SG11201504886SA - Implantable medical device for minimally-invasive insertion - Google Patents

Implantable medical device for minimally-invasive insertion

Info

Publication number
SG11201504886SA
SG11201504886SA SG11201504886SA SG11201504886SA SG11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA SG 11201504886S A SG11201504886S A SG 11201504886SA
Authority
SG
Singapore
Prior art keywords
minimally
medical device
implantable medical
invasive insertion
invasive
Prior art date
Application number
SG11201504886SA
Inventor
Robert Farra
Original Assignee
Microchips Biotech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microchips Biotech Inc filed Critical Microchips Biotech Inc
Publication of SG11201504886SA publication Critical patent/SG11201504886SA/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M5/00—Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular way; Accessories therefor, e.g. filling or cleaning devices, arm-rests
    • A61M5/14—Infusion devices, e.g. infusing by gravity; Blood infusion; Accessories therefor
    • A61M5/168—Means for controlling media flow to the body or for metering media to the body, e.g. drip meters, counters ; Monitoring media flow to the body
    • A61M5/172—Means for controlling media flow to the body or for metering media to the body, e.g. drip meters, counters ; Monitoring media flow to the body electrical or electronic
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/07—Endoradiosondes
    • A61B5/076—Permanent implantations
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/48—Other medical applications
    • A61B5/4836—Diagnosis combined with treatment in closed-loop systems or methods
    • A61B5/4839—Diagnosis combined with treatment in closed-loop systems or methods combined with drug delivery
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/166—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Biomedical Technology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Pathology (AREA)
  • Biophysics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Vascular Medicine (AREA)
  • Anesthesiology (AREA)
  • Hematology (AREA)
  • Electrotherapy Devices (AREA)
  • Cardiology (AREA)
  • Prostheses (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
SG11201504886SA 2012-12-21 2013-12-20 Implantable medical device for minimally-invasive insertion SG11201504886SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261745086P 2012-12-21 2012-12-21
PCT/US2013/076849 WO2014100555A1 (en) 2012-12-21 2013-12-20 Implantable medical device for minimally-invasive insertion

Publications (1)

Publication Number Publication Date
SG11201504886SA true SG11201504886SA (en) 2015-07-30

Family

ID=49943576

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504886SA SG11201504886SA (en) 2012-12-21 2013-12-20 Implantable medical device for minimally-invasive insertion

Country Status (9)

Country Link
US (1) US9919103B2 (en)
EP (1) EP2934289B1 (en)
JP (1) JP6435272B2 (en)
KR (1) KR102142912B1 (en)
CN (1) CN104869888B (en)
AU (1) AU2013361154B2 (en)
CA (1) CA2895235C (en)
SG (1) SG11201504886SA (en)
WO (1) WO2014100555A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10601121B2 (en) * 2017-05-09 2020-03-24 Verily Life Sciences Llc Slot antenna for in-body ISM-band communication
WO2019103732A1 (en) * 2017-11-22 2019-05-31 Hewlett-Packard Development Company, L.P. Multizonal microfluidic devices
BR112022007471A2 (en) * 2019-11-01 2022-07-12 Dare Mb Inc DEVICE AND METHODS FOR DRUG DISTRIBUTION BY TWO-STAGE MICROCHIP

Family Cites Families (44)

* Cited by examiner, † Cited by third party
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US5782891A (en) 1994-06-16 1998-07-21 Medtronic, Inc. Implantable ceramic enclosure for pacing, neurological, and other medical applications in the human body
US5797898A (en) 1996-07-02 1998-08-25 Massachusetts Institute Of Technology Microchip drug delivery devices
US7070590B1 (en) 1996-07-02 2006-07-04 Massachusetts Institute Of Technology Microchip drug delivery devices
US6052623A (en) 1998-11-30 2000-04-18 Medtronic, Inc. Feedthrough assembly for implantable medical devices and methods for providing same
WO2001012157A1 (en) * 1999-08-18 2001-02-22 Microchips, Inc. Thermally-activated microchip chemical delivery devices
WO2001035928A1 (en) 1999-11-17 2001-05-25 Microchips, Inc. Microfabricated devices for the delivery of molecules into a carrier fluid
WO2001041736A2 (en) 1999-12-10 2001-06-14 Massachusetts Institute Of Technology Microchip devices for delivery of molecules and methods of fabrication thereof
US6455930B1 (en) 1999-12-13 2002-09-24 Lamina Ceramics, Inc. Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
EP1261427B1 (en) 2000-03-02 2011-03-02 Microchips, Inc. Microfabricated devices and methods for storage and selective exposure of chemicals
US7226442B2 (en) 2000-10-10 2007-06-05 Microchips, Inc. Microchip reservoir devices using wireless transmission of power and data
WO2002030401A2 (en) 2000-10-11 2002-04-18 Microchips, Inc. Microchip reservoir devices and facilitated corrosion of electrodes
ATE359762T1 (en) 2001-01-09 2007-05-15 Microchips Inc FLEXIBLE MICROCHIP DEVICES FOR OPHTHALMOLOGICAL AND OTHER APPLICATIONS
US6973718B2 (en) * 2001-05-30 2005-12-13 Microchips, Inc. Methods for conformal coating and sealing microchip reservoir devices
AU2002326304A1 (en) 2001-05-31 2002-12-16 Massachusetts Institute Of Technology Microchip devices with improved reservoir opening
CA2451953A1 (en) 2001-06-28 2003-04-24 Microchips, Inc. Methods for hermetically sealing microchip reservoir devices
WO2003048665A1 (en) 2001-12-03 2003-06-12 Massachusetts Institute Of Technology Microscale lyophilization and drying methods for the stabilization of molecules
US6953455B2 (en) * 2002-07-30 2005-10-11 Hospira, Inc. Medicine delivery system
JP4436258B2 (en) 2002-08-16 2010-03-24 マイクロチップス・インコーポレーテッド Controlled release device and method
AU2003278766A1 (en) 2002-09-04 2004-03-29 Microchips, Inc. Method and device for the controlled delivery of parathyroid hormone
SE0202681D0 (en) 2002-09-10 2002-09-10 Frank Niklaus Hermetic sealing with combined adhesive bonding and sealing rings
WO2004026281A2 (en) 2002-09-23 2004-04-01 Microchips, Inc. Micro-reservoir osmotic release systems and microtube array device
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US7917208B2 (en) * 2002-10-04 2011-03-29 Microchips, Inc. Medical device for controlled drug delivery and cardiac monitoring and/or stimulation
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Also Published As

Publication number Publication date
JP6435272B2 (en) 2018-12-05
KR102142912B1 (en) 2020-08-10
EP2934289B1 (en) 2018-04-25
AU2013361154B2 (en) 2017-02-02
US9919103B2 (en) 2018-03-20
CN104869888A (en) 2015-08-26
JP2016506275A (en) 2016-03-03
KR20150098630A (en) 2015-08-28
WO2014100555A1 (en) 2014-06-26
CN104869888B (en) 2017-12-19
EP2934289A1 (en) 2015-10-28
US20140180262A1 (en) 2014-06-26
CA2895235C (en) 2020-12-29
AU2013361154A1 (en) 2015-07-02
CA2895235A1 (en) 2014-06-26

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