SG11201509935SA - Method for making an anti-crack electronic device - Google Patents

Method for making an anti-crack electronic device

Info

Publication number
SG11201509935SA
SG11201509935SA SG11201509935SA SG11201509935SA SG11201509935SA SG 11201509935S A SG11201509935S A SG 11201509935SA SG 11201509935S A SG11201509935S A SG 11201509935SA SG 11201509935S A SG11201509935S A SG 11201509935SA SG 11201509935S A SG11201509935S A SG 11201509935SA
Authority
SG
Singapore
Prior art keywords
making
electronic device
crack
crack electronic
electronic
Prior art date
Application number
SG11201509935SA
Inventor
Francis Allot
Sophie Lombardo
Mikko Lankinen
Youssiph Kamagate
Frédéric Blachon
Original Assignee
Gemalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto Sa filed Critical Gemalto Sa
Publication of SG11201509935SA publication Critical patent/SG11201509935SA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
SG11201509935SA 2013-06-07 2014-06-03 Method for making an anti-crack electronic device SG11201509935SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP13305764.6A EP2811427A1 (en) 2013-06-07 2013-06-07 Method for manufacturing an anti-cracking electronic device
PCT/EP2014/061473 WO2014195308A1 (en) 2013-06-07 2014-06-03 Method for making an anti-crack electronic device

Publications (1)

Publication Number Publication Date
SG11201509935SA true SG11201509935SA (en) 2016-01-28

Family

ID=48692409

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509935SA SG11201509935SA (en) 2013-06-07 2014-06-03 Method for making an anti-crack electronic device

Country Status (7)

Country Link
US (1) US10395158B2 (en)
EP (2) EP2811427A1 (en)
KR (2) KR102069747B1 (en)
CN (2) CN105453115A (en)
BR (1) BR112015030497B1 (en)
SG (1) SG11201509935SA (en)
WO (1) WO2014195308A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3217330A1 (en) * 2016-03-07 2017-09-13 Gemalto Sa Method for manufacturing a module with an integrated circuit chip and device comprising such a module
CN108564159B (en) * 2018-07-09 2023-11-24 东莞市芯安智能科技有限公司 Double-interface smart card
WO2021079165A1 (en) * 2019-10-22 2021-04-29 Linxens Holding Rfid device having an antenna with increased weight
WO2022042963A1 (en) * 2020-08-27 2022-03-03 Linxens Holding A pre-form for a smartcard, a smartcard and a method of forming the same
FR3138546A1 (en) 2022-08-01 2024-02-02 Paragon Id Laminated electronic device and method of manufacturing such a device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2601477B1 (en) 1986-07-11 1988-10-21 Bull Cp8 METHOD FOR MOUNTING AN INTEGRATED CIRCUIT IN AN ELECTRONIC MICROCIRCUIT CARD, AND RESULTING CARD
FR2716281B1 (en) 1994-02-14 1996-05-03 Gemplus Card Int Method of manufacturing a contactless card.
US5542175A (en) * 1994-12-20 1996-08-06 International Business Machines Corporation Method of laminating and circuitizing substrates having openings therein
US5608262A (en) * 1995-02-24 1997-03-04 Lucent Technologies Inc. Packaging multi-chip modules without wire-bond interconnection
AU704645B2 (en) * 1995-04-13 1999-04-29 Dainippon Printing Co. Ltd. IC card and IC module
US5889654A (en) * 1997-04-09 1999-03-30 International Business Machines Corporation Advanced chip packaging structure for memory card applications
FR2769389B1 (en) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De MICROCIRCUIT CARD COMBINING EXTERIOR CONTACT RANGES AND AN ANTENNA, AND METHOD FOR MANUFACTURING SUCH A CARD
FR2788646B1 (en) * 1999-01-19 2007-02-09 Bull Cp8 CHIP CARD HAVING A LOOP ANTENNA, AND ASSOCIATED MICROMODULE
KR20020086587A (en) * 2000-03-09 2002-11-18 후지쯔 가부시끼가이샤 Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
DE10016135A1 (en) * 2000-03-31 2001-10-18 Infineon Technologies Ag Housing assembly for an electronic component
US20020020898A1 (en) * 2000-08-16 2002-02-21 Vu Quat T. Microelectronic substrates with integrated devices
JP3794411B2 (en) * 2003-03-14 2006-07-05 セイコーエプソン株式会社 Display device and electronic device
FR2861201B1 (en) 2003-10-17 2006-01-27 Oberthur Card Syst Sa METHOD FOR MANUFACTURING A CARD WITH A DOUBLE INTERFACE, AND MICROCIRCUIT CARD THUS OBTAINED
FR2882174B1 (en) 2005-02-11 2007-09-07 Smart Packaging Solutions Sps METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE WITH NON-CONTACT FUNCTIONING, IN PARTICULAR FOR ELECTRONIC PASSPORT
EP1930844B1 (en) * 2005-09-26 2011-07-13 Panasonic Corporation Noncontact information storage medium and method for manufacturing same
TWI325745B (en) * 2006-11-13 2010-06-01 Unimicron Technology Corp Circuit board structure and fabrication method thereof
US20080180255A1 (en) * 2007-01-25 2008-07-31 Michael James Isabell RFID tag
US9697459B2 (en) * 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
FR2997535B1 (en) * 2012-10-30 2016-07-08 Oberthur Technologies METHOD FOR MANUFACTURING A CHIP CARD WITH MULTIPLE COMPONENTS AND CARD THUS OBTAINED

Also Published As

Publication number Publication date
KR20160018725A (en) 2016-02-17
WO2014195308A1 (en) 2014-12-11
CN114757319A (en) 2022-07-15
BR112015030497A2 (en) 2017-07-25
KR20170054535A (en) 2017-05-17
BR112015030497B1 (en) 2023-01-10
EP3005244A1 (en) 2016-04-13
KR102069747B1 (en) 2020-01-28
CN105453115A (en) 2016-03-30
EP2811427A1 (en) 2014-12-10
US20160125284A1 (en) 2016-05-05
US10395158B2 (en) 2019-08-27
EP3005244B1 (en) 2023-07-26

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