SG11201604950QA - Method for securing a component to a substrate - Google Patents
Method for securing a component to a substrateInfo
- Publication number
- SG11201604950QA SG11201604950QA SG11201604950QA SG11201604950QA SG11201604950QA SG 11201604950Q A SG11201604950Q A SG 11201604950QA SG 11201604950Q A SG11201604950Q A SG 11201604950QA SG 11201604950Q A SG11201604950Q A SG 11201604950QA SG 11201604950Q A SG11201604950Q A SG 11201604950QA
- Authority
- SG
- Singapore
- Prior art keywords
- securing
- substrate
- component
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13197640.9A EP2886244A1 (en) | 2013-12-17 | 2013-12-17 | Method for fixing a component on a substrate |
PCT/EP2014/077559 WO2015091260A1 (en) | 2013-12-17 | 2014-12-12 | Method for securing a component to a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201604950QA true SG11201604950QA (en) | 2016-08-30 |
Family
ID=49816849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201604950QA SG11201604950QA (en) | 2013-12-17 | 2014-12-12 | Method for securing a component to a substrate |
Country Status (8)
Country | Link |
---|---|
US (1) | US20160316572A1 (en) |
EP (1) | EP2886244A1 (en) |
JP (1) | JP2017507025A (en) |
KR (1) | KR20160102230A (en) |
CN (1) | CN105813798A (en) |
MX (1) | MX2016007749A (en) |
SG (1) | SG11201604950QA (en) |
WO (1) | WO2015091260A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6674982B2 (en) * | 2017-08-30 | 2020-04-01 | 株式会社タムラ製作所 | Solder composition and electronic substrate |
US10913132B2 (en) | 2017-08-30 | 2021-02-09 | Tamura Corporation | Solder composition, electronic board, and bonding method |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
AU5919890A (en) * | 1989-08-14 | 1991-02-14 | Multicore Solders Limited | Manufacture of printed circuit board assemblies |
JP3273961B2 (en) * | 1991-12-18 | 2002-04-15 | トヨタ自動車株式会社 | Cream solder |
US5272007A (en) * | 1992-02-21 | 1993-12-21 | Union Carbide Chemicals & Plastics Technology Corporation | Solder powder coated with parylene |
WO1995027307A1 (en) | 1994-03-31 | 1995-10-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process and device for producing solder humps |
US5539153A (en) | 1994-08-08 | 1996-07-23 | Hewlett-Packard Company | Method of bumping substrates by contained paste deposition |
JP3311282B2 (en) * | 1997-10-13 | 2002-08-05 | 株式会社東芝 | Method of joining metal members and joined body |
US6217671B1 (en) * | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
US6524398B2 (en) * | 2000-04-13 | 2003-02-25 | Fry's Metals, Inc. | Low-residue, low-solder-ball flux |
ATE306354T1 (en) | 2000-09-07 | 2005-10-15 | Infineon Technologies Ag | SOLDER FOR USE IN DIFFUSION SOLDERING PROCESSES |
JP3702418B2 (en) * | 2002-03-07 | 2005-10-05 | 株式会社 東京第一商興 | Solder paste flux and solder paste |
DE102005053553A1 (en) * | 2005-11-08 | 2007-05-16 | Heraeus Gmbh W C | Solder pastes with resin-free flux |
US7767032B2 (en) * | 2006-06-30 | 2010-08-03 | W.C. Heraeus Holding GmbH | No-clean low-residue solder paste for semiconductor device applications |
JP2008062253A (en) * | 2006-09-05 | 2008-03-21 | Denso Corp | Flux for soldering and solder paste composition |
DE102009034483A1 (en) * | 2009-07-22 | 2011-01-27 | W.C. Heraeus Gmbh | Lead-free high-temperature connection for the AVT in electronics |
KR20140023266A (en) * | 2010-12-17 | 2014-02-26 | 아라까와 가가꾸 고교 가부시끼가이샤 | Lead-free solder flux and lead-free solder paste |
US8430294B2 (en) * | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Amine, carboxylic acid flux composition and method of soldering |
US8434667B2 (en) * | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
US9950393B2 (en) * | 2011-12-23 | 2018-04-24 | Intel Corporation | Hybrid low metal loading flux |
-
2013
- 2013-12-17 EP EP13197640.9A patent/EP2886244A1/en not_active Withdrawn
-
2014
- 2014-12-12 US US15/105,378 patent/US20160316572A1/en not_active Abandoned
- 2014-12-12 JP JP2016539139A patent/JP2017507025A/en active Pending
- 2014-12-12 MX MX2016007749A patent/MX2016007749A/en unknown
- 2014-12-12 CN CN201480069205.3A patent/CN105813798A/en active Pending
- 2014-12-12 WO PCT/EP2014/077559 patent/WO2015091260A1/en active Application Filing
- 2014-12-12 SG SG11201604950QA patent/SG11201604950QA/en unknown
- 2014-12-12 KR KR1020167019334A patent/KR20160102230A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
MX2016007749A (en) | 2016-12-12 |
JP2017507025A (en) | 2017-03-16 |
WO2015091260A1 (en) | 2015-06-25 |
EP2886244A1 (en) | 2015-06-24 |
CN105813798A (en) | 2016-07-27 |
US20160316572A1 (en) | 2016-10-27 |
KR20160102230A (en) | 2016-08-29 |
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