SG11201510590QA - Bubble pump circulating heat pipe radiator - Google Patents

Bubble pump circulating heat pipe radiator

Info

Publication number
SG11201510590QA
SG11201510590QA SG11201510590QA SG11201510590QA SG11201510590QA SG 11201510590Q A SG11201510590Q A SG 11201510590QA SG 11201510590Q A SG11201510590Q A SG 11201510590QA SG 11201510590Q A SG11201510590Q A SG 11201510590QA SG 11201510590Q A SG11201510590Q A SG 11201510590QA
Authority
SG
Singapore
Prior art keywords
heat pipe
circulating heat
pipe radiator
pump circulating
bubble pump
Prior art date
Application number
SG11201510590QA
Inventor
Yongyan Liu
Haiyan Liu
Original Assignee
Forevertrust Internat S Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forevertrust Internat S Pte Ltd filed Critical Forevertrust Internat S Pte Ltd
Publication of SG11201510590QA publication Critical patent/SG11201510590QA/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG11201510590QA 2014-05-30 2014-05-30 Bubble pump circulating heat pipe radiator SG11201510590QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2014/000247 WO2015183192A1 (en) 2014-05-30 2014-05-30 Bubble pump circulating heat pipe radiator

Publications (1)

Publication Number Publication Date
SG11201510590QA true SG11201510590QA (en) 2016-01-28

Family

ID=54699384

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201510590QA SG11201510590QA (en) 2014-05-30 2014-05-30 Bubble pump circulating heat pipe radiator

Country Status (3)

Country Link
CN (1) CN205957774U (en)
SG (1) SG11201510590QA (en)
WO (1) WO2015183192A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3084733A1 (en) 2018-08-06 2020-02-07 Thermie Production VERTICAL ELECTRIC RADIATOR DEVICE WITH A MAXIMUM HEIGHT OF TWO METERS FOR HOUSEHOLD USE ACCORDING TO HEAT FLUID TECHNOLOGY
CN110634816B (en) * 2019-09-17 2021-06-22 深圳市科太科技有限公司 Liquid cooling phase transition vector heat transfer heat dissipation system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01169270A (en) * 1987-12-24 1989-07-04 Matsushita Electric Ind Co Ltd Heat exchanger
WO2005055319A2 (en) * 2003-12-08 2005-06-16 Noise Limit Aps A cooling system with a bubble pump
KR101070842B1 (en) * 2009-06-11 2011-10-06 주식회사 자온지 Heat-dissipating device and electronic apparatus having the same
US20130048254A1 (en) * 2011-08-31 2013-02-28 Troy W. Livingston Heat transfer bridge

Also Published As

Publication number Publication date
WO2015183192A1 (en) 2015-12-03
CN205957774U (en) 2017-02-15

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