SG11201601869VA - Interconnect structure for e/o engines having impedance compensation near a circuit connection region - Google Patents

Interconnect structure for e/o engines having impedance compensation near a circuit connection region

Info

Publication number
SG11201601869VA
SG11201601869VA SG11201601869VA SG11201601869VA SG11201601869VA SG 11201601869V A SG11201601869V A SG 11201601869VA SG 11201601869V A SG11201601869V A SG 11201601869VA SG 11201601869V A SG11201601869V A SG 11201601869VA SG 11201601869V A SG11201601869V A SG 11201601869VA
Authority
SG
Singapore
Prior art keywords
engines
circuit connection
interconnect structure
connection region
impedance compensation
Prior art date
Application number
SG11201601869VA
Inventor
Andrei Kaikkonen
Lennart Lundqvist
Lars-Goete Svenson
Robert Smith
Original Assignee
Tyco Electronics Svenska Holdings Ab
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Svenska Holdings Ab, Tyco Electronics Corp filed Critical Tyco Electronics Svenska Holdings Ab
Publication of SG11201601869VA publication Critical patent/SG11201601869VA/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Communication System (AREA)
  • Structure Of Printed Boards (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
SG11201601869VA 2013-09-17 2014-09-16 Interconnect structure for e/o engines having impedance compensation near a circuit connection region SG11201601869VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/029,201 US9544057B2 (en) 2013-09-17 2013-09-17 Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end
PCT/EP2014/069648 WO2015040000A1 (en) 2013-09-17 2014-09-16 Interconnect structure for e/o engines having impedance compensation near a circuit connection region

Publications (1)

Publication Number Publication Date
SG11201601869VA true SG11201601869VA (en) 2016-04-28

Family

ID=51541089

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201601869VA SG11201601869VA (en) 2013-09-17 2014-09-16 Interconnect structure for e/o engines having impedance compensation near a circuit connection region

Country Status (8)

Country Link
US (2) US9544057B2 (en)
EP (1) EP3047706B1 (en)
JP (1) JP6546594B2 (en)
CN (1) CN105557073B (en)
CA (1) CA2924218A1 (en)
IL (1) IL244589A0 (en)
SG (1) SG11201601869VA (en)
WO (1) WO2015040000A1 (en)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841815B2 (en) * 2002-03-19 2005-01-11 Finisar Corporation Transimpedance amplifier assembly with separate ground leads and separate power leads for included circuits
JP4094494B2 (en) * 2002-08-23 2008-06-04 新光電気工業株式会社 Semiconductor package
JP2004228478A (en) 2003-01-27 2004-08-12 Fujitsu Ltd Printed wiring board
WO2006050202A1 (en) * 2004-10-29 2006-05-11 Molex Incorporated Printed circuit board for high-speed electrical connectors
US20060210215A1 (en) * 2005-03-15 2006-09-21 Shigenori Aoki Optical transceiver array
JP2007123742A (en) 2005-10-31 2007-05-17 Sony Corp Board connection structure, flex rigid board, optical transmission/reception module and optical transmission/reception device
JP4774920B2 (en) 2005-10-31 2011-09-21 ソニー株式会社 Optical transceiver
US7520757B2 (en) * 2006-08-11 2009-04-21 Tyco Electronics Corporation Circuit board having configurable ground link and with coplanar circuit and ground traces
JP2009071048A (en) * 2007-09-13 2009-04-02 Fuji Xerox Co Ltd Optical relay module
US8281126B2 (en) * 2008-09-30 2012-10-02 Finisar Corporation Out of band encryption
US20110206379A1 (en) 2010-02-25 2011-08-25 International Business Machines Corporation Opto-electronic module with improved low power, high speed electrical signal integrity
US20110268390A1 (en) * 2010-05-01 2011-11-03 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Active optical cable that is suited for consumer applications and a method
JP5286600B2 (en) * 2010-08-30 2013-09-11 株式会社フジクラ Differential signal transmission circuit and manufacturing method thereof
US20120061129A1 (en) 2010-09-15 2012-03-15 Ying-Jiunn Lai Circuit board structure with low capacitance
JP5859219B2 (en) * 2011-04-22 2016-02-10 日本オクラロ株式会社 Differential transmission line and communication device
JP2013026601A (en) 2011-07-26 2013-02-04 Mitsubishi Electric Corp Printed wiring board, printed wiring board module, optical communication module, optical communication device and arithmetic processing device
JP5790769B2 (en) * 2011-09-29 2015-10-07 富士通株式会社 Optical module
US8885357B2 (en) * 2012-01-06 2014-11-11 Cray Inc. Printed circuit board with reduced cross-talk
EP2739125A1 (en) 2012-11-28 2014-06-04 Tyco Electronics Svenska Holdings AB Electrical connection interface for connecting electrical leads for high speed data transmission

Also Published As

Publication number Publication date
EP3047706A1 (en) 2016-07-27
CN105557073B (en) 2019-10-11
JP2016540388A (en) 2016-12-22
WO2015040000A1 (en) 2015-03-26
JP6546594B2 (en) 2019-07-17
US9544057B2 (en) 2017-01-10
CA2924218A1 (en) 2015-03-26
US20170150593A1 (en) 2017-05-25
US20150078755A1 (en) 2015-03-19
US9923636B2 (en) 2018-03-20
EP3047706B1 (en) 2020-08-05
IL244589A0 (en) 2016-04-21
CN105557073A (en) 2016-05-04

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