株式会社 | Imaging device and electronic apparatus |
| WO2019059077A1 (en) * | 2017-09-21 | 2019-03-28 | 富士フイルム株式会社 | Method for producing near-infrared cut filter, laminate and kit |
| KR102465624B1 (en) * | 2017-11-07 | 2022-11-10 | 니혼 이타가라스 가부시키가이샤 | Light-absorbing composition and optical filter |
| WO2019181587A1 (en) * | 2018-03-23 | 2019-09-26 | コニカミノルタ株式会社 | Near-infrared-absorbing composition, near-infrared-absorbing film, and image sensor for solid-state imaging element |
| US10694607B1 (en) | 2019-06-24 | 2020-06-23 | Apple Inc. | Electronic devices with light sensor waveguides |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU718609B2 (en) * | 1996-04-18 | 2000-04-20 | Osaka Gas Co., Ltd. | Near-infrared absorbing film, and multi-layered panel comprising the film |
| JP4092840B2 (en) * | 2000-02-01 | 2008-05-28 | コニカミノルタホールディングス株式会社 | Image forming material |
| TWI278991B (en) * | 2002-07-09 | 2007-04-11 | Toppan Printing Co Ltd | Solid image-pickup device and method of manufacturing the same |
| US7084472B2 (en) | 2002-07-09 | 2006-08-01 | Toppan Printing Co., Ltd. | Solid-state imaging device and manufacturing method therefor |
| JP2005044573A (en) * | 2003-07-25 | 2005-02-17 | Nippon Sheet Glass Co Ltd | Infrared cut filter and artificial sunlight lighting using this |
| JP2006010759A (en) * | 2004-06-22 | 2006-01-12 | Sumitomo Metal Mining Co Ltd | Near-infrared shielding material fine particle dispersion, near-infrared shielding body, and method for adjusting color tone of visible light passing through the near-infrared shielding material |
| JP4514577B2 (en) * | 2004-10-21 | 2010-07-28 | 大阪瓦斯株式会社 | Infrared absorption filter and infrared absorption panel |
| JP2008091535A (en) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | Solid-state imaging device |
| EP1970959A3 (en) * | 2007-03-12 | 2013-07-31 | FUJIFILM Corporation | Photoelectric conversion element and solid-state imaging device |
| JP5270114B2 (en) * | 2007-06-15 | 2013-08-21 | 富士フイルム株式会社 | Solid-state image sensor |
| TWI516450B (en) * | 2009-10-19 | 2016-01-11 | 富士軟片股份有限公司 | Titanium black dispersion, photosensitive resin composition, wafer level lens, light-shielding film and producing method thereof, and solid-state image pick-up device |
| JP5288640B2 (en) * | 2010-03-31 | 2013-09-11 | 富士フイルム株式会社 | Image sensor and manufacturing method thereof |
| JP5741283B2 (en) * | 2010-12-10 | 2015-07-01 | 旭硝子株式会社 | Infrared light transmission filter and imaging apparatus using the same |
| JP5614651B2 (en) * | 2011-01-21 | 2014-10-29 | 株式会社リコー | Electrophotographic photosensitive member, image forming method using the same, image forming apparatus, and process cartridge for image forming apparatus |
| JP2013019991A (en) | 2011-07-08 | 2013-01-31 | Japan Carlit Co Ltd:The | Near-infrared absorbing resin composition and near-infrared cut-off filter |
| JP5829641B2 (en) * | 2012-05-08 | 2015-12-09 | 富士フイルム株式会社 | Near-infrared absorbing liquid composition, near-infrared cut filter using the same, and manufacturing method thereof, and camera module and manufacturing method thereof |
| JP6183048B2 (en) | 2012-08-27 | 2017-08-23 | 旭硝子株式会社 | Optical filter and solid-state imaging device |
| US9891237B2 (en) * | 2013-07-24 | 2018-02-13 | The University Of Akron | Fluorescent sensor for metal cation detection based on 2-(2′-hydroxyphenyl)benzazole containing a Schiff base moiety |
-
2015
- 2015-06-25 TW TW104120439A patent/TW201600574A/en unknown
- 2015-06-29 WO PCT/JP2015/068642 patent/WO2016002702A1/en active Application Filing
- 2015-06-29 KR KR1020167034689A patent/KR20170007387A/en not_active Application Discontinuation
- 2015-06-29 CN CN201580034452.4A patent/CN106461831B/en not_active Expired - Fee Related
- 2015-06-29 JP JP2016531357A patent/JP6243027B2/en not_active Expired - Fee Related
- 2015-06-29 SG SG11201610852UA patent/SG11201610852UA/en unknown
-
2016
- 2016-12-23 US US15/389,546 patent/US9958576B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6243027B2 (en) | 2017-12-06 |
| KR20170007387A (en) | 2017-01-18 |
| TW201600574A (en) | 2016-01-01 |
| CN106461831A (en) | 2017-02-22 |
| CN106461831B (en) | 2019-04-09 |
| WO2016002702A1 (en) | 2016-01-07 |
| JPWO2016002702A1 (en) | 2017-04-27 |
| US9958576B2 (en) | 2018-05-01 |
| US20170102483A1 (en) | 2017-04-13 |
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