SG11201510710TA - Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same - Google Patents

Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same

Info

Publication number
SG11201510710TA
SG11201510710TA SG11201510710TA SG11201510710TA SG11201510710TA SG 11201510710T A SG11201510710T A SG 11201510710TA SG 11201510710T A SG11201510710T A SG 11201510710TA SG 11201510710T A SG11201510710T A SG 11201510710TA SG 11201510710T A SG11201510710T A SG 11201510710TA
Authority
SG
Singapore
Prior art keywords
substrate support
manufacturing techniques
surface feature
producing same
reduced reflection
Prior art date
Application number
SG11201510710TA
Inventor
Shu-Kwan Lau
Joseph M Ranish
Paul Brillhart
Mehmet Tugrul Samir
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201510710TA publication Critical patent/SG11201510710TA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
SG11201510710TA 2013-08-02 2014-07-09 Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same SG11201510710TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361861956P 2013-08-02 2013-08-02
US14/324,557 US9814099B2 (en) 2013-08-02 2014-07-07 Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same
PCT/US2014/045968 WO2015017094A1 (en) 2013-08-02 2014-07-09 Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same

Publications (1)

Publication Number Publication Date
SG11201510710TA true SG11201510710TA (en) 2016-02-26

Family

ID=52427764

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201510710TA SG11201510710TA (en) 2013-08-02 2014-07-09 Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same

Country Status (7)

Country Link
US (1) US9814099B2 (en)
JP (1) JP6518664B2 (en)
KR (1) KR20160039270A (en)
CN (1) CN105431934B (en)
SG (1) SG11201510710TA (en)
TW (1) TWI635562B (en)
WO (1) WO2015017094A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7333172B2 (en) * 2015-08-20 2023-08-24 インテグリス・インコーポレーテッド Silicon carbide/graphite composites and articles and assemblies containing same
JP6330941B1 (en) * 2017-03-07 2018-05-30 株式会社Sumco Epitaxial growth apparatus, preheat ring, and epitaxial wafer manufacturing method using them
JP7018744B2 (en) * 2017-11-24 2022-02-14 昭和電工株式会社 SiC epitaxial growth device
JP7012518B2 (en) * 2017-11-24 2022-01-28 昭和電工株式会社 SiC epitaxial growth device
DE102018107135A1 (en) * 2018-03-26 2019-09-26 Aixtron Se Provided with an individual identifier component of a CVD device and method for transmitting information
WO2021021357A1 (en) * 2019-07-26 2021-02-04 Applied Materials, Inc. Temperature profile measurement and synchronized control on substrate and susceptor in an epitaxy chamber
US20220076988A1 (en) * 2020-09-10 2022-03-10 Applied Materials, Inc. Back side design for flat silicon carbide susceptor

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Publication number Priority date Publication date Assignee Title
JPS6384017A (en) * 1986-09-26 1988-04-14 Toshiba Mach Co Ltd Vapor growth method
JPH01142418A (en) * 1987-11-30 1989-06-05 Toshiba Corp Infrared-ray detecting element
JPH05129639A (en) * 1991-01-14 1993-05-25 Mitsubishi Electric Corp Solar cell and manufacture thereof
JP2603296Y2 (en) * 1992-08-21 2000-03-06 日新電機株式会社 Susceptor for semiconductor manufacturing equipment
JP3393742B2 (en) * 1995-09-28 2003-04-07 京セラ株式会社 Wafer holding member
US7119337B1 (en) * 1997-08-04 2006-10-10 Ion Optics, Inc. Infrared radiation sources, sensors and source combinations, and methods of manufacture
US5926615A (en) * 1997-07-08 1999-07-20 National Science Council Temperature compensation method for semiconductor wafers in rapid thermal processor using separated heat conducting rings as susceptors
DE10026926C2 (en) 2000-05-30 2002-06-20 Infineon Technologies Ag Semiconductor arrangement with optical fuse
US6802906B2 (en) 2000-07-21 2004-10-12 Applied Materials, Inc. Emissivity-change-free pumping plate kit in a single wafer chamber
US7070660B2 (en) * 2002-05-03 2006-07-04 Asm America, Inc. Wafer holder with stiffening rib
FR2846786B1 (en) * 2002-11-05 2005-06-17 PROCESS FOR QUICK THERMAL RECOVERY OF CROWN WAFERS
DE10261362B8 (en) 2002-12-30 2008-08-28 Osram Opto Semiconductors Gmbh Substrate holder
US7585371B2 (en) * 2004-04-08 2009-09-08 Micron Technology, Inc. Substrate susceptors for receiving semiconductor substrates to be deposited upon
US7691204B2 (en) * 2005-09-30 2010-04-06 Applied Materials, Inc. Film formation apparatus and methods including temperature and emissivity/pattern compensation
US8226770B2 (en) 2007-05-04 2012-07-24 Applied Materials, Inc. Susceptor with backside area of constant emissivity
EP2562291A1 (en) 2008-08-29 2013-02-27 Veeco Instruments Inc. Wafer carrier with varying thermal resistance
US8455374B2 (en) * 2010-05-06 2013-06-04 Applied Materials, Inc. Radiation heating efficiency by increasing optical absorption of a silicon containing material
EP2600411B1 (en) * 2010-07-26 2019-08-21 Hamamatsu Photonics K.K. Method for manufacturing light-absorbing substrate and method for manufacturing die for manufacturing light-absorbing substrate
US9401271B2 (en) * 2012-04-19 2016-07-26 Sunedison Semiconductor Limited (Uen201334164H) Susceptor assemblies for supporting wafers in a reactor apparatus
JP6386700B2 (en) * 2012-07-04 2018-09-05 キヤノン株式会社 Structure, optical member, antireflection film, water repellent film, substrate for mass spectrometry, phase plate, method for producing structure, and method for producing antireflection film
SG11201504342SA (en) * 2013-01-16 2015-08-28 Applied Materials Inc Quartz upper and lower domes
US9322097B2 (en) * 2013-03-13 2016-04-26 Applied Materials, Inc. EPI base ring
US9532401B2 (en) * 2013-03-15 2016-12-27 Applied Materials, Inc. Susceptor support shaft with uniformity tuning lenses for EPI process
DE102013009925A1 (en) * 2013-06-13 2014-12-18 Centrotherm Photovoltaics Ag Measuring object, method for producing the same and apparatus for the thermal treatment of substrates
TWI734668B (en) * 2014-06-23 2021-08-01 美商應用材料股份有限公司 Substrate thermal control in an epi chamber

Also Published As

Publication number Publication date
KR20160039270A (en) 2016-04-08
JP6518664B2 (en) 2019-05-22
TW201517208A (en) 2015-05-01
TWI635562B (en) 2018-09-11
US20150037017A1 (en) 2015-02-05
WO2015017094A1 (en) 2015-02-05
US9814099B2 (en) 2017-11-07
JP2016533033A (en) 2016-10-20
CN105431934B (en) 2019-10-22
CN105431934A (en) 2016-03-23

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