SG11201601822WA - Apparatus for dissipating heat - Google Patents

Apparatus for dissipating heat

Info

Publication number
SG11201601822WA
SG11201601822WA SG11201601822WA SG11201601822WA SG11201601822WA SG 11201601822W A SG11201601822W A SG 11201601822WA SG 11201601822W A SG11201601822W A SG 11201601822WA SG 11201601822W A SG11201601822W A SG 11201601822WA SG 11201601822W A SG11201601822W A SG 11201601822WA
Authority
SG
Singapore
Prior art keywords
dissipating heat
dissipating
heat
Prior art date
Application number
SG11201601822WA
Inventor
Robert John Moskaitis
Mark Breloff
Original Assignee
Specialty Minerals Michigan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Specialty Minerals Michigan filed Critical Specialty Minerals Michigan
Publication of SG11201601822WA publication Critical patent/SG11201601822WA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG11201601822WA 2013-10-04 2014-09-24 Apparatus for dissipating heat SG11201601822WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/046,016 US20150096719A1 (en) 2013-10-04 2013-10-04 Apparatus for Dissipating Heat
PCT/US2014/057152 WO2015050757A1 (en) 2013-10-04 2014-09-24 Apparatus for dissipating heat

Publications (1)

Publication Number Publication Date
SG11201601822WA true SG11201601822WA (en) 2016-04-28

Family

ID=52776030

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201601822WA SG11201601822WA (en) 2013-10-04 2014-09-24 Apparatus for dissipating heat

Country Status (9)

Country Link
US (1) US20150096719A1 (en)
EP (1) EP3052884A4 (en)
JP (1) JP2016540371A (en)
KR (1) KR20160065856A (en)
CN (1) CN105593627A (en)
CA (1) CA2926451A1 (en)
SG (1) SG11201601822WA (en)
TW (1) TW201530078A (en)
WO (1) WO2015050757A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3086365A1 (en) * 2015-04-23 2016-10-26 ABB Technology Oy Compensation of power electronic module flatness deviations
FR3054095B1 (en) * 2016-07-12 2023-04-07 Leroy Somer Moteurs DEVICE FOR COOLING A POWER ELECTRONIC CIRCUIT
CN110062955B (en) * 2016-12-22 2023-05-23 京瓷株式会社 Electronic component mounting substrate, electronic device, and electronic module
GB2569306A (en) * 2017-12-12 2019-06-19 Rolls Royce Plc Thermal management device
KR102527454B1 (en) * 2018-03-21 2023-05-03 엠에이치기술개발 주식회사 Apparatus for cooling converter and method for manufacturing the same
EP4175434A1 (en) * 2021-11-02 2023-05-03 Carrier Corporation Combined liquid and air cooled power electronics assembly

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3927325A (en) * 1974-07-10 1975-12-16 Us Energy Tissue irradiator
US4928756A (en) * 1988-08-04 1990-05-29 Spectra-Physics Heat dissipating fin and method for making fin assembly
US5844310A (en) * 1996-08-09 1998-12-01 Hitachi Metals, Ltd. Heat spreader semiconductor device with heat spreader and method for producing same
JP2000273196A (en) * 1999-03-24 2000-10-03 Polymatech Co Ltd Heat-conductive resin substrate and semiconductor package
US6482520B1 (en) * 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
US8382004B2 (en) * 2001-04-04 2013-02-26 Graftech International Holdings Inc. Flexible graphite flooring heat spreader
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
AT7133U1 (en) * 2003-01-29 2004-10-25 Werner Dipl Ing Pustelnik PLATE COOLER
WO2005019132A1 (en) * 2003-08-26 2005-03-03 Matsushita Electric Industrial Co., Ltd. Highly heat-conductive member, method for producing same, and heat dissipating system using same
DE10341255B4 (en) * 2003-09-04 2005-06-16 Sgl Carbon Ag Heat conducting plates made of expanded graphite and process for their preparation
US20080265403A1 (en) * 2004-12-29 2008-10-30 Metal Matrix Cast Composites, Llc Hybrid Metal Matrix Composite Packages with High Thermal Conductivity Inserts
JP5128951B2 (en) * 2005-09-28 2013-01-23 日本碍子株式会社 Heat sink module and manufacturing method thereof
US20080085403A1 (en) * 2006-10-08 2008-04-10 General Electric Company Heat transfer composite, associated device and method
US8051896B2 (en) * 2007-07-31 2011-11-08 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
US20100314081A1 (en) * 2009-06-12 2010-12-16 Reis Bradley E High Temperature Graphite Heat Exchanger
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
JP2011258755A (en) * 2010-06-09 2011-12-22 Denso Corp Heat spreader and cooling device for heating element
KR101533895B1 (en) * 2010-09-02 2015-07-03 도요타지도샤가부시키가이샤 Semiconductor module
WO2012059074A1 (en) * 2010-11-03 2012-05-10 Bergmann Messgeräte Entwicklung Kg High-voltage switch with cooling device
US20130327508A1 (en) * 2012-06-07 2013-12-12 Mark A. Zaffetti Cold plate assembly incorporating thermal heat spreader

Also Published As

Publication number Publication date
CN105593627A (en) 2016-05-18
EP3052884A4 (en) 2017-09-27
EP3052884A1 (en) 2016-08-10
JP2016540371A (en) 2016-12-22
US20150096719A1 (en) 2015-04-09
TW201530078A (en) 2015-08-01
CA2926451A1 (en) 2015-04-09
WO2015050757A1 (en) 2015-04-09
KR20160065856A (en) 2016-06-09

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