SG11201601133XA - Method of controlled crack propagation for material cleavage using electromagnetic forces - Google Patents
Method of controlled crack propagation for material cleavage using electromagnetic forcesInfo
- Publication number
- SG11201601133XA SG11201601133XA SG11201601133XA SG11201601133XA SG11201601133XA SG 11201601133X A SG11201601133X A SG 11201601133XA SG 11201601133X A SG11201601133X A SG 11201601133XA SG 11201601133X A SG11201601133X A SG 11201601133XA SG 11201601133X A SG11201601133X A SG 11201601133XA
- Authority
- SG
- Singapore
- Prior art keywords
- crack propagation
- electromagnetic forces
- controlled crack
- material cleavage
- cleavage
- Prior art date
Links
- 238000003776 cleavage reaction Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000007017 scission Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361871820P | 2013-08-29 | 2013-08-29 | |
PCT/US2014/052846 WO2015031444A1 (en) | 2013-08-29 | 2014-08-27 | Method of controlled crack propagation for material cleavage using electromagnetic forces |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201601133XA true SG11201601133XA (en) | 2016-03-30 |
Family
ID=51494542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201601133XA SG11201601133XA (en) | 2013-08-29 | 2014-08-27 | Method of controlled crack propagation for material cleavage using electromagnetic forces |
Country Status (10)
Country | Link |
---|---|
US (1) | US9659764B2 (en) |
EP (1) | EP3039711A1 (en) |
JP (1) | JP2016531833A (en) |
KR (1) | KR20160047496A (en) |
CN (1) | CN105493247A (en) |
AU (1) | AU2014311321A1 (en) |
MX (1) | MX2016002284A (en) |
PH (1) | PH12016500319A1 (en) |
SG (1) | SG11201601133XA (en) |
WO (1) | WO2015031444A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9718215B2 (en) * | 2015-04-15 | 2017-08-01 | Halo Industries, Inc. | Capacitive clamping process for cleaving work pieces using crack propagation |
FR3054930B1 (en) | 2016-08-02 | 2018-07-13 | Soitec | USE OF AN ELECTRIC FIELD FOR DETACHING A PIEZOELECTRIC LAYER FROM A DONOR SUBSTRATE |
DE102017009136A1 (en) * | 2017-09-28 | 2019-03-28 | Hochschule Mittweida (Fh) | Method of separating and detaching slices from a brittle of a brittle-hard material |
CN112601633A (en) * | 2018-07-26 | 2021-04-02 | 哈罗工业公司 | Incident radiation induced surface damage for controlled crack propagation in material processing |
US10940611B2 (en) | 2018-07-26 | 2021-03-09 | Halo Industries, Inc. | Incident radiation induced subsurface damage for controlled crack propagation in material cleavage |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6146979A (en) * | 1997-05-12 | 2000-11-14 | Silicon Genesis Corporation | Pressurized microbubble thin film separation process using a reusable substrate |
US6548382B1 (en) | 1997-07-18 | 2003-04-15 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process |
US7140102B2 (en) * | 2001-09-02 | 2006-11-28 | Borealis Technical Limited | Electrode sandwich separation |
DE19834447A1 (en) * | 1998-07-30 | 2000-02-10 | Wacker Chemie Gmbh | Process for treating semiconductor material |
DE19955824A1 (en) * | 1999-11-20 | 2001-06-13 | Schott Spezialglas Gmbh | Method and device for cutting a workpiece made of brittle material |
US6717212B2 (en) * | 2001-06-12 | 2004-04-06 | Advanced Micro Devices, Inc. | Leaky, thermally conductive insulator material (LTCIM) in semiconductor-on-insulator (SOI) structure |
KR100745577B1 (en) * | 2005-12-29 | 2007-08-03 | 주식회사 탑 엔지니어링 | Scriber for Controlling Pressure Using Magnetic Force |
US7932164B2 (en) * | 2008-03-17 | 2011-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor substrate by using monitor substrate to obtain optimal energy density for laser irradiation of single crystal semiconductor layers |
EP2105957A3 (en) * | 2008-03-26 | 2011-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing soi substrate and method for manufacturing semiconductor device |
KR20120099387A (en) * | 2009-09-29 | 2012-09-10 | 피코드릴 에스 아 | A method of cutting a substrate and a device for cutting |
DE102010025968B4 (en) * | 2010-07-02 | 2016-06-02 | Schott Ag | Generation of microholes |
US8637382B2 (en) * | 2011-08-01 | 2014-01-28 | Silicon Genesis Corporation | Layer transfer of films utilizing thermal flux regime for energy controlled cleaving |
-
2014
- 2014-08-27 JP JP2016537802A patent/JP2016531833A/en active Pending
- 2014-08-27 MX MX2016002284A patent/MX2016002284A/en unknown
- 2014-08-27 KR KR1020167006906A patent/KR20160047496A/en not_active Application Discontinuation
- 2014-08-27 CN CN201480047317.9A patent/CN105493247A/en active Pending
- 2014-08-27 WO PCT/US2014/052846 patent/WO2015031444A1/en active Application Filing
- 2014-08-27 EP EP14761775.7A patent/EP3039711A1/en not_active Withdrawn
- 2014-08-27 SG SG11201601133XA patent/SG11201601133XA/en unknown
- 2014-08-27 US US14/469,983 patent/US9659764B2/en not_active Expired - Fee Related
- 2014-08-27 AU AU2014311321A patent/AU2014311321A1/en not_active Abandoned
-
2016
- 2016-02-17 PH PH12016500319A patent/PH12016500319A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20150060509A1 (en) | 2015-03-05 |
PH12016500319A1 (en) | 2016-05-16 |
CN105493247A (en) | 2016-04-13 |
US9659764B2 (en) | 2017-05-23 |
WO2015031444A1 (en) | 2015-03-05 |
JP2016531833A (en) | 2016-10-13 |
EP3039711A1 (en) | 2016-07-06 |
MX2016002284A (en) | 2016-06-10 |
AU2014311321A1 (en) | 2016-03-10 |
KR20160047496A (en) | 2016-05-02 |
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