SG11201606919VA - Wire tensioner - Google Patents

Wire tensioner

Info

Publication number
SG11201606919VA
SG11201606919VA SG11201606919VA SG11201606919VA SG11201606919VA SG 11201606919V A SG11201606919V A SG 11201606919VA SG 11201606919V A SG11201606919V A SG 11201606919VA SG 11201606919V A SG11201606919V A SG 11201606919VA SG 11201606919V A SG11201606919V A SG 11201606919VA
Authority
SG
Singapore
Prior art keywords
wire tensioner
tensioner
wire
Prior art date
Application number
SG11201606919VA
Inventor
Yoshitaka Takagi
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201606919VA publication Critical patent/SG11201606919VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78611—Feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H01L2224/78631—Means for wire tension adjustments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
SG11201606919VA 2014-02-24 2015-02-10 Wire tensioner SG11201606919VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014032934 2014-02-24
PCT/JP2015/053669 WO2015125672A1 (en) 2014-02-24 2015-02-10 Wire tensioner

Publications (1)

Publication Number Publication Date
SG11201606919VA true SG11201606919VA (en) 2016-10-28

Family

ID=53878177

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606919VA SG11201606919VA (en) 2014-02-24 2015-02-10 Wire tensioner

Country Status (7)

Country Link
US (1) US9865563B2 (en)
JP (1) JP6149235B2 (en)
KR (1) KR101839125B1 (en)
CN (1) CN106233445B (en)
SG (1) SG11201606919VA (en)
TW (1) TWI566875B (en)
WO (1) WO2015125672A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168888A1 (en) * 2017-03-16 2018-09-20 株式会社新川 Wire bonding device, and semiconductor device manufacturing method
KR102068594B1 (en) 2018-07-02 2020-01-20 (주)이지원인터넷서비스 Apparatus for controlling tension of wire
KR102068592B1 (en) 2018-07-02 2020-01-20 (주)이지원인터넷서비스 Apparatus for controlling tension of wire
KR102068593B1 (en) 2018-07-02 2020-01-20 (주)이지원인터넷서비스 Apparatus for controlling tension of wire

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH592365A5 (en) * 1975-12-23 1977-10-31 Esec Sales Sa
US4172544A (en) * 1977-05-17 1979-10-30 Sola Basic Industries, Inc. Wire tensioning and feeding device
EP0330053B1 (en) * 1988-02-23 1994-08-03 F & K Delvotec Bondtechnik GmbH Device and method for the controlled supply of a bonding wire to the wedge or to the capillary of a bonding head
JP2842677B2 (en) * 1990-08-27 1999-01-06 三井化学株式会社 Air gun for nonwoven fabric production
JPH06252197A (en) * 1993-02-26 1994-09-09 Toshiba Corp Wire bonding apparatus
JP3260531B2 (en) * 1994-02-01 2002-02-25 宮崎沖電気株式会社 Extra fine wire tension generator by air
US5402927A (en) * 1994-06-09 1995-04-04 Kulicke And Soffa Investments, Inc. Adjustable wire tensioning apparatus
JPH0945721A (en) * 1995-08-03 1997-02-14 Kaijo Corp Device and method for guiding wire and wire bonding apparatus having this device
TW412817B (en) * 1998-06-19 2000-11-21 Matsushita Electric Ind Co Ltd A bump bonding apparatus and method
DE19963416C1 (en) * 1999-12-28 2001-10-25 Agie Sa Device and method for inserting a machining electrode into an electrode running system of a spark erosion machine
JP2002083837A (en) 2000-09-07 2002-03-22 Shinkawa Ltd Wire bonding apparatus
US20060091181A1 (en) * 2004-10-28 2006-05-04 Kulicke And Soffa Industries, Inc. Wire tensioner for a wire bonder
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
JP4700633B2 (en) 2007-02-15 2011-06-15 株式会社新川 Wire cleaning guide
US7954689B2 (en) * 2007-05-04 2011-06-07 Asm Technology Singapore Pte Ltd Vacuum wire tensioner for wire bonder
US8459530B2 (en) * 2009-10-29 2013-06-11 Asm Technology Singapore Pte Ltd Automatic wire feeding method for wire bonders
CN105895543B (en) * 2014-12-01 2019-09-13 恩智浦美国有限公司 Bonding wire feed system and its method

Also Published As

Publication number Publication date
JPWO2015125672A1 (en) 2017-03-30
US9865563B2 (en) 2018-01-09
CN106233445B (en) 2019-01-11
JP6149235B2 (en) 2017-06-21
WO2015125672A1 (en) 2015-08-27
US20160365331A1 (en) 2016-12-15
KR20160125455A (en) 2016-10-31
TWI566875B (en) 2017-01-21
CN106233445A (en) 2016-12-14
TW201536469A (en) 2015-10-01
KR101839125B1 (en) 2018-03-15

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