SG11201610400UA - Encapsulated composite backing plate - Google Patents

Encapsulated composite backing plate

Info

Publication number
SG11201610400UA
SG11201610400UA SG11201610400UA SG11201610400UA SG11201610400UA SG 11201610400U A SG11201610400U A SG 11201610400UA SG 11201610400U A SG11201610400U A SG 11201610400UA SG 11201610400U A SG11201610400U A SG 11201610400UA SG 11201610400U A SG11201610400U A SG 11201610400UA
Authority
SG
Singapore
Prior art keywords
backing plate
composite backing
encapsulated composite
encapsulated
plate
Prior art date
Application number
SG11201610400UA
Inventor
Jaeyeon Kim
Kevin B Albaugh
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Publication of SG11201610400UA publication Critical patent/SG11201610400UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B23K20/026—Thermo-compression bonding with diffusion of soldering material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
SG11201610400UA 2014-08-20 2015-08-17 Encapsulated composite backing plate SG11201610400UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462039694P 2014-08-20 2014-08-20
US14/820,336 US20160053365A1 (en) 2014-08-20 2015-08-06 Encapsulated composite backing plate
PCT/US2015/045449 WO2016028657A1 (en) 2014-08-20 2015-08-17 Encapsulated composite backing plate

Publications (1)

Publication Number Publication Date
SG11201610400UA true SG11201610400UA (en) 2017-03-30

Family

ID=55347796

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610400UA SG11201610400UA (en) 2014-08-20 2015-08-17 Encapsulated composite backing plate

Country Status (7)

Country Link
US (1) US20160053365A1 (en)
EP (1) EP3183744A4 (en)
JP (1) JP2017525846A (en)
KR (1) KR20170042589A (en)
CN (1) CN106663605A (en)
SG (1) SG11201610400UA (en)
WO (1) WO2016028657A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6649245B2 (en) * 2016-12-28 2020-02-19 株式会社コベルコ科研 Repair method of backing plate for sputtering target and repaired backing plate
CN107974656B (en) * 2017-11-15 2019-10-22 西北工业大学 It is a kind of to take into account that titanium alloy is wear-resisting, preparation method of anti-fatigue performance Cr-Zr-Ti solid solution layer
KR102559553B1 (en) * 2020-12-08 2023-07-26 (주)지오엘리먼트 Sputtering target with upper-side reinforcement region and method for manufacturing the same sputtering target
KR102559547B1 (en) * 2020-12-08 2023-07-26 (주)지오엘리먼트 Sputtering target with reinforcement region and method for manufacturing the same sputtering target

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593082A (en) * 1994-11-15 1997-01-14 Tosoh Smd, Inc. Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
JPH093641A (en) * 1995-06-23 1997-01-07 Sony Corp Backing plate and its manufacture
US6039848A (en) * 1995-07-10 2000-03-21 Cvc Products, Inc. Ultra-high vacuum apparatus and method for high productivity physical vapor deposition.
JPH11102827A (en) * 1997-09-26 1999-04-13 Hitachi Metals Ltd Saturable reactor core and magnetic amplifier mode high output switching regulator using the same, and computer using the same
EP0933343B1 (en) * 1998-01-29 2003-06-25 Coi Ceramics, Inc. Method for producing sized, coated ceramic fibers
JP2000226650A (en) * 1999-02-08 2000-08-15 Mitsubishi Materials Corp Reinforcement ring for preventing deformation of backing plate, backing plate with the reinforcement ring, sputtering target, and their use
US6596139B2 (en) * 2000-05-31 2003-07-22 Honeywell International Inc. Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications
JP4820508B2 (en) * 2000-08-30 2011-11-24 株式会社東芝 Sputtering target and manufacturing method thereof, sputtering apparatus, thin film manufacturing method, electronic component manufacturing method
US6376281B1 (en) * 2000-10-27 2002-04-23 Honeywell International, Inc. Physical vapor deposition target/backing plate assemblies
JP2002161361A (en) * 2000-11-21 2002-06-04 Taiheiyo Cement Corp Backing plate for sputtering target
TWI232241B (en) * 2001-03-13 2005-05-11 Ind Tech Res Inst Method of regenerating a phase change sputtering target for optical storage media
US20040222090A1 (en) * 2003-05-07 2004-11-11 Tim Scott Carbon fiber and copper support for physical vapor deposition target assemblies
US7485210B2 (en) * 2004-10-07 2009-02-03 International Business Machines Corporation Sputtering target fixture
JP4803716B2 (en) * 2005-12-09 2011-10-26 株式会社アルバック Backing plate and manufacturing method thereof
DE112006003537B4 (en) * 2005-12-28 2017-07-06 Plansee Se Method of making a sputtering target assembly
US7815782B2 (en) * 2006-06-23 2010-10-19 Applied Materials, Inc. PVD target
JP5272361B2 (en) * 2006-10-20 2013-08-28 豊田合成株式会社 Sputter deposition apparatus and backing plate for sputter deposition apparatus
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US7901552B2 (en) * 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
US8182870B1 (en) * 2008-05-29 2012-05-22 The United States Of America As Represented By The United States Department Of Energy Method for generating small and ultra small apertures, slits, nozzles and orifices
US8133368B2 (en) * 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
US8968537B2 (en) * 2011-02-09 2015-03-03 Applied Materials, Inc. PVD sputtering target with a protected backing plate
JP5779491B2 (en) * 2011-12-13 2015-09-16 株式会社アルバック Target device, sputtering device, and method of manufacturing target device

Also Published As

Publication number Publication date
CN106663605A (en) 2017-05-10
US20160053365A1 (en) 2016-02-25
EP3183744A4 (en) 2018-03-14
JP2017525846A (en) 2017-09-07
WO2016028657A1 (en) 2016-02-25
KR20170042589A (en) 2017-04-19
EP3183744A1 (en) 2017-06-28

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